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Part Number TBB1010

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TBB1010
Twin Build in Biasing Circuit MOS FET IC
VHF/VHF RF Amplifier
ADE-208-1607B (Z)
3rd. Edition
Feb. 2003
Features
·
Small SMD package CMPAK-6 built in twin BBFET; To reduce using parts cost & PC board space.
·
High |yfs|=29mS ×2
·
Suitable for World Standard Tuner RF amplifier.
·
Very useful for total tuner cost reduction.
·
Withstanding to ESD; Build in ESD absorbing diode. Withstand up to 200 V at C = 200 pF,
Rs = 0 conditions.
·
Provide mini mold packages; CMPAK-6
Outline
CMPAK-6
3
1
6
4
1. Drain(1)
2. Source
3. Drain(2)
4. Gate-1(2)
5. Gate-2
6. Gate-1(1)
2
5
Notes:
1.
Marking is "KM".
2.
TBB1010 is individual type number of HITACHI TWIN BBFET.
TBB1010
Rev.2, Feb. 2003, page 2 of 10
Absolute Maximum Ratings
(Ta = 25°C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DS
6
V
Gate1 to source voltage
V
G1S
+6
-0
V
Gate2 to source voltage
V
G2S
+6
-0
V
Drain current
I
D
30
mA
Channel power dissipation
Pch
*3
250
mW
Channel temperature
Tch
150
°
C
Storage temperature
Tstg
­55 to +150
°
C
Notes: 3. Value on the glass epoxy board (50mm
×
40mm
×
1mm).
TBB1010
Rev.2, Feb. 2003, page 3 of 10
Electrical Characteristics
(Ta = 25°C)
The below specification are applicable for FET1 and FET2 unit
Item
Symbol Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown
voltage
V
(BR)DSS
6
--
--
V
I
D
= 200
µ
A, V
G1S
= V
G2S
= 0
Gate1 to source breakdown
voltage
V
(BR)G1SS
+6
--
--
V
I
G1
= +10
µ
A, V
G2S
= V
DS
= 0
Gate2 to source breakdown
voltage
V
(BR)G2SS
+6
--
--
V
I
G2
= +10
µ
A, V
G1S
= V
DS
= 0
Gate1 to source cutoff current
I
G1SS
--
--
+100
nA
V
G1S
= +5 V, V
G2S
= V
DS
= 0
Gate2 to source cutoff current
I
G2SS
--
--
+100
nA
V
G2S
= +5 V, V
G1S
= V
DS
= 0
Gate1 to source cutoff voltage
V
G1S(off)
0.6
--
1.1
V
V
DS
= 5 V, V
G2S
= 4 V,
I
D
= 100
µ
A
Gate2 to source cutoff voltage
V
G2S(off)
0.6
--
1.1
V
V
DS
= 5 V, V
G1S
= 5 V,
I
D
= 100
µ
A
Drain current
I
D(op)
12
16
20
mA
V
DS
= 5 V, V
G1
= 5 V
V
G2S
= 4 V, R
G
= 120 k
Forward transfer admittance
|y
fs
|
24
29
--
mS
V
DS
= 5 V, V
G1
= 5 V, V
G2S
=4V
R
G
= 120 k
, f = 1 kHz
Input capacitance
Ciss
1.7
2.1
2.5
pF
V
DS
= 5 V, V
G1
= 5 V
Output capacitance
Coss
1.0
1.4
1.8
pF
V
G2S
=4 V, R
G
= 120 k
Reverse transfer capacitance
Crss
--
0.03
0.05
pF
f = 1 MHz
Power gain
PG
25
30
--
dB
V
DS
= V
G1
= 5 V, V
G2S
= 4 V
Noise figure
NF
--
1.1
1.8
dB
R
G
= 120 k
, f = 200 MHz
TBB1010
Rev.2, Feb. 2003, page 4 of 10
Test Circuits
·
DC Biasing Circuit for Operating Characteristic Items (I
D(op)
, |yfs|, Ciss, Coss, Crss, NF, PG)
Measurment of FET1
Gate 1
Source
Open
R
G
V
G1
I
D
V
D
Open
Drain
V
G2
Gate 2
A
Measurment of FET2
Open
Source
Gate 2
R
G
Drain
A
I
D
V
G2
V
G1
V
D
Gate 1
Open
TBB1010
Rev.2, Feb. 2003, page 5 of 10
·
Equivalent Circuit
BBFET-(1)
BBFET-(2)
No.1
No.2
No.3
No.6
No.5
