Conclusion

The MAX1555 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality
and reliability standards.

Table of Contents

I. ........Device Description

V. ........Quality Assurance Information

II. ........Manufacturing Information

VI. .......Reliability Evaluation

III. .......Packaging Information

IV. .......Die Information

......Attachments

I. Device Description

A. General

The MAX1555 charges a single-cell lithium-ion (Li+) battery from both USB* and AC adapter sources. It operates
with no external FETs or diodes, and accept operating input voltages up to 7V.

On-chip thermal limiting simplifies PC board layout and allows optimum charging rate without the thermal limits
imposed by worst-case battery and input voltage. When the MAX1551 thermal limits are reached, the charger does
not shut down, but progressively reduces charging current.

The MAX1555 includes a POK-bar output to indicate when input power is present. The MAX1555 features a CHG-bar
output to indicate charging.

With USB connected, but without DC power, charge current is set to 100mA (max). This allows charging from both
powered and unpowered USB hubs with no port communication required. When DC power is connected, charging
current is set at 280mA (typ). No input-blocking diodes are required to prevent battery drain.

The MAX1555 is available in 5-pin thin SOT23 packages and operates over a -40°C to +85°C range.

B. Absolute Maximum Ratings

Item

Rating

DC to GND

0 to +8V

DC to BAT

0 to +7V

BAT, CHG, POK, USB to GND

-0.3V to +7V

Operating Temperature Range

-40°C to +85°C

Junction Temperature Range

-40°C to +150°C

Storage Temperature Range

-65°C to +150°C

Lead Temperature (soldering, 10s)

+300°C

Continuous Power Dissipation (TA = +70°C)

5-Pin Thin SOT23

727mW

Derates above +70

5-Pin Thin SOT23

9.1mW/

II. Manufacturing Information

A. Description/Function:

SOT23 Dual-Input USB/AC Adapter 1-Cell Li+ Battery Charger

B. Process:

B8 - Standard 8 micron silicon gate CMOS

C. Number of Device Transistors:

541

D. Fabrication Location:

California, USA

E. Assembly Location:

Philippines

F. Date of Initial Production:

June, 2003

III. Packaging Information

A. Package Type:

5-Lead SOT23

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-filled Epoxy

E. Bondwire:

Gold (1.0 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

Buildsheet # 05-9000-0523

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1

IV. Die Information

A. Dimensions:

59 X 40 mils

B. Passivation:

/SiO

(Silicon nitride/ Silicon dioxide)

C. Interconnect:

TiW/ AlCu/ TiWN

D. Backside Metallization:

None

E. Minimum Metal Width:

.8 microns (as drawn)

F. Minimum Metal Spacing:

.8 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

SiO

I. Die Separation Method:

Wafer Saw

V. Quality Assurance Information

A. Quality Assurance Contacts: Jim Pedicord

(Manager, Reliability Operations)

Bryan Preeshl (Executive Director of QA)

Kenneth Huening (Vice President)

B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135

C biased (static) life test are shown in Table 1. Using these results, the Failure

Rate (

) is calculated as follows:

= 1 = 1.83 (Chi square value for MTTF upper limit)

MTTF

192 x 4389 x 48 x 2

Temperature Acceleration factor assuming an activation energy of 0.8eV

= 22.62 x 10

-9

= 22.62 F.I.T. (60% confidence level @ 25

This low failure rate represents data collected from Maxim's reliability qualification and monitor programs.

Maxim also performs weekly Burn-In on samples from production to assure reliability of its processes. The
reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates
to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The
Burn-In Schematic (Spec.# 06-6146) shows the static circuit used for this test. Maxim also performs 1000 hour life
test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M) located
on the Maxim website at http://www.maxim-ic.com .

B. Moisture Resistance Tests

Maxim evaluates pressure pot stress from every assembly process during qualification of each new design.

Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85

C/85%RH or

HAST tests are performed quarterly per device/package family.

B. E.S.D. and Latch-Up

PN20-1 die type has been found to have all pins able to withstand a transient pulse of

1000V, per Mil-Std-

883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a
current of

250mA.

Table 1

Reliability Evaluation Test Results

MAX1555EZK

TEST ITEM

TEST CONDITION

FAILURE

SAMPLE

NUMBER OF

IDENTIFICATION

SIZE

FAILURES

Static Life Test (Note 1)

Ta = 135

DC Parameters

Biased

& functionality

Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot

Ta = 121

DC Parameters

P = 15 psi.

& functionality

RH= 100%

Time = 168hrs.

85/85

Ta = 85

DC Parameters

RH = 85%

& functionality

Biased

Time = 1000hrs.

Mechanical Stress (Note 2)

Temperature

-65

C/150

DC Parameters

Cycle

1000 Cycles

& functionality

Method 1010

Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic process/package data

Part Number MAX1555EZK