Conclusion

The MAX5309 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality
and reliability standards.

Table of Contents

I. ........Device Description

V. ........Quality Assurance Information

II. ........Manufacturing Information

VI. .......Reliability Evaluation

III. .......Packaging Information

IV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX5309 is a10-bit, eight channel, low-power, voltage-output, digital-to-analog converters (DAC) in a space-
saving 16-pin TSSOP package. The wide +2.7V to +5.5V supply voltage range and less than 215µA (max) supply
current per DAC is excellent for low-power and low-voltage applications. The low 2nV-s glitch energy of the MAX5309
makes it ideal for digital control of fast-response, closed-loop systems.

The MAX5309 has a hardware reset input (CLR-bar) which clears all registers and DACs to zero. The MAX5309 has
a software shutdown feature that reduces the supply current to 1µA. The MAX5308 features a load DAC (LDAC-bar)
function that updates the output of all eight DACs simultaneously.

The 3-wire SPITM, QSPITM, MICROWIRETM and DSP-compatible serial interface allows the input and DAC registers
to be updated independently or simultaneously with a single software command. This device uses a double-buffered
design to minimize the digital-noise feedthrough from the digital inputs to the outputs. The MAX5309 operating
temperature range is from -40°C to +85°C

B. Absolute Maximum Ratings

Item

Rating

VDD to GND

-0.3V to +6V

All Other Pins to GND

-0.3V to (VDD + 0.3V)

Maximum Current Into Any Pin

±50mA

Operating Temperature Range

-40°C to +85°C

Junction Temperature

+150°C

Storage Temperature Range

-65°C to +150°C

Lead Temperature (soldering, 10s) +300°C
Continuous Power Dissipation (TA = +70°C)
16-Pin TSSOP

775mW

Derates above +70°C

16-Pin TSSOP

9.4mW/°C

II. Manufacturing Information

A. Description/Function:

Low-Power, Low-Glitch, Octal 10-Bit Voltage-Output DACs with Serial Interface

B. Process:

S6 (Standard 0.6 micron silicon gate CMOS)

C. Number of Device Transistors:

19,000

D. Fabrication Location: California, USA

E. Assembly Location:

Malaysia or Thailand

F. Date of Initial Production:

July, 2001

III. Packaging Information

A. Package Type:

16-Pin TSSOP

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-Filled Epoxy

E. Bondwire:

Gold (1 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

#05-3901-0002

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-020-A: Level 1

IV. Die Information

A. Dimensions:

102 x 141 mils

B. Passivation:

/SiO

(Silicon nitride/ Silicon dioxide)

C. Interconnect:

Aluminum/Si (Si = 1%)

D. Backside Metallization:

None

E. Minimum Metal Width:

0.6 microns (as drawn)

F. Minimum Metal Spacing:

0.6 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

SiO

I. Die Separation Method:

Wafer Saw

V. Quality Assurance Information

A. Quality Assurance Contacts:

Jim Pedicord (Manager, Rel Operations)

Bryan Preeshl (Executive Director)

Kenneth Huening (Vice President)

B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135

C biased (static) life test are shown in Table 1. Using these results, the Failure

Rate (

) is calculated as follows:

= 1 = 1.83 (Chi square value for MTTF upper limit)

MTTF

192 x 4389 x 79 x 2

Temperature Acceleration factor assuming an activation energy of 0.8eV

= 13.75 x 10

-9

= 13.75 F.I.T. (60% confidence level @ 25

This low failure rate represents data collected from Maxim's reliability monitor program. In addition to

routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5814) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).

B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample

must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85

C/85%RH testing is done per generic device/package family once a quarter.

C. E.S.D. and Latch-Up Testing

The DB06

die type has been found to have all pins able to withstand a transient pulse of

1500V per Mil-

Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of

250mA.

Table 1

Reliability Evaluation Test Results

MAX5309EUE

TEST ITEM

TEST CONDITION

FAILURE

SAMPLE

NUMBER OF

IDENTIFICATION

PACKAGE

SIZE

FAILURES

Static Life Test (Note 1)

Ta = 135

DC Parameters

Biased

& functionality

Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot

Ta = 121

DC Parameters

TSSOP

P = 15 psi.

& functionality

RH= 100%

Time = 168hrs.

85/85

Ta = 85

DC Parameters

RH = 85%

& functionality

Biased

Time = 1000hrs.

Mechanical Stress (Note 2)

Temperature

-65

C/150

DC Parameters

Cycle

1000 Cycles

& functionality

Method 1010

Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data

Part Number MAX5309EUE