No.4
Drain(1)
Source
Drain(2)
Gate-1(1)
Gate-2
Gate-1(2)
·
200 MHz Power Gain, Noise Figure Test Circuit
V
G2
Input (50
)
1000p
36p
1000p
L1
V = V
D G1
R
G
TWINBBFET
RFC
Output (50
)
L2
1000p
10p max
1000p
1000p
47k
1SV70
1000p
1000p
1000p
47k
47k
120k
V
T
V
T
Unit : Resistance (
)
Capacitance (F)
1SV70
L1 :
1mm Enameled Copper Wire,Inside dia 10mm, 2Turns
L2 :
1mm Enameled Copper Wire,Inside dia 10mm, 2Turns
RFC :
1mm Enameled Copper Wire,Inside dia 5mm, 2Turns
TBB1010
Rev.2, Feb. 2003, page 6 of 10
400
300
200
100
0
50
100
150
200
0
1
2
3
4
5
25
20
15
10
5
V = 4 V
V = V
G2S
G1
DS
25
20
15
10
5
0
1
2
3
4
5
50
40
30
20
10
0
1
2
3
4
5
V = 5 V
R = 120 k
DS
G
Channel Power Dissipation Pch* (mW)
Ambient Temperature Ta (
°
C)
Maximum Channel Power
Dissipation Curve
Drain Current I (mA)
D
Typical Output Characteristics
Drain to Source Voltage V (V)
DS
Drain Current vs. Gate1 Voltage
Gate1 Voltage V (V)
G1
Drain Current I (mA)
D
R = 82 k
G
100 k
2 V
V = 1 V
G2S
4 V
3 V
* Value on the glass epoxy board (50mm
× 40
mm
×
1mm)
120 k
150 k
180 k
Gate1 Voltage V (V)
G1
Forward Transfer Admittance
vs. Gate1 Voltage
fs
Forward Transfer Admittance |y | (mS)
V = 1 V
G2S
4 V
3 V
2 V
V = 5 V
R = 120 k
f = 1 kHz
DS
G
TBB1010
Rev.2, Feb. 2003, page 7 of 10
0
1
2
3
4
4
3
2
1
0
Gate2 to Source Voltage V (V)
G2S
Input Capacitance Ciss (pF)
Input Capacitance vs.
Gate2 to Source Voltage
30
25
20
15
10
5
0
10
20
50
100 200
500 1000
V = 5 V
V = 5 V
V = 4 V
DS
G1
G2S
Drain Current vs. Gate Resistance
Drain Current I (mA)
D
Gate Resistance R (k
)
G
40
35
30
25
20
15
10
10
20
50
100 200
500 1000
V = 5 V
V = 5 V
V = 4 V
f = 200 MHz
DS
G1
G2S
Power Gain vs. Gate Resistance
Gate Resistance R (k
)
G
Power Gain PG (dB)
0
4
3
2
1
10
20
50
100
200
500 1000
Noise Figure vs. Gate Resistance
Noise Figure NF (dB)
Gate Resistance R (k
)
G
V = 5 V
V = 5 V
V = 4 V
f = 200 MHz
DS
G1
G2S
V = 5 V
V = 5 V
R = 120 k
f = 1 MHz
DS
G1
G
TBB1010
Rev.2, Feb. 2003, page 8 of 10
0
50
40
30
20
10
0
1
2
3
4
DS
G
V = V = 5 V
R = 120 k
G1
Gain Reduction GR (dB)
Gain Reduction vs.
Gate2 to Source Voltage
Gate2 to Source Voltage V (V)
G2S
TBB1010
Rev.2, Feb. 2003, page 9 of 10
Package Dimensions
2.1 ± 0.3
6-0.2
0.9 ± 0.1
(0.2)
2.0 ± 0.2
(0.65)
(0.65)
1.3 ± 0.2
(0.425)
(0.425)
Hitachi Code
JEDEC
JEITA
Mass (reference value)
CMPAK-6
--
Conforms
0.006 g
0.15
0 ­ 0.1
+ 0.1
­ 0.05
+ 0.1
­ 0.05
1.25 ± 0.1
As of July, 2002
Unit: mm
TBB1010
Rev.2, Feb. 2003, page 10 of 10
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi's sales office before using the product in an application that demands especially high
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traffic, safety equipment or medical equipment for life support.
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for maximum rating, operating supply voltage range, heat radiation characteristics, installation
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