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Part Number PCK12429

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Philips
Semiconductors
PCK12429
25­400 MHz differential PECL
clock generator
Product data
Supersedes data of 2002 Mar 15
2002 Jun 03
INTEGRATED CIRCUITS
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2
2002 Jun 03
853-2312 28362
INTRODUCTION
The PCK12429 is a general purpose synthesized clock source
targeting applications that require both serial and parallel interfaces.
The differential PECL output can be configured to be the VCO
frequency divided by 1, 2, 4, or 8. With the output configured to
divide the VCO frequency by 2, and with a 16.000 MHz external
quartz crystal used to provide the reference frequency, the output
frequency can be specified in 1 MHz steps. The PLL loop filter is
fully integrated so that no external components are required.
FEATURES
·
25 to 400 MHz differential PECL outputs
·
±
25 ps peak-to-peak output jitter
·
Fully integrated phase-locked loop
·
Minimal frequency over-shoot
·
Synthesized architecture
·
Serial 3-wire interface
·
Parallel interface for power-up
·
Quartz crystal interface
·
Package offer: SO28, PLCC28, and LQFP32
·
Operates from 3.3 V power supply
DESCRIPTION
The internal oscillator uses the external quartz crystal as the basis
of its frequency reference. The output of the reference oscillator is
divided by 16 before being sent to the phase detector.
The VCO output is scaled by a divider that is configured by either
the serial or parallel interfaces. The output of this loop divider is also
applied to the phase detector.
The phase detector and loop filter attempt to force the VCO output
frequency to be M times the reference frequency by adjusting the
VCO control voltage. Note that for some values of M (either too high
or too low) the PLL will not achieve loop lock.
The output of the VCO is also passed through an output divider
before being sent to the PECL output driver. This output divider (N
divider) is configured through either the serial or the parallel
interfaces, and can provide one of four division ratios (1, 2, 4, or 8).
This divider extends performance of the part while providing a 50%
duty cycle.
The output driver is driven differentially from the output divider, and
is capable of driving a pair of transmission lines terminated in 50
to V
CC
­2.0. The positive reference for the output driver and the
internal logic is separated from the power supply for the
phase-locked loop to minimize noise induced jitter.
The configuration logic has two sections: serial and parallel. The
parallel interface uses the values at the M[8:0] and N[1:0] inputs to
configure the internal counters. Normally, on system reset, the
P_LOAD input is held LOW until sometime after power becomes
valid. On the LOW-to-HIGH transition of P_LOAD, the parallel inputs
are captured. The parallel interface has priority over the serial
interface. Internal pullup resistors are provided on the M[8:0] and
N[1:0] inputs to reduce component count in the application of the
chip.
The serial interface centers on a fourteen bit shift register. The shift
register shifts once per rising edge of the S_CLOCK input. The
serial input S_DATA must meet setup and hold timing as specified in
the AC Characteristics section of this document. The configuration
latches will capture the value of the shift register on the
HIGH-to-LOW edge of the S_LOAD input. See the programming
section for more information.
The TEST output reflects various internal node values, and is
controlled by the T[2:0] bits in the serial data stream. See the
programming section for more information.
