PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Rev. 01 -- 30 October 2002

Product data

Description

The PCKEP14 is a low skew 1-to-5 differential driver, designed with clock distribution
in mind, accepting two clock sources into an input multiplexer. The ECL/PECL input
signals can be either differential or single-ended (if the V

output is used). HSTL

inputs can be used when the PCKEP14 is operating under PECL conditions.

The PCKEP14 specifically guarantees low output-to-output skew. Optimal design,
layout, and processing minimize skew within a device, and from device to device.

To ensure that the tight skew specification is realized, both sides of any differential
output need to be terminated identically into 50

resistors, even if only one output is

being used. If an output pair is unused, both outputs may be left open (unterminated)
without affecting skew.

The common enable (EN) is synchronous, outputs are enabled/disabled in the LOW
state. This avoids a runt clock pulse when the device is enabled/disabled, as can
happen with an asynchronous control. The internal flip-flop is clocked on the falling
edge of the input clock, therefore, all associated specification limits are referenced to
the negative edge of the clock input.

The PCKEP14, as with most other ECL devices, can be operated from a positive V

supply in PECL mode. This allows the PCKEP14 to be used for high performance
clock distribution in +3.3 V or +2.5 V systems.

Features

100 ps device-to-device skew

25 ps within device skew

400 ps typical propagation delay

Maximum frequency > 2 GHz (typical)

Contains temperature compensation

PECL and HSTL mode: V

= 2.375 V to 3.8 V with V

= 0 V

NECL mode: V

= 0 V with V

2.375 V to

3.8 V

LVDS input compatible

Open input default state.

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

2 of 15

9397 750 09565

Pinning information

3.1 Pinning

3.2 Pin description

3.2.1

Power supply connection

Fig 1.

SO20 pin configuration.

Fig 2.

TSSOP20 pin configuration.

PCKEP14D

002aaa354

VCC

CLK1

VBB

CLK0

CLK_SEL

VEE

PCKEP14PW

002aaa221

VCC

CLK1

VBB

CLK0

CLK_SEL

VEE

Table 1:

Pin description

Symbol

Pin

Description

Q0-Q4

1, 3, 5, 7, 9

Positive ECL/PECL output

Q0-Q4

2, 4, 6, 8, 10

Negative ECL/PECL output

Negative supply

CLK_SEL

ECL/PECL active clock select input. Pin will default LOW
when left open.

CLK0, CLK1

13, 16

ECL/PECL/HSTL CLK input. Pins will default LOW when
left open.

CLK0, CLK1

14, 17

ECL/PECL/HSTL CLK input. Pins will default to V

/2 when

left open.

Reference voltage output

18, 20

Positive supply

ECL synchronous enable

CAUTION

All V

and V

pins must be connected to power supply to guarantee

proper operation.

MSC895

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

3 of 15

9397 750 09565

Ordering information

Logic diagram

Table 2:

Ordering information

Type number

Package

Name

Description

Version

PCKEP14D

SO20

plastic small outline package 8 leads; body width 7.5 mm

SOT163-1

PCKEP14PW

TSSOP20

plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

Fig 3.

Logic diagram.

CAUTION

All V

and V

pins must be connected to power supply to guarantee

proper operation.

CLK1

CLK0

CLK_SEL

002aaa222

CLK1

CLK0

MSC895

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

4 of 15

9397 750 09565

Function table

[1]

On next negative transition of CLK0 or CLK1.

Attributes

Table 3:

Function table

CLK0

CLK1

CLK_SEL

[1]

Table 4:

Attributes

Characteristic

Value

internal input pull-down resistor

75 k

internal input pull-up resistor

37.5 k

ESD protection

Human Body Model

> 2.5 kV

Machine Model

> 100 V

Charged Device Model

> 1 kV

moisture sensitivity, indefinite time out of drypack

Level 1

flammability rating

UL-94 code V-0 A 1/8"

Meets or exceeds JEDEC Specification EIA/JEDS78 IC latch-up test.

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

5 of 15

9397 750 09565

Limiting values

Static characteristics

[1]

Devices are designed to meet the DC specifications shown in this table, after thermal equilibrium has been established. The circuit is in
a test socket or mounted on a printed circuit board and transverse air flow greater than 500 LFPM is maintained.

[2]

Input and output parameters vary 1:1 with V

. V

can vary +0.125 V to

1.3 V.

[3]

All loading with 50

to V

2 V.

[4]

IHCMR(min)

varies 1:1 with V

, V

IHCMR(max)

varies 1:1 with V

. The V

IHCMR

range is referenced to the most positive side of the

differential input signal.

