2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

FEATURES

Fully compatible with the

"ISO 11898" standard

High speed (up to 1 Mbaud)

Bus lines protected against transients in an automotive
environment

Slope control to reduce Radio Frequency Interference
(RFI)

Differential receiver with wide common-mode range for
high immunity against ElectroMagnetic Interference
(EMI)

Thermally protected

Short-circuit proof to battery and ground

Low-current standby mode

An unpowered node does not disturb the bus lines

At least 110 nodes can be connected.

APPLICATIONS

High-speed applications (up to 1 Mbaud) in cars.

GENERAL DESCRIPTION

The PCA82C250 is the interface between the CAN
protocol controller and the physical bus. The device
provides differential transmit capability to the bus and
differential receive capability to the CAN controller.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

4.5

5.5

supply current

standby mode

170

1/t

bit

maximum transmission speed

non-return-to-zero

Mbaud

CAN

CANH, CANL input/output voltage

+18

diff

differential bus voltage

1.5

3.0

propagation delay

high-speed mode

amb

ambient temperature

+125

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

CODE

PCA82C250

DIP8

plastic dual in-line package; 8 leads (300 mil)

SOT97-1

PCA82C250T

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

PCA82C250U

bare die; 2790

1780

380

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

FUNCTIONAL DESCRIPTION

The PCA82C250 is the interface between the CAN
protocol controller and the physical bus. It is primarily
intended for high-speed applications (up to 1 Mbaud) in
cars. The device provides differential transmit capability to
the bus and differential receive capability to the CAN
controller. It is fully compatible with the

"ISO 11898"

standard.

A current limiting circuit protects the transmitter output
stage against short-circuit to positive and negative battery
voltage. Although the power dissipation is increased
during this fault condition, this feature will prevent
destruction of the transmitter output stage.

If the junction temperature exceeds a value of
approximately 160

C, the limiting current of both

transmitter outputs is decreased. Because the transmitter
is responsible for the major part of the power dissipation,
this will result in a reduced power dissipation and hence a
lower chip temperature. All other parts of the IC will remain
in operation. The thermal protection is particularly needed
when a bus line is short-circuited.

The CANH and CANL lines are also protected against
electrical transients which may occur in an automotive
environment.

Pin 8 (Rs) allows three different modes of operation to be
selected: high-speed, slope control or standby.

For high-speed operation, the transmitter output
transistors are simply switched on and off as fast as
possible. In this mode, no measures are taken to limit the
rise and fall slope. Use of a shielded cable is
recommended to avoid RFI problems. The high-speed
mode is selected by connecting pin 8 to ground.

For lower speeds or shorter bus length, an unshielded
twisted pair or a parallel pair of wires can be used for the
bus. To reduce RFI, the rise and fall slope should be
limited. The rise and fall slope can be programmed with a
resistor connected from pin 8 to ground. The slope is
proportional to the current output at pin 8.

If a HIGH level is applied to pin 8, the circuit enters a low
current standby mode. In this mode, the transmitter is
switched off and the receiver is switched to a low current.
If dominant bits are detected (differential bus voltage
>0.9 V), RXD will be switched to a LOW level.
The microcontroller should react to this condition by
switching the transceiver back to normal operation (via
pin 8). Because the receiver is slow in standby mode, the
first message will be lost.

Table 1 Truth table of the CAN transceiver

Note

1. X = don't care.

Table 2 Pin Rs summary

SUPPLY

TXD

CANH

CANL

BUS STATE

RXD

4.5 to 5.5 V

HIGH

LOW

dominant

4.5 to 5.5 V

1 (or floating)

floating

recessive

<2 V (not powered)

(1)

floating

recessive

(1)

2 V < V

< 4.5 V

>0.75V

floating

recessive

(1)

2 V < V

< 4.5 V

(1)

floating if

> 0.75V

floating if

> 0.75V

recessive

(1)

CONDITION FORCED AT PIN Rs

MODE

RESULTING VOLTAGE OR CURRENT AT PIN Rs

> 0.75V

standby

A < I

200

slope control

0.4V

< V

< 0.6V

< 0.3V

high-speed

500

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;
positive input current.

Notes

1. In accordance with

"IEC 60747-1". An alternative definition of virtual junction temperature is:

= T

amb

+ P

th(vj-a)

, where R

th(j-a)

is a fixed value to be used for the calculation of T

. The rating for T

limits

the allowable combinations of power dissipation (P

) and ambient temperature (T

amb

2. Classification A: human body model; C = 100 pF; R = 1500

; V =

2000 V.

3. Classification B: machine model; C = 200 pF; R = 25

; V =

200 V.

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

According to

"SNW-FQ-611 part E".

