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Part Number DS1558

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091202
Note: Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple revisions of any device
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http://www.maxim-ic.com/errata
.





FEATURES
§ Integrated real-time clock (RTC), power-fail
control circuit, and NV RAM controller
§ Clock registers are accessed identically to the
static RAM; these registers are resident in the
16 top RAM locations
§ Century register
§ Greater than 10 years of timekeeping and data
retention in the absence of power with small
lithium coin cell(s) and low-leakage SRAM
§ Precision power-on reset
§ Programmable watchdog timer and RTC
alarm
§ BCD-coded year, month, date, day, hours,
minutes, and seconds with automatic leap-
year compensation valid up to the year 2100
§ Battery voltage-level indicator flag
§ Power-fail write protection allows for
±
10%
V
CC
power-supply tolerance
§ Underwriters Laboratory (UL) recognized
ORDERING INFORMATION
PART
PIN-
PACKAGE
V
CC
(V)
TOP
MARK
DS1558Y
48 TQFP
5
DS1558B
DS1558W
48 TQFP
3.3
DS1558D


PIN ASSIGNMENT (Top View)











Package Dimension Information
http://www.maxim-ic.com/TechSupport/DallasPackInfo.htm
PIN DESCRIPTION
A0­A18
- Address Input
DQ0­DQ7
- Data Input/Outputs
IRQ
\FT
- Interrupt, Frequency-Test
Output (Open Drain)
RST
- Power-On Reset Output
(Open Drain)
CE
- Chip-Enable Input
CER
- Chip-Enable RAM
OE
- Output-Enable Input
OER
- Output-Enable RAM
WE
- Write Enable
V
CC
- Power-Supply Input
V
CCO
- V
CC
Out to RAM
GND
- Ground
N.C.
- No Connection
X1, X2
- Crystal Connection
V
BAT1
- +3V Battery Input
V
BAT2
- +3V Battery Input
DS1558
Watchdog Clock with
NV RAM Control
www.maxim-ic.com
www.maxim-ic.com
A18
A16
A12
A6
A4
A3
A2
A1
A5
A7
A14
N.C.
VCCO
1
2
3
4
5
6
7
8
10
12
35
36
VCC
N.C.
A17
GND
RST
NC
N.C.
DQ0
DQ1 DQ
2
DQ6
VBAT1
WE
IRQ/FT
A8
OE
A10
CE
X1
GND
VBAT
2
A15
A13
OER
A9
A11
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
11
9
48 47
46 45 44 43
42 41 40 39
38 37
CER
DQ7
DQ5
DQ4
DQ3
GND
A0
DS1558
X2
N.C.
48-Pin TQFP
DS1558
2 of 18
TYPICAL OPERATING CIRCUIT
DESCRIPTION
The DS1558 is a full function, year 2000-compliant (Y2KC), real-time clock/calendar with an RTC
alarm, watchdog timer, power-on reset, battery monitor, and NV SRAM controller. User access to all
registers within the DS1558 is accomplished with a byte-wide interface as shown in Figure 1. The RTC
registers contain century, year, month, date, day, hours, minutes, and seconds data in 24-hour BCD
format. Corrections for day of month and leap year are made automatically.
The DS1558 maps the RTC registers into the SRAM address space and constantly monitors A0­A18.
When any of the upper 16 address locations are accessed, the DS1558 inhibits
CER
and
OER
to the
SRAM, and redirects reads and writes to the RTC registers within the DS1558. The DS1558 can be used
with SRAMs up to 524,272 addresses. Smaller SRAMs can be used, provided that the unused upper
address lines on the DS1558 are connected to V
CC
.
The RTC registers are double-buffered into an internal and external set. The user has direct access to the
external set. Clock/calendar updates to the external set of registers can be disabled and enabled to allow
the user to access static data. Assuming the internal oscillator is turned on, the internal set of registers is
continuously updated; this occurs regardless of external register settings to guarantee that accurate RTC
information is always maintained.
The DS1558 has interrupt (
IRQ
/FT) and reset (
RST
) outputs that can be used to control CPU activity.
The
IRQ
/FT interrupt output can be used to generate an external interrupt when the RTC register values
match user-programmed alarm values. The interrupt is always available while the device is powered from
the system supply, and it can be programmed to occur when in the battery-backed state to serve as a
system wake-up. The
IRQ
/FT output can also be used as a CPU watchdog timer. CPU activity is
monitored and an interrupt or reset output are activated if the correct activity is not detected within
DS1558
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programmed limits. The DS1558 power-on reset can be used to detect a system power-down or failure
and hold the CPU in a safe reset state until normal power returns and stabilizes; the
RST
output is used
for this function.