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
ORDER CODE
DRAWING NUMBER
28-Pin Plastic SO
0 to +70
°
C
PCK12429D
SOT136-1
28-Pin Plastic PLCC
0 to +70
°
C
PCK12429A
SOT261-2
32-pin Plastic LQFP
0 to +70
°
C
PCK12429BD
SOT358-1
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
3
PIN CONFIGURATION
28-Pin SO
1
2
3
4
5
6
7
8
9
10
11
12
17
18
19
20
21
22
23
24
25
26
27
28
M[0]
P_LOAD
M[1]
V
CC
M[2]
XTAL2
M[3]
XTAL1
M[4]
NC
M[5]
NC
M[6]
PLL-V
CC
M[7]
S_DATA
M[8]
S_LOAD
N[0]
S_CLOCK
N[1]
V
CC
FOUT
13
GND
16 FOUT
14
TEST
15 GND
SW01013
V
CC
28-Pin PLCC
TOP VIEW
SR02303
PLL-
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
V
CC
NC
NC
XT
AL1
XTAL2
OE
P_LOAD
M[0]
M[1]
M[2]
M[3]
M[4]
M[5]
M[6]
M[7]
M[8]
N[0]
N[1]
GND
TEST
V
CC
GND
FOUT
FOUT
V
CC
S_CLOCK
S_DA
T
A
S_LOAD
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
4
32-Pin LQFP
24
23
22
21
20
19
18
17
9
10
11
12
13
14
15
16
N/C
N[1]
N[0]
M[8]
M[7]
M[6]
M[5]
M[4]
1
2
3
4
5
6
7
8
32
31
30
20
28
27
26
25
32-LEAD LQFP
SW01012
S_CLOCK
S_DATA
S_LOAD
N/C
N/C
XTAL1
V
FOUT
FOUT
GND
V
V
TEST
GND
XT
AL2
OE
M[0]
P_LOAD
M[1]
M[2]
M[3]
N/C
PLL-V
CC
cc
cc
PLL-V
CC
cc
PIN DESCRIPTION
SYMBOL
FUNCTION
XTAL1, XTAL2
These pins form an oscillator when connected to an external series-resonant crystal.
S_LOAD (Int. pulldown)
This pin loads the configuration latches with the contents of the shift registers. The latches will be
transparent when this signal is HIGH, thus the data must be stable on the HIGH-to-LOW transition
of S_LOAD for proper operation.
S_DATA (Int. pulldown)
This pin acts as the data input to the serial configuration shift registers.
S_CLOCK (Int. pulldown)
This pin serves to clock the serial configuration shift registers. Data from S_DATA is sampled on the
rising edge.
P_LOAD (Int. pullup)
This pin loads the configuration latches with the contents of the parallel inputs. The latches will be
transparent when this signal is LOW, thus the parallel data must be stable on the LOW-to-HIGH
transition of P_LOAD for proper operation.
M[8:0] (Int. pullup)
These pins are used to configure the PLL loop divider. They are sampled on the LOW-to-HIGH
transition of P_LOAD, M[8] is the MSB, M[0] is the LSB.
N[1:0] (Int. pullup)
These pins are used to configure the output divider modulus. They are sampled on the
LOW-to-HIGH transition of P_LOAD.
OE (Int. pullup)
Active HIGH Output Enable. The Enable is synchronous to eliminate possibility of runt pulse
generation on the F
OUT
output.
F
OUT
, F
OUT
These differential positive-referenced ECL signals (PECL) are the output of the synthesizer.
TEST
The function of this output is determined by the serial configuration bits T[2:0].
V
CC1
and V
CCO
This is the positive supply for the internal logic and the output buffer of the chip, and is connected to
+3.3 V (V
CC
= PLL_V
CC
).
PLL_V
CC
This is the positive supply for the PLL, and should be as noise-free as possible for low-jitter
operation. This supply is connected to +3.3 V (V
CC
= PLL_V
CC
).
GND
These pins are the negative supply for the chip and are normally all connected to ground.
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
5
BLOCK DIAGRAM
XTAL1
SW00728
OSC
XTAL2
DIV 16
1 MHz
F
REF
PHASE
DETECTOR
VCO
9-BIT DIV M
COUNTER
LATCH
200­400
MHz
DIV N
(1, 2, 4, 8)
V
CC0
+3.3 V
LATCH
F
OUT
F
OUT
16 MHz
OE
0
1
0
1
LATCH
TEST
S_LOAD
P_LOAD
9-BIT
SR
2-BIT
SR
3-BIT
SR
S_DATA
S_CLOCK
V
CC1
+3.3 V
9
M[8:0]
2
N[1:0]
+3.3 V
PLL_V
CC
N[1:0]
Output Division
0 0
0 1
1 0
1 1
1
2
4
8
PROGRAMMING INTERFACE
Programming the device amounts to properly configuring the internal
dividers to produce the desired frequency at the outputs. The output
frequency can be represented by this formula:
F
OUT
= (F
XTAL
÷
16)
×
M
÷
N
(1)
Where F
XTAL
is the crystal frequency, M is the loop divider modulus,
and N is the output divider modulus. Note that it is possible to select
values of M such that the PLL is unable to achieve loop lock. To
avoid this, always make sure that M is selected to be 200
M
400
for a 16 MHz input reference.
