ChipFind - Datasheet

Part Number UCC5342

Download:  PDF   ZIP
1/98
BLOCK DIAGRAM
·
Supports IrDA Standard to 115kbps
Data Rates
·
3V to 5V Operation
·
Wide Dynamic Receiver Range from
200nA to 50mA Typical
·
IrDA Compliant I/O
·
500mA LED Driver
·
Very Low Quiescent Current in Active
Mode (250
µ
A Typical)
·
Ultra Low Quiescent Current in Sleep
Mode (0.5
µ
A Typical)
·
Compatible with IrDA Detector Diodes
IrDA 115.2kbps Transceiver
FEATURES
DESCRIPTION
UCC5342
PRELIMINARY
The UCC5342 IrDA (Infrared Data Association) Transceiver supports
the analog section of the IrDA standard. The receiver has a limiting
transresistance amplifier to detect a current signal from a PIN diode
and drives RXX pulses to a UART. The amplifier is capable of input cur-
rents ranging from 200nA to 50mA. The amplifier is bandpass limited to
reduce interference from other IR sources.
The output of the receiver is designed to drive CMOS and TTL levels,
for direct interfacing to IrDA compliant UARTs and Super I/O devices.
Internal resistors are provided for decoupling the detector diode supply,
thus minimizing the number of external components required.
The transmitter portion of the chip has a low impedance open drain
MOSFET output. It is capable of sinking 300mA from an output LED at
3V, and 500mA at 5V.
14 pin version
µ
UDG-97164
2
UCC5342
CONNECTION DIAGRAM
SOIC-14, DIL-14 (Top View)
D,N Package
ELECTRICAL CHARACTERISTICS:
Unless otherwise specified, T
A
= 0°C to 70°C, AVDD = 3.0V to 5.5V, C
AVDD
= 100nF,
C
DVDD
= 100nF, C
CAT
= 4.7
µ
F + 100nF, C
RXX
= 40pF, C
DET
< 56pF. T
A
= T
J.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNITS
Supply Current Section
I
DD
No Output Load, SLEEP
0.5V
250
350
µ
A
I
DD
SLEEP
AVDD ­ 0.5V, TXX
0.5V
0.5
3
µ
A
R
DVDD
AVDD to DVDD
1.0
2
3.0
k
R
CAT
AVDD to CAT
10
20
32
Receiver Section
Input Refered Noise
(Note 1)
10
pA
Hz
Detection Threshold
1.6
µ
s Input Pulse, 1
µ
s
R
XX
8
µ
s
200
400
nA
Signal to Noise Ratio
I
DET
= 200nA (Note 1)
11.8
Lower Band Limit
(Note 1)
50
kHz
Upper Band Limit
(Note 1)
1
MHz
Output Pulse Width
I
DET
= 400nApk to 20mApk, 0 to 200
µ
ADC, 1.6
µ
s Input Pulse
1.0
8.0
µ
s
RXX Output (V
OL
)
I
RXX
= 800
µ
A
200
400
mV
RXX Output (V
OH
)
I
RXX
= ­100
µ
A, DVDD ­ RXX
200
400
mV
RXX Rise Time
From 10% to 90% of DVDD
150
200
ns
RXX Fall Time
From 90% to 10% of DVDD
100
150
ns
ABSOLUTE MAXIMUM RATINGS
AVDD, DVDD, CAT . . . . . . . . . . . . . . . . . . . . . . . . . ­0.3V to 7V
SLEEP, DET, TXX, LED,
DVDD, CAT. . . . . . . . . . . . . . . . . . . . . . ­-0.3V to AVDD + 0.3V
I
RXX
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ­10mA to 10 mA
I
DET
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250mA
I
LED
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A
Storage Temperature . . . . . . . . . . . . . . . . . . . ­65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . ­55°C to +150°C
Lead Temperature (Soldering, 10sec.) . . . . . . . . . . . . . +300°C
All voltages are with respect to respect to AGND. DGND and PGND must be con-
nected to AGND. Currents are positive into, negative out of the specified terminal.
Consult Packaging Section of the Databook for thermal limitations and considerations
of packages.
SSOP-16 (Top View)
M Package
3
UCC5342
PIN DESCRIPTIONS
AGND: Ground reference for analog circuits. Connect to
circuit board ground plane.
AVDD: Supply pin for analog circuits. Bypass to AGND
with a 100nF or 1
µ
F ceramic capacitor.
CAT: Filtered supply for PIN diode cathode. Internally
connected to AVDD with a 20
resistor. Bypass to AGND
with a 4.7
µ
F capacitor plus a 100nF ceramic capacitor.