Table 5:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

PECL mode power supply

= 0 V

4.1

NECL mode power supply

= 0 V

4.1

PECL mode input voltage

= 0 V; V

4.1

NECL mode input voltage

= 0 V; V

4.1

out

output current

continuous

surge

100

source current

0.1

amb

operating ambient temperature

+85

stg

storage temperature range

+150

th(j-a)

thermal resistance from junction to ambient

0 LFPM

140

C/W

500 LFPM

100

C/W

th(j-c)

thermal resistance from junction to case

C/W

sld

soldering temperature

265

Table 6:

PECL DC characteristics

[1]

= 2.5 V; V

= 0 V

[2]

Symbol

Parameter

Conditions

amb

= +25

amb

= +85

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

power supply current

HIGH-level output
voltage

[3]

1355 1480 1605 1355 1500 1605 1355 1510 1605 mV

LOW-level output voltage

[3]

555

720

805

555

700

805

555

710

805

HIGH-level input voltage

single-ended

1335 -

1620 1335 -

1620 1275 -

1620 mV

LOW-level input voltage

single-ended

555

875

555

875

555

875

IHCMR

HIGH-level input voltage,
common mode range
(differential)

[4]

1.2

2.5

1.2

2.5

1.2

2.5

HIGH-level input current

150

LOW-level input current

CLK

0.5

CLK

150 -

output reference voltage

1075 1165 1265 1065 1165 1265 1085 1180 1270 mV

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

6 of 15

9397 750 09565

[1]

[2]

Input and output parameters vary 1:1 with V

. V

can vary +0.925 V to

0.5 V.

[3]

All loading with 50

to V

2 V.

[4]

Single-ended input operation is limited to V

3.0 V in PECL mode.

[5]

IHCMR(min)

varies 1:1 with V

, V

IHCMR(max)

varies 1:1 with V

. The V

IHCMR

range is referenced to the most positive side of the

differential input signal.

Table 7:

PECL DC characteristics

[1]

= 3.3 V; V

= 0 V

[2]

Symbol

Parameter

Conditions

amb

= +25

amb

= +85

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

power supply current

HIGH-level output
voltage

[3]

2155 2280 2405 2155 2300 2405 2155 2310 2405 mV

LOW-level output
voltage

[3]

1355 1515 1605 1355 1500 1605 1355 1500 1605 mV

HIGH-level input
voltage

single-ended

2135 -

2420 2135 -

2420 mV

LOW-level input voltage single-ended

1355 -

1675 1355 -

1675 mV

output reference
voltage

[4]

1875 1965 2065 1865 1965 2065 1885 1980 2070 mV

IHCMR

HIGH-level input
voltage, common mode
range (differential)

[5]

1.2

3.3

1.2

3.3

1.2

3.3

HIGH-level input current

150

LOW-level input current

CLK

0.5

CLK

150 -

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

7 of 15

9397 750 09565

[1]

Devices are designed to meet the DC specifications shown in the above table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 LFPM is maintained.

[2]

Input and output parameters vary 1:1 with V

. V

can vary +0.925 V to

0.5 V.

[3]

All loading with 50

to V

2 V.

[4]

Single-ended input operation is limited to V

3.0 V in NECL mode.

[5]

IHCMR(min)

varies 1:1 with V

, V

IHCMR(max)

varies 1:1 with V

. The V

IHCMR

range is referenced to the most positive side of the

differential input signal.

Table 8:

NECL DC characteristics

[1]

= 0 V; V

3.8 V to

2.375 V

[2]

Symbol Parameter

Conditions

amb

= +25

amb

= +85

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

power supply
current

HIGH-level output
voltage

[3]

1145

1020

895

1145

1000

895

1145

990

895

LOW-level output
voltage

[3]

1945

1785

1695

1945

1800

1695

1945

1800

1695 mV

HIGH-level input
voltage

single-ended

1165 -

880

1165 -

880

1165 -

880

LOW-level input
voltage

single-ended

1945 -

1625

1945 -

1625

1945 -

1625 mV

output reference
voltage

[4]

1425

1335

1235

1435

1335

1235

1415

1320

1230 mV

IHCMR

HIGH-level input
voltage, common
mode range
(differential)

[5]

+1.2

HIGH-level input
current

150

LOW-level input
current

CLK

0.5

CLK

150

Table 9:

HSTL DC characteristics

= 2.375 V to 3.8 V; V

= 0 V.

