DS90CR211/DS90CR212
21-Bit Channel Link
General Description
The DS90CR211 transmitter converts 21 bits of CMOS/TTL
data into three LVDS (Low Voltage Differential Signaling)
data streams. A phase-locked transmit clock is transmitted in
parallel with the data streams over a fourth LVDS link. Every
cycle of the transmit clock 21 bits of input data are sampled
and transmitted. The DS90CR212 receiver converts the
LVDS data streams back into 21 bits of CMOS/TTL data. At
a transmit clock frequency of 40 MHz, 21 bits of TTL data are
transmitted at a rate of 280 Mbps per LVDS data channel.
Using a 40 MHz clock, the data throughput is 840
Mbit/s(105 Mbyte/s).
The multiplexing of the data lines provides a substantial
cable reduction. Long distance parallel single-ended buses
typically require a ground wire per active signal (and have
very limited noise rejection capability). Thus, for a 21-bit wide
data bus and one clock, up to 44 conductors are required.
With the Channel Link chipset as few as 9 conductors (3
data pairs, 1 clock pair and a minimum of one ground) are
needed. This provides a 80% reduction in required cable
width, providing a system cost savings, reduces connector
physical size, and reduces shielding requirements due to the
cables smaller form factor.
The 21 CMOS/TTL inputs can support a variety of signal
combinations. For example, 5 4-bit nibbles plus 1 control, or
2 9-bit (byte + parity) and 3 control.
Features
n
Narrow bus reduces cable size and cost
n
±
1V Common mode range (ground shifting)
n
290 mV swing LVDS data transmission
n
840 Mbit/s data throughput
n
Low swing differential current mode drivers reduce EMI
n
Rising edge data strobe
n
Power down mode
n
Offered in low profile 48-lead TSSOP package
Block Diagrams
TRI-STATE
®
is a registered trademark of National Semiconductor Corporation.
DS90CR211
DS012637-27
Order Number DS90CR211MTD
See NS Package Number MTD48
DS90CR212
DS012637-1
Order Number DS90CR212MTD
See NS Package Number MTD48
July 1997
DS90CR21
1/DS90CR212
21-Bit
Channel
Link
© 1998 National Semiconductor Corporation
DS012637
www.national.com
Connection Diagrams
Typical Application
DS90CR211
DS012637-2
DS90CR212
DS012637-3
DS012637-19
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2
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
)
-0.3V to +6V
CMOS/TTL Input Voltage
-0.3V to (V
CC
+ 0.3V)
CMOS/TTL Ouput Voltage
-0.3V to (V
CC
+ 0.3V)
LVDS Receiver Input Voltage
-0.3V to (V
CC
+ 0.3V)
LVDS Driver Output Voltage
-0.3V to (V
CC
+ 0.3V)
LVDS Output
Short Circuit Duration
continuous
Junction Temperature
+150°C
Storage Temperature Range
-65°C to +150°C
Lead Temperature
(Soldering, 4 sec.)
+260°C
Maximum Power Dissipation
@
+25°C
MTD48 (TSSOP) Package:
DS90CR211
1.98W
DS90CR212
1.89W
Package Derating:
DS90CR211
16 mW/°C above +25°C
DS90CR212
15 mW/°C above +25°C
This device does not meet 2000V ESD rating (Note 4) .
Recommended Operating
Conditions
Min
Max
Units
Supply Voltage (V
CC
)
4.5
5.5
V
Operating Free Air Temperature (T
A
)
-10
+70
°C
Receiver Input Range
0
2.4
V
Supply Noise Voltage (V
CC
)
100
mV
PP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
CMOS/TTL DC SPECIFICATIONS
V
IH
High Level Input Voltage
2.0
V
CC
V
V
IL
Low Level Input Voltage
GND
0.8
V
V
OH
High Level Output Voltage
I
OH
= -0.4 mA
3.8
4.9
V
V
OL
Low Level Output Voltage
I
OL
= 2 mA
0.1
0.3
V
V
CL
Input Clamp Voltage
I
CL
= -18 mA
-0.79
-1.5
V
I
IN
Input Current
V
IN
= V
CC
, GND, 2.5V or 0.4V
±
5.1
±
10
µA
I
OS
Output Short Circuit Current
V
OUT
= 0V
-120
mA
LVDS DRIVER DC SPEClFlCATIONS
V
OD
Differential Output Voltage
R
L
= 100
250
290
450
mV
V
OD
Change in V
OD
between
35
mV
Complementary Output States
V
CM
Common Mode Voltage
1.1
1.25
1.375
V
V
CM
Change in V
CM
between
35
mV
Complementary Output States
I
OS
Output Short Circuit Current
V
OUT
= 0V, R
L
= 100
-2.9
-5
mA
I
OZ
Output TRI-STATE
®
Current
Power Down = 0V, V
OUT
= 0V or V
CC
±
1
±
10
µA
LVDS RECEIVER DC SPECIFlCATIONS
V
TH
Differential Input High Threshold
V
CM
= +1.2V
+100
mV
V
TL
Differential Input Low Threshold
-100
mV
I
IN
Input Current
V
IN
= +2.4V
V
CC
= 5.5V
<
±
1
±
10
µA
V
IN
= 0V
<
±
1
±
10
µA
TRANSMITTER SUPPLY CURRENT
I
CCTW
Transmitter Supply Current,
Worst Case
R
L
= 100
, C
L
= 5 pF,
Worst Case Pattern
(
Figure 1, Figure 2)
f = 32.5 MHz
34
51
mA
f = 37.5 MHz
36
53
mA
I
CCTZ
Transmitter Supply Current,
Power Down
Power Down = Low
1
25
µA
RECEIVER SUPPLY CURRENT
I
CCRW
Receiver Supply Current,
Worst Case
C
L
= 8 pF,
Worst Case Pattern
(
Figure 1, Figure 3)
f = 32.5 MHz
55
75
mA
f = 37.5 MHz
60
80
mA
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3
Electrical Characteristics
(Continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Units
RECEIVER SUPPLY CURRENT
I
CCRZ
Receiver Supply Current,
Power Down
Power Down = Low
1
10
µA
Note 1: "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of "Electrical Characteristics" specify conditions for device operation.