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

0.3

+9.0

DC voltage at pins 1, 4, 5 and 8

0.3

+ 0.3

6, 7

DC voltage at pins 6 and 7

0 V < V

< 5.5 V;

no time limit

8.0

+18.0

trt

transient voltage at pins 6 and 7

see Fig.8

150

+100

stg

storage temperature

+150

amb

ambient temperature

+125

virtual junction temperature

note 1

+150

esd

electrostatic discharge voltage

note 2

2000

+2000

note 3

200

+200

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air

PCA82C250

100

K/W

PCA82C250T

160

K/W

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

CHARACTERISTICS
V

= 4.5 to 5.5 V; T

amb

40 to +125

C; R

= 60

; I

A; unless otherwise specified; all voltages referenced

to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,
but only 100% tested at +25

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply current

dominant; V

= 1 V

recessive; V

= 4 V;

= 47 k

recessive; V

= 4 V;

= 1 V

standby; T

amb

< 90

note 1

100

170

DC bus transmitter

HIGH-level input voltage

output recessive

0.7V

+ 0.3 V

LOW-level input voltage

output dominant

0.3

0.3V

HIGH-level input current

= 4 V

200

+30

LOW-level input current

= 1 V

100

600

6,7

recessive bus voltage

= 4 V; no load

2.0

3.0

off-state output leakage current

2 V < (V

) < 7 V

5 V < (V

) < 18 V

+12

CANH output voltage

= 1 V

2.75

4.5

CANL output voltage

= 1 V

0.5

2.25

6, 7

difference between output
voltage at pins 6 and 7

= 1 V

1.5

3.0

= 1 V; R

= 45

;

4.9 V

1.5

= 4 V; no load

500

+50

sc7

short-circuit CANH current

5 V; V

5 V

105

5 V; V

= 5.5 V

120

sc6

short-circuit CANL current

= 18 V

160

DC bus receiver: V

= 4 V; pins 6 and 7 externally driven;

2 V < (V

) < 7 V; unless otherwise specified

diff(r)

differential input voltage
(recessive)

1.0

+0.5

7 V < (V

) < 12 V;

not standby mode

1.0

+0.4

diff(d)

differential input voltage
(dominant)

0.9

5.0

7 V < (V

) < 12 V;

not standby mode

1.0

5.0

diff(hys)

differential input hysteresis

see Fig.5

150

HIGH-level output voltage
(pin 4)

100

0.8V

LOW-level output voltage (pin 4) I

= 1 mA

0.2V

= 10 mA

1.5

CANH, CANL input resistance

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

Note

1. I

= I

= 0 mA; 0 V < V

< V

; 0 V < V

< V

; V

= V

diff

differential input resistance

100

CANH, CANL input capacitance

diff

differential input capacitance

Reference output

ref

reference output voltage

= 1 V;

A < I

< 50

0.45V

0.55V

= 4 V;

A < I

< 5

0.4V

0.6V

Timing (see Figs 4, 6 and 7)

bit

minimum bit time

= 1 V

onTXD

delay TXD to bus active

= 1 V

offTXD

delay TXD to bus inactive

= 1 V

onRXD

delay TXD to receiver active

= 1 V

120

offRXD

delay TXD to receiver inactive

= 1 V; V

< 5.1 V;

amb

< +85

150

= 1 V; V

< 5.1 V;

amb

< +125

170

= 1 V; V

< 5.5 V;

amb

< +85

170

= 1 V; V

< 5.5 V;

amb

< +125

190

onRXD

delay TXD to receiver active

= 47 k

390

520

= 24 k

260

320

offRXD

delay TXD to receiver inactive

= 47 k

260

450

= 24 k

210

320

differential output voltage slew
rate

= 47 k

WAKE

wake-up time from standby
(via pin 8)

dRXDL

bus dominant to RXD LOW

= 4 V; standby mode

Standby/slope control (pin 8)

input voltage for high-speed

0.3V

input current for high-speed

= 0 V

500

stb

input voltage for standby mode

0.75V

slope

slope control mode current

200

slope

slope control mode voltage

0.4V

0.6V

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

UNIT

max.

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

5.0
4.8

4.0
3.8

1.27

6.2
5.8

1.05

0.7
0.6

0.7
0.3

8
0

0.25

0.1

0.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0
0.4

SOT96-1

detail X

(A )

pin 1 index

076E03

MS-012

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.20
0.19

0.16
0.15

0.050

0.244
0.228

0.028
0.024

0.028
0.012

0.01

0.041

0.004

0.039
0.016

2.5

5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

97-05-22
99-12-27

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

SOLDERING

Introduction

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

OLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

ANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Surface mount packages

EFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

AVE SOLDERING

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

ANUAL SOLDERING

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

suitable

(2)

suitable

Surface mount

BGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS

not suitable

(3)

suitable

PLCC

(4)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

SSOP, TSSOP, VSO

not recommended

(6)

suitable

2000 Jan 13

Philips Semiconductors

Product specification

CAN controller interface

PCA82C250

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately
indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors
has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing,
handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in
which the die is used.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Š Philips Electronics N.V.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000

Philips Semiconductors a worldwide company

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Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands

285002/05/pp

Date of release:

2000 Jan 13

Document order number:

9397 750 06609

Part Number PCA82C250