Assuming that a 16 MHz reference frequency is used, the above
equation reduces to:
F
OUT
= M
÷
N
Substituting the four values for N (1, 2, 4, or 8) yields:
F
OUT
= M, F
OUT
= M
÷
2,
F
OUT
= M
÷
4 and F
OUT
= M
÷
8
for 200
M
400
The user can identify the proper M and N values for the desired
frequency from the above equations. The four output frequency
ranges established by N are 200­400 MHz, 100­200 MHz,
50­100 MHz, and 25­50 MHz respectively. From these ranges the
user will establish the value of N required, then the value of M can
be calculated based on the appropriate equation above. For
example, if an output frequency of 131 MHz was desired, the
following steps would be taken to identify the appropriate M and N
values. 131 MHz falls within the frequency range set by an N value
of 2 so N [1:0] = 01. For N = 2 F
OUT
= M
÷
2 and M = 2
×
F
OUT
.
Therefore, M = 131
×
2 = 262, so M[8:0] = 100000110. Following this
same procedure a user can generate any whole frequency desired
between 25 and 400 MHz. Note that for N
2 fractional values of
F
OUT
can be realized. The size of the programmable frequency
steps (and thus the indicator of the fractional output frequencies
achievable) will be equal to F
XTAL
÷
16
÷
N.
For input reference frequencies other than 16 MHz, the set of
appropriate equations can be deduced from equation 1. For
computer applications another useful frequency base would be
16.666 MHz. From this reference, one can generate a family of
output frequencies at multiples of the 33.333 MHz PCI clock. As an
example, to generate a 133.333 MHz clock from a 16.666 MHz
reference, the following M and N values would be used:
F
OUT
= 16.666
÷
16
×
M
÷
N = 1.041625
×
M
÷
N
Let N = 2, M = 256,
F
OUT
= 1.041625
×
256
÷
2 = 133.328 MHz
The value for M falls within the constraints set for PLL stability,
therefore N[1:0] = 01 and M[8:0] = 100000000. If the value for M fell
outside of the valid range a different N value would be selected to try
to move M in the appropriate direction.
The M and N counters can be loaded either through a parallel or
serial interface. The parallel interface is controlled via the P_LOAD
signal such that a LOW to HIGH transition will latch the information
present on the M[8:0] and N[1:0] inputs into the M and N counters.
When the P_LOAD signal is LOW the input latches will be
transparent and any changes on the M[8:0] and N[1:0] inputs will
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
6
affect the F
OUT
output pair. To use the serial port the S_CLOCK
signal samples the information on the S_DATA line and loads it into
a 14-bit shift register. Note that the P_LOAD signal must be HIGH
for the serial load operation to function. The Test register is loaded
with the first three bits, the N register with the next two, and the M
register with the final eight bits of the data stream on the S_DATA
input. For each register the most significant bit is loaded first (T2,
N1, and M8). A pulse on the S_LOAD pin after the shift register is
fully loaded will transfer the divide values into the counters. The
HIGH_to_LOW transition on the S_LOAD input will latch the new
divide values into the counters. Figure 1 illustrates the timing
diagram for both a parallel and a serial load of the PCK12429
synthesizer.
M[8:0] and N[1:0] are normally specified once at power-up through
the parallel interface, and then possibly again through the serial
interface. This approach allows the application to come up at one
frequency and then change or fine-tune the clock as the ability to
control the serial interface becomes available. To minimize
transients in the frequency domain, the output should be varied in
the smallest step size possible. The bandwidth of the PLL is such
that frequency stepping in 1 MHz steps at the maximum S_CLOCK
frequency or less will cause smooth, controlled slewing of the output
frequency.