Note 2: Typical values are given for V
CC
= 5.0V and T
A
= +25°C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise speci-
fied (except V
OD
and
V
OD
).
Note 4: ESD Rating:
HBM (1.5 k
, 100 pF)
PLL V
CC
1000V
All other pins
2000V
EIAJ (0
, 200 pF)
150V
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
LLHT
LVDS Low-to-High Transition Time (
Figure 2)
0.75
1.5
ns
LHLT
LVDS High-to-Low Transition Time (
Figure 2)
0.75
1.5
ns
TCIT
TxCLK IN Transition Time (
Figure 4)
8
ns
TCCS
TxOUT Channel-to-Channel Skew (Note 5) (
Figure 5)
350
ps
TPPos0
Transmitter Output Pulse Position for Bit0 (
Figure 16)
f = 20 MHz
-200
150
350
ps
TPPos1
Transmitter Output Pulse Position for Bit1
6.3
7.2
7.5
ns
TPPos2
Transmitter Output Pulse Position for Bit2
12.8
13.6
14.6
ns
TPPos3
Transmitter Output Pulse Position for Bit3
20
20.8
21.5
ns
TPPos4
Transmitter Output Pulse Position for Bit4
27.2
28
28.5
ns
TPPos5
Transmitter Output Pulse Position for Bit5
34.5
35.2
35.6
ns
TPPos6
Transmitter Output Pulse Position for Bit6
42.2
42.6
42.9
ns
TPPos0
Transmitter Output Pulse Position for Bit0 (
Figure 16)
f = 40 MHz
-100
100
300
ps
TPPos1
Transmitter Output Pulse Position for Bit1
2.9
3.3
3.9
ns
TPPos2
Transmitter Output Pulse Position for Bit2
6.1
6.6
7.1
ns
TPPos3
Transmitter Output Pulse Position for Bit3
9.7
10.2
10.7
ns
TPPos4
Transmitter Output Pulse Position for Bit4
13
13.5
14.1
ns
TPPos5
Transmitter Output Pulse Position for Bit5
17
17.4
17.8
ns
TPPos6
Transmitter Output Pulse Position for Bit6
20.3
20.8
21.4
ns
TCIP
TxCLK IN Period (
Figure 6)
25
T
50
ns
TCIH
TxCLK IN High Time (
Figure 6)
0.35T
0.5T
0.65T
ns
TCIL
TxCLK IN Low Time (
Figure 6)
0.35T
0.5T
0.65T
ns
TSTC
TxIN Setup to TxCLK IN (
Figure 6)
f = 20 MHz
14
ns
f = 40 MHz
8
ns
THTC
TxIN Hold to TxCLK IN (
Figure 6)
2.5
2
ns
TCCD
TxCLK IN to TxCLK OUT Delay
@
25°C, V
CC
= 5.0V (Figure 8)
5
9.7
ns
TPLLS
Transmitter Phase Lock Loop Set (
Figure 10)
10
ms
TPDD
Transmitter Powerdown Delay (
Figure 14)
100
ns
Note 5: This limit based on bench characterization.
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4
Receiver Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol
Parameter
Min
Typ
Max
Units
CLHT
CMOS/TTL Low-to-High Transition Time (
Figure 3)
3.5
6.5
ns
CHLT
CMOS/TTL High-to-Low Transition Time (
Figure 3)
2.7
6.5
ns
RCOP
RxCLK OUT Period (
Figure 7)
25
T
50
ns
RSKM
Receiver Skew Margin (Note 6)
f = 20 MHz
1.1
ns
V
CC
= 5V, T
A
= 25°C (Figure 17)
f = 40 MHz
700
ps
RCOH
RxCLK OUT High Time (
Figure 7)
f = 20 MHz
19
ns
f = 40 MHz
6
ns
RCOL
RxCLK OUT Low Time (
Figure 7)
f = 20 MHz
21.5
ns
f = 40 MHz
10.5
ns
RSRC
RxCLK Setup to RxCLK OUT (
Figure 7)
f = 20 MHz
14
ns
f = 40 MHz
4.5
ns
RHRC
RxCLK Hold to RxCLK OUT (
Figure 7)
f = 20 MHz
16
ns
f = 40 MHz
6.5
ns
RCCD
RxCLK IN to RxCLK OUT Delay
@
25°C, V
CC
= 5.0V (Figure 9)
7.6
11.9
ns
RPLLS
Receiver Phase Lock Loop Set (
Figure 11)
10
ms
RPDD
Receiver Powerdown Delay (
Figure 15)
1
µs
Note 6: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account for transmitter output skew(TCCS)
and the setup and hold time (internal data sampling window), allowing LVDS cable skew dependent on type/length and source clock(TxCLK IN) jitter.
RSKM
cable skew (type, length) + source clock jitter (cycle to cycle).
AC Timing Diagrams
DS012637-4
FIGURE 1. "WORST CASE" Test Pattern
DS012637-5
DS012637-6
FIGURE 2. DS90CR211 (Transmitter) LVDS Output Load and Transition Timing
DS012637-7
DS012637-8
FIGURE 3. DS90CR212 (Receiver) CMOS/TTL Output Load and Transition Timing
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