DET: Input to receiver amplifier. Connect to PIN diode
anode. Shield with a AVDD and/or AGND from all other
signals, especially RXX.
DGND: Ground pin for digital circuits. Connect to circuit
board ground plane.
DVDD: Supply pin for digital circuits. Internally connected
to AVDD with a 2k
resistor. Bypass to DGND with a
100nF or 1
µ
F ceramic capacitor.
LED: Open drain of transmitter output transistor. Connect
to an external IrDA compliant light emitting diode via an
external resistor.
PGND: Source of transmitter output transistor. Connect
to circuit board ground plane.
RXX: Output of the detect amplifier and buffer. Connect
to UART. Avoid coupling the RXX signal to DET.
SLEEP: Sleep mode select pin. A logic high on SLEEP
puts the chip into sleep mode, reducing IDD to 0.5
µ
A
typical.
TXX: Input from UART to transmit LED driver.
ELECTRICAL CHARACTERISTICS (cont.): Unless otherwise specified, T
A
= 0°C to 70°C, AVDD = 3.0V to 5.5V,
C
AVDD
= 100nF, C
DVDD
= 100nF, C
CAT
= 4.7
µ
F + 100nF, C
RXX
= 40pF, C
DET
< 56pF. T
A
= T
J.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNITS
Transmitter Section
I
TXX
TXX = 0 to AVDD
­10
10
µ
A
TXX (V
IH
)
2
2.5
V
TXX (V
IL
)
0.8
1
V
LED
TXX = AVDD = 4.5V, I
LED
= 500mA
0.3
0.6
V
TXX = AVDD = 3.0V, I
LED
= 300mA
0.3
0.6
V
AVDD ­ LED
TXX = 0, AVDD = 3.0V, I
LED
= ­1mA
0.2
0.6
V
Note 1: Guaranteed by design. Not 100% tested in production.
APPLICATION INFORMATION
Ground Plane
There are 3 ground connections shown on the applica-
tion drawing, representing the sensitive analog ground,
the `dirty' digital ground and the high current transmitter
ground. These 3 points can simply be geographic group-
ings of connections to a ground plane. If a ground plane
is not used, other provision to isolate the analog and digi-
tal ground currents should be provided. The use of a
ground plane is strongly recommended.
DET Considerations
DET is flanked by AGND and an unconnected pin. This
should be used to good advantage by fully enclosing the
DET circuit board trace with AGND in order to shield
leakage noise from DET. The DET circuit board trace
length should be minimized. Since the PIN diode con-
nected to DET is capacitive, noise coupling to the cath-
ode of the diode will be coupled directly to DET. For this
reason, the 100nF capacitor on CAT should be located
physically close to the cathode of the PIN diode.
There is natural parasitic coupling from RXX to DET.
RXX should be routed to minimize the parasitic capaci-
tive coupling from RXX to DET.
Analog Power Supply Decoupling
The UCC3542 has a highly sensitive amplifier section ca-
pable of detecting extremely low current levels (200nA
typical). Achieving this sensitivity requires quiet analog
power supply rails. A 100nF high frequency capacitor in
close proximity to AVDD and AGND is required for quiet
analog rails.
The transmitter section of the chip runs form the AVDD
supply and draws high peak currents (~500mA in a typi-
cal application). A bulk capacitor may be required close
to the AVDD and AGND pins if the connection length to
the power supply is long, or if the supply is relatively high
impedance. This bulk capacitor is in addition to the
100nF high frequency capacitor mentioned above. The
bypass capacitors on CAT and AVDD should present
very low equivalent series resistance and inductance to
the circuit.
4
UCC5342
APPLICATION INFORMATION (cont.)
Digital Power Supply
DVDD is fed directly from AVDD through an internal 2k
resistor. The DVDD bypass capacitor handles all tran-
sient current produced by the digital section of the chip. If
more drive is required from RXX, than the internal 2k re-
sistor will allow, an external resistor can shunt it. This
technique should always be accompanied by increasing
the value of the decoupling capacitor on DVDD and
AVDD.
Economy Application
The diagram of the economy application shows only one
bypass capacitor. This application is suitable where maxi-
mum sensitivity is not required and where the power sup-
ply feeding AVDD is relatively clean and low impedance.
UNITRODE CORPORATION
7 CONTINENTAL BLVD. · MERRIMACK, NH 03054
TEL. (603) 424-2410 · FAX (603) 424-3460
Figure 1. Typical Application of the UCC5342
Figure 2. Economy Application of the UCC5342
UDG-97155
UDG-97156
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL
APPLICATIONS"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER'S RISK.
In order to minimize risks associated with the customer's applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI's publication of information regarding any third
party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright
©
1999, Texas Instruments Incorporated