The TEST output provides visibility for one of the several internal
nodes as determined by the T[2:0] bits in the serial configuration
stream. It is not configurable through the parallel interface. Although
it is possible to select the node that represents F
OUT
, the CMOS
output may may not be able to toggle fast enough for some of the
higher output frequencies. The T2, T1, and T0 control bits are preset
to `000' when P_LOAD is LOW so that the PECL F
OUT
outputs are
as jitter-free as possible. Any active signal on the TEST output pin
will have detrimental affects on the jitter of the PECL output pair. In
normal operations, jitter specifications are only guaranteed if the
TEST output is static. The serial configuration port can be used to
select one of the alternate functions for this pin.
Most of the signals available on the TEST output pin are useful only
for performance verification of the PCK12429 itself. However, the
PLL bypass mode may be of interest at the board level for functional
debug. When T[2:0] is set to 110 the PCK12429 is placed in PLL
bypass mode. In this mode the S_CLOCK input is fed directly into
the M and N dividers. The N divider drives the F
OUT
differential pair
and the M counter drives the TEST output pin. In this mode the
S_CLOCK input could be used for low speed broad level functional
test or debug. Bypassing the PLL and driving F
OUT
directly, gives
the user more control on the test clocks sent through the clock tree.
Figure 2 shows the functional setup of the PLL bypass mode.
Because the S_CLOCK is a CMOS level the input frequency is
limited to 250 MHz or less. This means the fastest the F
OUT
pin can
be toggled via the S_CLOCK is 125 MHz, as the minimum divide
ratio of the N counter is 2. Note that the M counter output on the
TEST output will not be a 50% duty cycle due to the way the divider
is implemented.
Table 1. Test modes
T2
T1
T0
TEST (Pin 20)
0
0
0
SHIFT REGISTER OUT
0
0
1
HIGH
0
1
0
F
REF
0
1
1
M COUNTER OUT
1
0
0
F
OUT
1
0
1
LOW
1
1
0
PLL BYPASS
1
1
1
F
OUT
/4
S_CLOCK
SW00729
T2
S_DATA
T1 T0 N1 N0 M8 M7 M6 M5 M4 M3 M2 M1
M0
S_LOAD
First
Bit
Last
Bit
M, N
M[8:0]
N[1:0]
P_LOAD
Figure 1. Timing Diagram
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
7
SW00730
N DIVIDE
(2, 4, 8, 16)
PLL 12429
SHIFT
REG
14-BIT
VCO_CLK
F
REF
MCNT
0
1
F
OUT
(VIA ENABLE GATE)
SEL_CLK
SCLOCK
SDATA
T0
T1
T2
DECODE
LATCH
Reset
M COUNTER
SLOAD
PLOADB
FDIV4
MCNT
LOW
F
OUT
MCNT
F
REF
HIGH
TEST
MUX
0
7
TEST
·
T2 = T1 = 1. T0 = 0: Test Mode
·
SCLOCK is selected, MCNT is on TEST output, SCLOCK DIVIDE BY N is on F
OUT
pin.
PLOADB acts as reset for test pin latch. When latch reset T2 data is shifted out TEST pin.
Figure 2. Serial Test Clock Block Diagram
DC CHARACTERISTICS
(T
amb
= 0 to 70
°
C, V
CC
= 3.3 V
±
5%)
SYMBOL
PARAMETER
CONDITION
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITION
MIN
TYP
MAX
UNIT
V
IH
Input HIGH Voltage
V
CC
= 3.3 V
2.0
--
--
V
V
IL
Input LOW Voltage
V
CC
= 3.3 V
--
--
0.8
V
I
IN
Input Current
--
--
1.0
mA
V
OH
Output HIGH Voltage
TEST
I
OH
= ­0.8 mA
2.5
--
V
V
OL
Output LOW Voltage
TEST
I
OL
= 0.8 mA
--
--
0.4
V
V
O
Output HIGH Voltage
F
OUT
V
CC0
= 3.3 V
2 17
2 50
V
V
OH
Output HIGH Voltage
F
OUT
CC0
(Notes 1 and 2)
2.17
--
2.50
V
V
O
Output LOW Voltage
F
OUT
V
CC0
= 3.3 V
1 41
1 76
V
V
OL
Output LOW Voltage
F
OUT
CC0
(Notes 1 and 2)
1.41
--
1.76
V
I
CC
Power Supply Current
V
CC1
85
100
mA
I
CC
Power Supply Current
PLL_V
CC
--
15
20
mA
NOTES:
1. Output levels will vary 1:1 with V
CC0
variation.