The DS1558 also contains its own power-fail circuitry, which automatically protects the data in the clock
and SRAM against out-of-tolerance V
CCI
conditions by inhibiting the
CE
input when the V
CC
supply
enters an out-of-tolerance condition. When V
CCI
goes below the level of V
BAT
, the external battery is
switched on to supply energy to the clock and the external SRAM. This feature provides a high degree of
data security during unpredictable system operation brought on by low V
CC
levels.
Figure 1. BLOCK DIAGRAM
Note: Any unused upper address pins must be connected to V
CC
to properly address the RTC.
SIGNAL DESCRIPTIONS
A0­A18 ­ Address inputs for address decode. The DS1558 uses the address inputs to determine whether
or not a read or write cycle should be directed to the attached SRAM or to the RTC registers.
DQ0­DQ7 ­ Data input/output pins for the RTC registers.
IRQ
/FT ­ This pin is used to output the alarm interrupt or the frequency test signal. It is open drain and
requires an external pullup resistor.
DS1558
4 of 18
RST
­ This pin is an output used to signal that V
CC
is out of tolerance. On power-up,
RST
is held low for
a period of time to allow the system to stabilize. The RTC and SRAM are not accessible while
RST
is
active. This pin is open drain and requires an external pullup resistor.
CE
­ Chip-enable input that is used to access the RTC and the external SRAM.
CER
­ Chip-enable RAM output.
CE
is passed through to
CER
, with an added propagation delay. When
the signals on A0­A18 match an RTC address,
CER
is held high, disabling the SRAM. If
OE
is also low,
the RTC outputs data on DQ0­DQ7.
OE
­ Output-enable input that is used to access the RTC and the external SRAM.
OER
­ Output-enable RAM output.
OE
is passed through to
OER
, with an added propagation delay.
When the signals on A0­A18 match an RTC address,
CER
is held high, disabling the SRAM. If
CE
is
also low, the RTC outputs data on DQ0­DQ7.
WE
­ Write-enable input that is used to write data to the RTC registers.
V
CC
, GND ­ DC power is provided to the device on these pins. V
CC
is the +5V input. When 5V (or 3.3V
for the 3.3V version) is applied within normal limits, the device is fully accessible and data can be written
and read. Reads and writes are inhibited when a 3V battery is connected to the device and V
CC
is V
TP
.
However, the timekeeping function continues unaffected by the lower input voltage. As V
CC
falls below
V
BAT
, the RAM and RTC are switched over to the external power supply (nominal 3.0V DC) at V
BAT
.
V
CCO
­ V
CC
output to RAM. While V
CC
is above V
BAT
, the external SRAM is powered by V
CC
. When
V
CC
is below the battery level, the SRAM is powered by one of the V
BAT
inputs.
N.C. ­ No internal connection.
X1, X2 ­ Connections for a standard 32.768kHz quartz crystal. The internal oscillator circuitry is
designed for operation with a crystal having a specified load capacitance (C
L
) of 6pF. For more
information about crystal selection and crystal layout considerations, refer to Application Note 58
"Crystal Considerations with Dallas Real-Time Clocks." The DS1558 can also be driven by an external
32.768kHz oscillator. In this configuration, the X1 pin is connected to the external oscillator signal and
the X2 pin is floated.
V
BAT1
, V
BAT2
­ Battery inputs for any standard 3V lithium cell or other energy source. Battery voltage
must be held between 2.5V and 3.7V for proper operation. UL recognized to ensure against reverse
charging current when used with a lithium battery. If only one battery is used, it should be attached to
V
BAT1
, and V
BAT2
should be grounded.
See "Conditions of Acceptability" at
http://www.maxim-ic.com/TechSupport/QA/ntrl.htm
.
DS1558
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Table 1. OPERATING MODES
V
CC
CE
OE
WE
DQ0­DQ7
MODE
POWER
V
IH
X
X
High-Z
Deselect
Standby
V
IL
X
V
IL
D
IN
Write
Active
V
IL
V
IL
V
IH
D
OUT
Read
Active
V
CC
> V
PF
V
IL
V
IH
V
IH
High-Z
Read
Active
V
SO
< V
CC
< V
PF
X
X
X
High-Z
Deselect
CMOS Standby
V
CC
< V
SO
< V
PF
X
X
X
High-Z
Data Retention
Battery Current
DATA READ MODE
The DS1558 is in the read mode whenever
CE
is low and
WE
is high. The device architecture allows
ripple-through access to any valid address location. Valid data is available at the DQ pins within t
AA
after
the last address input is stable, provided that
CE
and
OE
access times are satisfied. If
CE
or
OE
access
times are not met, valid data is available at the latter of chip-enable access (t
CEA
) or at output-enable
access time (t
OEA
). The state of the data input/output pins (DQ) is controlled by
CE
and
OE
. If the
outputs are activated before t
AA
, the data lines are driven to an intermediate state until t
AA
. If the address
inputs are changed while
CE
and
OE
remain valid, output data remains valid for output-data hold time
(t
OH
), but then goes indeterminate until the next address access.
