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  1. IBM0418A81XLAB-3F Specifications: Memory Category: SRAM Chip ; Density: 1180 kbits ; Number of Words: 64 k ; Bits per Word: 18 bits ; Package Type: BGA, BGA-119 ; Pins: 119 ; Logic Family: CMOS ; Supply Voltage: 3.3V ; Access .

  2. ibm0418a81xlab-3f . Features. x 18 organizations x 18 organizations 0.25 Micron CMOS technology Synchronous Pipeline Mode of Operation with Self-Timed Late Write Single Differential HSTL Clock +2.5V Power Supply, Ground, 1.6V VDDQ, and 0.95V VREF HSTL Input

  3. Full datasheet IBM0418A81XLAB-3F manufactirer IBM, SRAM (8 Мб) 8 Mb. Archive 1.687.043 components : Datasheets Cross-reference Online-stock: ChipFind: Search field:

  4. IBM0418A81DLAB-3F . Features. x 18 organizations x 18 organizations 0.25 Micron CMOS technology Synchronous pipeline mode of operation with self-timed late write Single differential high-speed transceiver logic (HSTL) Clock +3.3V power supply, ground, 2.1V

  5. IBM0418A81XLAB: Manufacturer: IBM (www.ibm.com) Note: 8Mb (256Kx36 & 512Kx18) and 4Mb (128Kx36 & 256Kx18) SRAM: Function: SRAM (8 Mb)

  6. Compare IBM0418A81XLAB-3F by IBM vs UPD4382362GF-A75 by NEC Electronics Group. View differences in part data attributes and features.

  7. IBM0418A81NLAB-3F . Features. x 18 organizations x 18 organizations 0.25 Micron CMOS technology Common I/O Synchronous pipeline mode of operation with self-timed late write Differential PECL clocks or 2.5V LVTTL swing with one clock tied VDDQ/2 +3.3V power