2. 50
to V
CC
­ 2.0 V pulldown.
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
8
AC CHARACTERISTICS
(T
amb
= 0 to 70
°
C, V
CC
= 3.3 V
±
5%)
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
T
amb
= 0 to +70
°
C
UNIT
MIN
MAX
F
Maximum Input Frequency
S_CLOCK
Note 1
--
10
MHz
F
MAXI
Maximum Input Frequency
Xtal Oscillator
Note 1
10
20
MHz
F
O
Maximum Output Frequency
VCO (Internal)
Note 2
200
400
MHz
F
MAXO
Maximum Output Frequency
F
OUT
Note 2
25
400
MHz
t
LOCK
Maximum PLL Lock Time
--
10
ms
t
jitter
RMS jitter (peak-to-peak)
Note 2
See Applications Section
--
±
25
ps
S_DATA to
S_CLOCK
20
--
t
s
Setup Time
S_CLOCK TO
S_LOAD
20
--
ns
M, N to P_LOAD
20
--
t
n
Hold Time
S_DATA to
S_CLOCK
20
--
ns
n
M, N to P_LOAD
20
--
tpw
Minimum Pulse Width
S_LOAD
Note 2
50
--
ns
tpw
MIN
Minimum Pulse Width
P_LOAD
Note 2
50
--
ns
t
r
, t
f
Output Rise/Fall
F
OUT
20%­80%, Note 2
100
400
ps
Duty Cycle
45
55
%
NOTES:
1. 10 MHz is the maximum frequency to load the feedback device registers. S_CLOCK can be switched at higher frequencies when used as a
test clock in TEST_MODE 6. Crystal frequency of 16MHz verified at productiontest. 10 to 20MHz operationguaranteed by design.
2. 50
to V
CC
­2.0 V pulldown.
APPLICATIONS INFORMATION
Using the on-board crystal oscillator
The PCK12429 features a fully integrated on-board crystal oscillator
to minimize system implementation costs. The oscillator is a series
resonant, multivibrator type design as opposed to the more common
parallel resonant oscillator design. The series resonant design
provides better stability and eliminates the need for large on chip
capacitors. The oscillator is totally self contained so that the only
external component required is the crystal. As the oscillator is
somewhat sensitive to loading on its inputs, the user is advised to
mount the crystal as close to the PCK12429 as possible to avoid
any board level parasitics. To facilitate co-location surface mount
crystals are recommended, but not required. Because the series
resonant design is affected by capacitive loading on the XTAL
terminals, loading variation introduced by crystals from different
vendors could be a potential issue.
The oscillator circuit is a series resonant circuit and thus for
optimum performance a series resonant crystal should be used.
Unfortunately most crystals are characterized in a parallel resonant
mode. Fortunately there is no physical difference between a series
resonant and a parallel resonant crystal. The difference is purely in
the way the devices are characterized. As a result, a parallel
resonant crystal can be used with the PCK12429 with only a minor
error in the desired frequency. A parallel resonant mode crystal used
in a series resonant circuit will exhibit a frequency of oscillation a
few hundred ppm lower than specified, a few hundred ppm
translates to kHz inaccuracies. In a general computer application
this level of inaccuracy is immaterial. Table 2 specifies the
performance requirements of the crystals to be used with the
PCK12429.
Table 2. Test modes
PARAMETER
VALUE
Crystal Cut
Fundamental AT Cut
Resonance
Series Resonance*
Frequency Tolerance
±
75 ppm at 25
°
C
Frequency/Temperature Stability
±
150 pm 0 to 70
°
C
Operating Range
0 to 70
°
C
Shunt Capacitance
5­7 pF
Equivalent Series Resistance (ESR)
50 to 80
Correlation Drive Level
100
µ
W
Aging
5 ppm/Yr (first 3 years)
NOTE:
*
See accompanying text for series versus parallel resonant
discussion.
