UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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DALLAS, TEXAS 75265
D
Controlled Baseline
- One Assembly/Test Site, One Fabrication
Site
D
Extended Temperature Performance of
-40
°
C to 125
°
C
D
Enhanced Diminishing Manufacturing
Sources (DMS) Support
D
Enhanced Product-Change Notification
D
Qualification Pedigree
D
Dual Output Drive Stages in Push-Pull
Configuration
D
Current Sense Discharge Transistor to
Improve Dynamic Response
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
D
130-
µ
A Typical Starting Current
D
1-mA Typical Run Current
D
Operation to 1 MHz
D
Internal Soft Start
D
On-Chip Error Amplifier With 2-MHz Gain
Bandwidth Product
D
On Chip VDD Clamping
D
Output Drive Stages Capable of 500-mA
Peak-Source Current, 1-A Peak-Sink
Current
description/ordering information
The UCC2808A is a family of BiCMOS push-pull, high-speed, low-power, pulse-width modulators. The
UCC2808A contains all of the control and drive circuitry required for off-line or dc-to-dc fixed frequency
current-mode switching power supplies with minimal external parts count.
The UCC2808A dual output drive stages are arranged in a push-pull configuration. Both outputs switch at half
the oscillator frequency using a toggle flip-flop. The dead time between the two outputs is typically 60 ns to
200 ns depending on the values of the timing capacitor and resistors, thus limiting each output stage duty cycle
to less than 50%.
The UCC2808A family offers a variety of package options and choice of undervoltage lockout levels. The family
has UVLO thresholds and hysteresis options for off-line and battery powered systems. Thresholds are shown
in the ordering information table.
The UCC2808A is an enhanced version of the UCC2808 family. The significant difference is that the A versions
feature an internal discharge transistor from the CS pin to ground, which is activated each clock cycle during
the oscillator dead time. The feature discharges any filter capacitance on the CS pin during each cycle and helps
minimize filter capacitor values and current sense delay.
Copyright
2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1
2
3
4
8
7
6
5
COMP
FB
CS
RC
VDD
OUTA
OUTB
GND
D PACKAGE
(TOP VIEW)
UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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ORDERING INFORMATION
TA
UVLO
Option
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
-40
°
C to 125
°
C
12.5 V/8.3 V
SOIC (D)
Tape and reel
UCC2808AQDR-1EP
UCC2808AQD-1EP
-40
°
C to 125
°
C
4.3 V/4.1 V
SOIC (D)
Tape and reel
UCC2808AQDR-2EP
UCC2808AQD-2EP
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available
at www.ti.com/sc/package.
block diagram
UDG-00097
Note: Pinout shown is for SOIC package. TSSOP pinout is different.
3
1
2
8
7
6
5
4
OSCILLATOR
S
Q
R
RC
1.2R
R
0.5 V
PEAK CURRENT
COMPARATOR
Q
Q
T
S
Q
R
S
Q
R
VDD
VOLTAGE
REFERENCE
14 V
PWM
COMPARATOR
PWM
LATCH
SOFT START
0.5 V
VDD-1 V
0.75 V
2.2 V
2.0 V
FB
COMP
CS
VDD
OUTA
OUTB
GND
SLOPE = 1 V/ms
VDD OK
OVERCURRENT
COMPARATOR
22 k
UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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absolute maximum ratings over operating free-air temperature (unless otherwise noted)
}
Supply voltage (IDD
10 mA)
15 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply current
20 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OUTA/OUTB source current (peak)
-0.5 A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OUTA/OUTB sink current (peak)
1.0 A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog inputs (FB, CS)
-0.3 V to VDD 0.3 V, not to exceed 6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power dissipation at T
A
= 25
°
C (D package)
650 mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
§
-65
°
C to150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature, T
J
-55
°
C to 150
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 sec.)
300
°
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Power Supply Control Data Book (TI Literature
Number SLUD003) for thermal limitations and considerations of packages.
§ Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall
device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
electrical characteristics, T
A
= -40
°
C to 125
°
C for the UCC2808AQ-x, VDD = 10 V (see Note 6), 1-
µ
F
capacitor from VDD to GND, R = 22 k
, C = 330 pF T
A
= T
J
, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Oscillator Section
Oscillator frequency
175
194
213
kHz
Oscillator amplitude/VDD
See Note 1
0.44
0.5
0.56
V/V
NOTES:
1. Measured at RC. Signal amplitude tracks VDD.
6. For UCCx808A-1, set VDD above the start threshold before setting at 10 V.
UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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electrical characteristics, T
A
= -40
°
C to 125
°
C for the UCC2808AQ-x, VDD = 10 V (see Note 6), 1-
µ
F
capacitor from VDD to GND, R = 22 k
, C = 330 pF T
A
= T
J
, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
Error Amplifier Section
Input voltage
COMP = 2 V
1.95
2
2.05
V
Input bias current
1
1
µ
A
Open loop voltage gain
60
80
dB
COMP sink current
FB = 2.2 V,
COMP = 1 V
0.3
2.5
mA
COMP source current
FB = 1.3 V,
COMP = 3.5 V
0.2
0.5
mA
PWM Section
Maximum duty cycle
Measured at OUTA or OUTB
48
49
50
%
Minimum duty cycle
COMP = 0 V
0
%
Current Sense Section
Gain
See Note 2
1.9
2.2
2.5
V/V
Maximum input signal
COMP = 5 V
See Note 3
0.45
0.5
0.55
V
CS to output delay
COMP = 3.5 V,
CS from 0 mV to 600 mV
100
200
ns
CS source current
-200
nA
CS sink current
CS = 0.5 V,
RC = 5.5 V
See Note 7
4
10
mA
Over current threshold
0.65
0.75
0.85
V
COMP to CS offset
CS = 0 V
0.35
0.8
1.2
V
Output Section
OUT low level
I = 100 mA
0.5
1.1
V
OUT high level
I = -50 mA,
VDD OUT
0.5
1
V
Rise time
CL = 1 nF
25
60
ns
Fall time
CL = 1 nF
25
60
ns
Undervoltage Lockout Section
Start threshold
UCCx808A-1
See Note 6
11.5
12.5
13.5
V
Start threshold
UCCx808A-2
4.1
4.3
4.5
V
Minimum operating voltage after start
UCCx808A-1
7.6
8.3
9
V
Minimum operating voltage after start
UCCx808A-2
3.9
4.1
4.3
V
Hysteresis
UCCx808A-1
3.5
4.2
5.1
V
Hysteresis
UCCx808A-2
0.1
0.2
0.3
V
Soft Start Section
COMP rise time
FB = 1.8 V,
Rise from 0.5 V to 4 V
3.5
20
ms
Overall Section
Startup current
VDD < start threshold
130
260
µ
A
Operating supply current
FB = 0 V,
CS = 0 V
See Note 5 and 6
1
2
mA
VDD zener shunt voltage
IDD = 10 mA
See Note 4
13
14
15
V
NOTES:
2. Gain is defined by: A
+
D
V
COMP
D
V
CS
, 0
VCS
0.4 V.
3. Parameter measured at trip point of latch with FB at 0 V.
4. Start threshold and zener shunt threshold track one another.
5. Does not include current in the external oscillator network.
6. For UCC2808A-1, set VDD above the start threshold before setting at 10 V.
7. The internal current sink on the CS pin is designed to discharge an external filter capacitor. It is not intended to be a dc sink path.
UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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pin assignments
COMP: COMP is the output of the error amplifier and the input of the PWM comparator. The error amplifier in
the UCC2808A is a true low-output impedance, 2-MHz operational amplifier. As such, the COMP pin can both
source and sink current. However, the error amplifier is internally current limited, so that zero duty cycle can be
externally forced by pulling COMP to GND.
The UCC2808A family features built-in full-cycle soft start. Soft start is implemented as a clamp on the maximum
COMP voltage.
CS: The input to the PWM, peak current, and overcurrent comparators. The overcurrent comparator is only
intended for fault sensing. Exceeding the overcurrent threshold will cause a soft start cycle. An internal MOSFET
discharges the current sense filter capacitor to improve dynamic performance of the power converter.
FB: The inverting input to the error amplifier. For best stability, keep FB lead length as short as possible and
FB stray capacitance as small as possible.