DATA WRITE MODE
The DS1558 is in the write mode whenever
WE
and
CE
are in their active state. The start of a write is
referenced to the latter occurring transition of
WE
or
CE
. The addresses must be held valid throughout
the cycle.
CE
and
WE
must return inactive for a minimum of t
WR
prior to the initiation of a subsequent
read or write cycle. Data in must be valid t
DS
prior to the end of the write and remain valid for t
DH
afterward. In a typical application, the
OE
signal is high during a write cycle. However,
OE
can be active
provided that care is taken with the data bus to avoid bus contention. If
OE
is low prior to
WE
transitioning low, the data bus can become active with read data defined by the address inputs. A low
transition on
WE
then disables the outputs t
WEZ
after
WE
goes active.
DATA RETENTION MODE
The 5V device is fully accessible and data can be written and read only when V
CC
is greater than V
PF
.
However, when V
CC
is below the power-fail point V
PF
(point at which write protection occurs), the
internal clock registers and SRAM are blocked from any access. When V
CC
falls below the battery switch
point V
SO
(battery supply level), device power is switched from the V
CC
pin to the backup battery. RTC
operation and SRAM data are maintained from the battery until V
CC
is returned to nominal levels.
The 3.3V device is fully accessible and data can be written and read only when V
CC
is greater than V
PF
.
When V
CC
falls below V
PF
, access to the device is inhibited. If V
PF
is less than V
SO
, the device power is
switched from V
CC
to the internal backup lithium battery when V
CC
drops below V
PF
. If V
PF
is greater
than V
SO
, the device power is switched from V
CC
to the internal backup lithium battery when V
CC
drops
below V
SO
. RTC operation and SRAM data are maintained from the battery until V
CC
is returned to
nominal levels.
All control, data, and address signals must be powered down when V
CC
is powered down.
DS1558
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BATTERY LONGIVITY
The battery lifetime is dependent on the RAM battery standby current and the DS1558 internal clock
oscillator current. The total battery current is I
OSC
+ I
CCO
. When V
CC
is above V
PF
, I
BAT
current is less than
50nA. The DS1558 has an internal circuit to prevent battery charging. No external protection components
are required, and none should be used. The DS1558 has two battery pins that operate independently; the
DS1558 selects the higher of the two inputs. If only one battery is used, the battery should be attached to
V
BAT1
, and V
BAT2
should be grounded.
INTERNAL BATTERY MONITOR
The DS1558 constantly monitors the battery voltage of the internal battery. The battery-low flag (BLF)
bit of the flags register (B4 of 7FFF0h) is not writable and should always be a 0 when read. If a 1 is ever
present, both battery inputs are below 1.8V and both the contents of the RTC and RAM are questionable.
POWER-ON RESET
A temperature-compensated comparator circuit monitors the level of V
CC
. When V
CC
falls to the power-
fail trip point, the
RST
signal (open drain) is pulled low. When V
CC
returns to nominal levels, the
RST
signal continues to be pulled low for a period of 40ms to 200ms. The power-on reset function is
independent of the RTC oscillator and thus is operational whether or not the oscillator is enabled.
DS1558
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CLOCK OPERATIONS
Table 2 and the following paragraphs describe the operation of the RTC, alarm, and watchdog functions.