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
9
Power supply filtering
The PCK12429 is a mixed analog/digital product and as such it
exhibits some sensitivities that would not necessarily be seen on a
fully digital product. Analog circuitry is naturally susceptible to
random noise, especially if this noise is seen on the power supply
pins. The PCK12429 provides separate power supplies for the
digital circuitry (V
CC
) and the internal PLL (PLL_V
CC
) of the device.
The purpose of this design technique is to try and isolate the high
switching noise digital outputs from the relatively sensitive internal
analog phase-locked loop. In a controlled environment such as an
evaluation board, this level of isolation is sufficient. However, in a
digital system environment where it is more difficult to minimize
noise on the power supplies, a second level of isolation may be
required. The simplest form of isolation is a power supply filter on
the PLL_V
CC
pin for the PCK12429.
Figure 3 illustrates a typical power supply filter scheme. The
PCK12429 is most susceptible to noise with spectral content in the
1 kHz to 2 MHz range. A good choice of pole placement should be
close to 32 kHz. Therefore the filter should be designed to target this
range. The key parameter that needs to be met in the final filter
design is the DC voltage drop that will be seen between the V
CC
supply and the PLL_V
CC
pin of the PCK12429. From the data sheet
the I
PLL_VCC
current (the current sourced through the PLL_V
CC
pin)
is typically 15 mA (20 mA maximum), assuming that a minimum of
3.0 V must be maintained on the PLL_V
CC
pin, very little DC voltage
drop can be tolerated when a 3.3 V V
CC
supply is used. The resistor
shown in Figure 3 must have a resistance of 10­15
to meet the
voltage drop criteria. The RC filter pictured will provide a broadband
filter with approximately 100:1 attenuation for noise whose spectral
content is above 20 kHz. As the noise frequency crosses the series
resonant point of an individual capacitor, its overall impedance
begins to look inductive and thus increases with increasing
frequency. The parallel capacitor combination shown ensures that a
low impedance path to ground exists for frequencies well above the
bandwidth of the PLL.
V
CC
SW00745
PLL_V
CC
PCK12429
0.01
µ
F
22
µ
F
R
S
= 10­15
L = 1000
µ
H
R = 15
3.3 V
3.3 V
Figure 3. Power supply filter
A higher level of attenuation can be achieved by replacing the
resistor with an appropriate valued inductor. Figure 3 shows a
1000
µ
H choke, this value choke will show a significant impedance
at 10 KHz frequencies and above. Because of the current draw and
the voltage that must be maintained on the PLL_V
CC
pin, a low DC
resistance inductor is required (less than 15
). Generally the
resistor/capacitor filter will be cheaper, easier to implement, and
provide an adequate level of supply filtering.
The PCK12429 provides sub-nanosecond output edge rates, and
thus a good power supply bypassing scheme is a must. Figure 4
shows a representative board layout for the PCK12429. There exists
many different potential board layouts and the one pictured is but
one. The important aspect of the layout in Figure 4 is the low
impedance connections between V
CC
and GND for the bypass
capacitors. Combining good quality general purpose chip capacitors
with good PCB layout techniques will produce effective capacitor
resonances at frequencies adequate to supply the instantaneous
switching current for the PCK12429 outputs. It is imperative that low
inductance chip capacitors are used; it is equally important that the
board layout does not introduce back all of the inductance saved by
using the leadless capacitors. Thin interconnect traces between the
capacitor and the power plane should be avoided and multiple large
vias should be used to tie the capacitors to the buried power planes.
Fat interconnect and large vias will help to minimize layout induced
inductance and thus maximize the series resonant point of the
bypass capacitors.
SW00746
Xtal
1
C3
C2
É
É
É
= VCC
= GND
= Via
ÉÉ
É
É
É
É
É
C1
ÉÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
É
É
É
É
C1
R1 = 10­15
C1 = 0.01
µ
F
C2 = 22
µ
F
C3 = 0.1
µ
F
R1
Figure 4. PCB board layout for PCK12429
Note the dotted lines circling the crystal oscillator connection to the
device. The oscillator is a series resonant circuit and the voltage
amplitude across the crystal is relatively small. It is imperative that
no actively switching signals cross under the crystal, as crosstalk
energy coupled to these lines could significantly impact the jitter of
the device. Special attention should be paid to the layout of the
crystal to ensure a stable, jitter free interface between the crystal
and the on-board oscillator.