Symbol Parameter

Conditions

amb

= +25

amb

= +85

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

HIGH-level input
voltage

1200

LOW-level input
voltage

400

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

8 of 15

9397 750 09565

10. Dynamic characteristics

[1]

Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50

to V

2.0 V.

[2]

Skew is measured between outputs under identical transitions.

Table 10:

AC characteristics

= 0 V; V

2.375 V to

3.8 V) or (V

= 2.375 V to 3.8 V; V

= 0 V)

[1]

Symbol

Parameter

Conditions

amb

= +25

amb

= +85

Unit

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

max(PECL/

HSTL)

maximum toggle
frequency

see

Figure 4

> 2

GHz

PLH

, t

PHL

propagation delay to
output differential

250

345

425

275

360

475

300

430

525

SKEW

skew time

within-device

part-to-part

[2]

100

125

150

175

200

225

JITTER

cycle-to-cycle jitter

see

Figure 4

0.2

< 1

0.2

< 1

0.2

< 1

EN set-up time

100

EN hold time

200

140

200

140

200

140

i(p-p)

minimum input swing

150

800

1200

150

800

1200

150

800

1200 mV

output rise/fall times

(20% - 80%)

125

205

250

125

200

250

125

200

275

Fig 4.

max

900

800

700

600

500

400

300

200

100

1000

2000

3000

4000

OUT(p-p)

(mV)

002aaa223

FREQUENCY (MHz)

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

10 of 15

9397 750 09565

12. Package outline

Fig 6.

SO20 package outline (SOT163-1).

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

2.65

0.30
0.10

2.45
2.25

0.49
0.36

0.32
0.23

13.0
12.6

7.6
7.4

1.27

10.65
10.00

1.1
1.0

0.9
0.4

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT163-1

detail X

0.25

075E04

MS-013

pin 1 index

0.10

0.012
0.004

0.096
0.089

0.019
0.014

0.013
0.009

0.51
0.49

0.30
0.29

0.050

1.4

0.055

0.419
0.394

0.043
0.039

0.035
0.016

0.01

0.25

0.01

0.004

0.043
0.016

0.01

10 mm

scale

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

97-05-22
99-12-27

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

11 of 15

9397 750 09565

Fig 7.

TSSOP20 package outline (SOT360-1).

UNIT

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

0.15
0.05

0.95
0.80

0.30
0.19

0.2
0.1

6.6
6.4

4.5
4.3

0.65

6.6
6.2

0.4
0.3

0.5
0.2

8
0

0.13

0.1

0.2

1.0

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75
0.50

SOT360-1

MO-153

95-02-04
99-12-27

0.25

pin 1 index

detail X

(A )

2.5

5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

max.

1.10

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

12 of 15

9397 750 09565

13. Soldering

13.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended.

13.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 250

C. The top-surface

temperature of the packages should preferable be kept below 220

C for thick/large

packages, and below 235

C small/thin packages.

13.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal
results:

Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle

to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

13 of 15

9397 750 09565

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time is 4 seconds at 250

C. A mildly-activated flux will eliminate the

need for removal of corrosive residues in most applications.

13.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320

13.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note

(AN01026); order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

[3]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.

[4]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[5]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[6]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

14. Revision history

Table 11:

Suitability of surface mount IC packages for wave and reflow soldering
methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA

not suitable

suitable

HBCC, HBGA, HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable

[3]

suitable

PLCC

[4]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[4][5]

suitable

SSOP, TSSOP, VSO

not recommended

[6]

suitable

Table 12:

Revision history

Rev Date

CPCN

Description

20021030

Product data (9397 750 09565)

Engineering Change Notice 853-2373 28877 (date: 20020909)

9397 750 09565

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Product data

Rev. 01 -- 30 October 2002

14 of 15

Contact information

For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.

Fax: +31 40 27 24825

15. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

16. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

17. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

Level

Data sheet status

[1]

Product status

[2][3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.

The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.

Date of release: 30 October 2002

Document order number: 9397 750 09565

Contents

Philips Semiconductors

PCKEP14

2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Pinning information . . . . . . . . . . . . . . . . . . . . . . 2

3.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

3.2.1

Power supply connection . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 3

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

Dynamic characteristics . . . . . . . . . . . . . . . . . . 8

Application information. . . . . . . . . . . . . . . . . . . 9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

13.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 12

13.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 12

13.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13

13.5

Package related soldering information . . . . . . 13

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Part Number PCKEP14

Document Outline