GND: Reference ground and power ground for all functions. Due to high currents, and high frequency operation
of the UCC2808A, a low impedance circuit board ground plane is highly recommended.
OUTA and OUTB: Alternating high current output stages. Both stages are capable of driving the gate of a power
MOSFET. Each stage is capable of 500-mA peak-source current, and 1-A peak-sink current.
The output stages switch at half the oscillator frequency, in a push-pull configuration. When the voltage on the
RC pin is rising, one of the two outputs is high, but during fall time, both outputs are off. This dead time between
the two outputs, along with a slower output rise time than fall time, insures that the two outputs can not be on
at the same time. This dead time is typically 60 ns to 200 ns and depends upon the values of the timing capacitor
and resistor.
The high-current-output drivers consist of MOSFET output devices, which switch from VDD to GND. Each
output stage also provides a very low impedance to overshoot and undershoot. This means that in many cases,
external-schottky-clamp diodes are not required.
RC: The oscillator programming pin. The UCC2808A's oscillator tracks VDD and GND internally, so that
variations in power supply rails minimally affect frequency stability. Figure 1 shows the oscillator block diagram.
Only two components are required to program the oscillator: a resistor (tied to the VDD and RC), and a capacitor
(tied to the RC and GND). The approximate oscillator frequency is determined by the simple formula:
f
OSCILLATOR
+
1.41
RC
where frequency is in Hz, resistance in Ohms, and capacitance in Farads. The recommended range of timing
resistors is between 10 k
and 200 k
and range of timing capacitors is between 100 pF and 1000 pF. Timing
resistors less than 10 k
should be avoided.
For best performance, keep the timing capacitor lead to GND as short as possible, the timing resistor lead from
VDD as short as possible, and the leads between timing components and RC as short as possible. Separate
ground and VDD traces to the external timing network are encouraged.
UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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pin assignments (continued)
S
Q
R
4
OSCILLATOR
OUTPUT
0.2 V
VDD
2
RC
(APPROXIMATE
FREQUENCY)
FREQUENCY =
1.41
RC
UDG-00095
Figure 1. Block Diagram for Oscillator
NOTE A: The oscillator generates a sawtooth waveform on RC. During the RC rise time, the output stages alternate on time, but both stages are
off during the RC fall time. The output stages switch a 1/2 the oscillator frequency, with ensured duty cycle of < 50% for both outputs.
VDD: The power input connection for this device. Although quiescent VDD current is very low, total supply
current will be higher, depending on OUTA and OUTB current, and the programmed oscillator frequency. Total
VDD current is the sum of quiescent VDD current and the average OUT current. Knowing the operating
frequency and the MOSFET gate charge (Qg), average OUT current can be calculated from:
I
OUT
+
Qg
F, where F is frequency
To prevent noise problems, bypass VDD to GND with a ceramic capacitor as close to the chip as possible along
with an electrolytic capacitor. A 1-
µ
F decoupling capacitor is recommended.
APPLICATION INFORMATION
A 200-kHz push-pull application circuit with a full-wave rectifier is shown in Figure 2. The output, V
O
, provides
5 V at 50 W maximum and is electrically isolated from the input. Since the UCC2808A is a peak-current-mode
controller the 2N2907 emitter following amplifier (buffers the CT waveform) provides slope compensation which
is necessary for duty ratios greater than 50%. Capacitor decoupling is very important with a single ground IC
controller, and a 1
µ
F is suggested as close to the IC as possible. The controller supply is a series RC for start-up,
paralleled with a bias winding on the output inductor used in steady state operation.
Isolation is provided by an optocoupler with regulation done on the secondary side using the TL431 adjustable
precision shunt regulator. Small signal compensation with tight voltage regulation is achieved using this part
on the secondary side. Many choices exist for the output inductor depending on cost, volume, and mechanicall
strength. Several design options are iron powder, molypermalloy (MPP), or a ferrite core with an air gap as
shown here. The main power transformer has a Magnetics Inc. ER28 size core made of P material for efficient
operation at this frequency and temperature. The input voltage may range from 36 V dc to 72 V dc.
UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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APPLICATION INFORMATION
UDG-00096
UCC2808AD-1
RC
4.99 k
4.99 k
432
0.1
µ
F
10
µ
F
20 k
330 pF
86.6 k
0.01
µ
F
1 kV
N
S1
N
S2
N
P1
N
P2
680
µ
F
0.01
µ
F
470 pF
4700 pF
20 k
19.1 k
COMP
19.1 k
200
LOOP
B
LOOP
A
2.2
0.2
2 k
330 pF
1000 pF
62
62
1000 pF
2.2
51 k
1/4 W
0.47
µ
F
4700
µ
F
V
IN
36 V
T
O
72 V
+
-
BYV
28-200
BYV
28-200
32CTQ030
ER28
8:2
+
V
O
5 V 50 W
5
6
7
8
4
3
2
1
H1
1A1
4
5
6
3
2
1
U3
CURRENT
SENSE
PRIMAR
Y
GROUND
-
IRF640
IRF640
20 k
2K12907
0.1
µ
F
240
0.1
µ
F
3
1
TL431
2
10
12
EF25 7
µ
H
1m
H
DF02SGICT
2.80 k
VDD
OUT
A
OUTB
GND
RC
CS
FB
COMP
Figure 2. Typical Application Diagram: 48-V In, 5-V, 50-W Output
UCC2808A 1EP, UCC2808A 2EP
LOW POWER CURRENT MODE PUSH PULL PWM
SGLS187A - SEPTEMBER 2003 - REVISED SEPTEMBER 2003
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TYPICAL CHARACTERISTICS
Figure 3
Frequency
- kHz
OSCILLATOR FREQUENCY
vs
EXTERNAL RC VALUES
0
RT - Timing Resistor - k
50
100
150
200
1
10
100
1000
C = 100 pF
C = 220 pF
C = 330 pF
C = 560 pF
C = 820 pF
C = 1000 pF
Figure 4
600
800
1000
1200
400
200
0
0
2
4
6
8
10
12
14
Oscillator Frequency - kHz
IDD
without load
IDD
with 1 nF load
VDD = 10 V, t = 25
5
C
IDD
vs
OSCILLATOR FREQUENCY
IDD -mA
Figure 5
-55
-35
-15
5
25
45
65
85
105
125
0
0.2
0.4
0.6
0.8
1.0
1.2
Temperature
COMP TO CS OFFSET
vs
TEMPERATURE
COMP - CS Offset - V
-
°
C
1
100
10000
1000000
0
10
20
30
40
50
60
70
80
90
0
20
40
60
80
100
120
140
160
180
Gain
Figure 6
Phase Margin - Degrees
Gain dB
ERROR AMPLIFIER GAIN AND PHASE
RESPONSE
vs
FREQUENCY
Frequency - Hz
Phase
Figure 7
OUTPUT DEAD TIME
vs
EXTERNAL RC VALUES
Dead
T
ime - ns
RT - Timing Resistor - k
50
100
150
200
250
100
150
250
300
200
50
C = 100 pF
C = 220 pF
C = 330 pF
C = 560 pF
C = 820 pF
C = 1000 pF
Figure 8
DEAD TIME
vs
TEMPERATURE
Dead
T
ime - ns
Temperature -
°
C
-100
-50
0
50
100
150
VDD = 10 V
VDD = 7.5 V
VDD = 5 V
0
50
100
150
200
250
300
350
400
Figure 9
RC RDS(on)
vs
TEMPERATURE
Ohms
-100
-50
0
50
100
150
0
50
100
150
200
250
300
VDD = 10 V
VDD = 7.5 V
VDD = 5 V
Temperature -
°
C
Figure 10
Temperature -
°
C
-100
-50
0
50
100
150
0
20
40
60
80
100
120
VDD = 5 V
VDD = 7.5 V
VDD = 10 V
Ohms
CS RDS(on)
vs
TEMPERATURE
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
UCC2808AQDR-1EP
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Level-1-220C-UNLIM
UCC2808AQDR-2EP
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Level-1-220C-UNLIM
V62/04642-01XE
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Level-1-220C-UNLIM
V62/04642-02XE
ACTIVE
SOIC
D
8
2500
TBD
Call TI
Level-1-220C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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