Although the PCK12429 has several design features to minimize the
susceptibility to power supply noise (isolated power and grounds
and fully differential PLL) there still may be applications in which
overall performance is being degraded due to system power supply
noise. The power supply filter and bypass schemes discussed in this
section should be adequate to eliminate power supply noise related
problems in most designs.
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
10
Jitter performance of the PCK12429
The PCK12429 exhibits long term and cycle-to-cycle jitter which
rivals that of SAW based oscillators. This jitter performance comes
with the added flexibility one gets with a synthesizer over a fixed
frequency oscillator.
0
5
10
15
20
200
220
240
260
280
300
320
340
360
380
400
VCO FREQUENCY (MHz)
N = 1
N = 2
N = 4
N = 8
SW01010
RMS JITTER (ps)
Figure 5. RMS PLL jitter versus VCO frequency
Figure 5 illustrates the RMS jitter performance of the PCK12429
across its specified VCO frequency range. Note that the jitter is a
function of both the output frequency as well as the VCO frequency,
however the VCO frequency shows a much stronger dependence.
The data presented has not been compensated for trigger jitter, this
fact provides a measure of guardband to the reported data. In
addition the data represents long term period jitter, the cycle-to-cycle
jitter could not be measured to the level of accuracy required with
available test equipment but certainly will be smaller than the long
term period jitter.
The most commonly specified jitter parameter is cycle-to-cycle jitter.
Unfortunately with today's high performance measurement
equipment there is no way to measure this parameter for jitter
performance in the class demonstrated by the PCK12429. As a
result, different methods are used which approximate cycle-to-cycle
jitter. The typical method of measuring the jitter is to accumulate a
large number of cycles, create a histogram of the edge placements,
and record peak-to-peak as well as standard deviations of the jitter.
Care must be taken that the measured edge is the edge immediately
following the trigger edge. The oscilloscope cannot collect adjacent
pulses, rather it collects pulses from a very large sample of pulses. It
is safe to assume that collecting pulse information in this mode will
produce period jitter values somewhat larger than if consecutive
cycles (cycle-to-cycle jitter) were measured. All of the jitter data
reported on the PCK12429 was collected in this manner.
Figure 6 shows the jitter as a function of the output frequency. For
the PCK12429, this information is probably of more importance. The
flat line represents an RMS jitter value that corresponds to an
8 sigma
±
25 ps peak-to-peak long term period jitter. The graph
shows that for output frequencies from 125 to 400 MHz the jitter falls
within the
±
25 ps peak-to-peak specification. The general trend is
that as the output frequency is decreased the output edge jitter will
increase.
0.00
5.00
10.00
15.00
20.00
25.00
25 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400
OUTPUT FREQUENCY (MHz)
6.25 ps REFERENCE (1 SIGMA)
SW01011
RMS JITTER (ps)
Figure 6. RMS jitter versus output frequency
The jitter data presented should provide users with enough
information to determine the effect on their overall timing budget.
The jitter performance meets the needs of most system designs
while adding the flexibility of frequency margining and field
upgrades. These features are not available with a fixed frequency
SAW oscillator.
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
11
SO28:
plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
12
PLCC28:
plastic leaded chip carrier; 28 leads
SOT261-2
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
13
LQFP32:
plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm
SOT358-1
Philips Semiconductors
Product data
PCK12429
25­400 MHz differential PECL clock generator
2002 Jun 03
14
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to:
sales.addresses@www.semiconductors.philips.com.
©
Koninklijke Philips Electronics N.V. 2002
All rights reserved. Printed in U.S.A.
Date of release: 06-02
Document order number:
9397 750 09913
Philips
Semiconductors
Data sheet status
[1]
Objective data
Preliminary data
Product data
Product
status
[2]
Development
Qualification
Production
Definitions
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
This data sheet contains data from the preliminary specification. Supplementary data will be
published at a later date. Philips Semiconductors reserves the right to change the specification
without notice, in order to improve the design and supply the best possible product.
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply.
Changes will be communicated according to the Customer Product/Process Change Notification
(CPCN) procedure SNW-SQ-650A.
Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.