Table 2. DS1558 REGISTER MAP
DATA
ADDRESS
B
7
B
6
B
5
B
4
B
3
B
2
B
1
B
0
FUNCTION/RANGE
7FFFFh
10 YEAR
YEAR
YEAR
00­99
7FFFEh
X
X
X
10 M
MONTH
MONTH
01­12
7FFFDh
X
X
10 DATE
DATE
DATE
01­31
7FFFCh
X
FT
X
X
X
DAY
DAY
01­07
7FFFBh
X
X
10 HOUR
HOUR
HOUR
00­23
7FFFAh
X
10 MINUTES
MINUTES
MINUTES
00­59
7FFF9h
OSC
10 SECONDS
SECONDS
SECONDS
00­59
7FFF8h
W
R
10 CENTURY
CENTURY
CONTROL
00­39
7FFF7h
WDS
BMB4
BMB3
BMB2
BMB1
BMB0
RB1
RB0
WATCHDOG
--
7FFF6h
AE
Y
ABE
Y
Y
Y
Y
Y
INTERRUPTS
--
7FFF5h
AM4
Y
10 DATE
DATE
ALARM DATE
01­31
7FFF4h
AM3
Y
10 HOURS
HOURS
ALARM HOURS
00­23
7FFF3h
AM2
10 MINUTES
MINUTES
ALARM MINUTES
00­59
7FFF2h
AM1
10 SECONDS
SECONDS
ALARM SECONDS
00­59
7FFF1h
Y
Y
Y
Y
Y
Y
Y
Y
UNUSED
--
7FFF0h
WF
AF
0
BLF
0
0
0
0
FLAGS
--
X = Unused, Read/Writeable Under Write and Read Bit Control
AE = Alarm Flag Enable
FT = Frequency Test Bit
Y = Unused, Read/Writeable Without Write and Read Bit Control
OSC = Oscillator Start/Stop Bit
ABE = Alarm in Backup-Battery Mode Enable
W = Write Bit
AM1­AM4 = Alarm Mask Bits
R = Read Bit
WF = Watchdog Flag
WEN = Watchdog Enable Bit
AF = Alarm Flag
BMB0­BMB4 = Watchdog Multiplier Bits
0 = Reads as a 0 and Cannot Be Changed
RB0­RB1 = Watchdog Resolution Bits
BLF = Battery Low Flag
CLOCK OSCILLATOR CONTROL
The oscillator can be turned off to minimize current drain from the battery. The
OSC
bit is the MSB of
the seconds register (B7 of 7FFF9h). Setting
OSC
to a 1 stops the oscillator; setting to a 0 starts the
oscillator. The initial state of
OSC
is not guaranteed. When power is applied for the first time, the
OSC
bit should be enabled. Oscillator operation and frequency can be verified by setting the FT bit and
monitoring the
IRQ
/FT pin for 512Hz.
OSCILLATOR STARTUP TIME
Oscillator startup times are highly dependent upon crystal characteristics and layout. High ESR and
excessive capacitive loads are the major contributors to long startup times. A circuit using a crystal with
the recommended characteristics and following the recommended layout usually starts within 1 second.
DS1558
8 of 18
READING THE CLOCK
When reading the RTC data, it is recommended to halt updates to the external set of double-buffered
RTC registers. This puts the external registers into a static state, allowing data to be read without register
values changing during the read process. Normal updates to the internal registers continue while in this
state. External updates are halted when a 1 is written into the read bit, B6 of the control register
(7FFF8h). As long as a 1 remains in the control register read bit, updating is halted. After a halt is issued,
the registers reflect the RTC count (day, date, and time) that was current at the moment the halt command
is issued. Normal updates to the external set of registers resume within 1 second after the read bit is set to
a 0 for a minimum of 500
ms. The read bit must be a 0 for a minimum of 500ms to ensure the external
registers are updated.
SETTING THE CLOCK
The MSB bit, B7, of the control register is the write bit. Setting the write bit to a 1, like the read bit, halts
updates to the 7FFF8h­7FFFFh registers. After setting the write bit to a 1, RTC registers can be loaded
with the desired RTC count (day, date, and time) in 24-hour BCD format. Setting the write bit to a 0 then
transfers the values written to the internal RTC registers and allows normal operation to resume.
CLOCK ACCURACY
The accuracy of the clock is dependent upon the accuracy of the crystal and the accuracy of the match
between the capacitive load of the oscillator circuit and the capacitive load for which the crystal was
trimmed. Additional error is added by the crystal-frequency drift caused by temperature shifts. External
circuit noise coupled into the oscillator circuit can result in the clock running fast. Refer to Application
Note 58
"Crystal Considerations with Dallas Real-Time Clocks" for detailed information.
FREQUENCY TEST MODE
The DS1558 frequency test mode uses the open-drain
IRQ
/FT output. With the oscillator running, the
IRQ
/FT output toggles at 512Hz when the FT bit is a 1, the alarm-flag enable bit (AE) is a 0, and the
watchdog-enable bit (WDS) is a 1, or the watchdog register is reset (register 7FFF7h = 00h). The
IRQ
/FT
output and the frequency test mode can be used as a measure of the actual frequency of the 32.768kHz
RTC oscillator. The
IRQ
/FT pin is an open-drain output that requires a pullup resistor for proper
operation. The FT bit is cleared to a 0 on power-up.
USING THE CLOCK ALARM
The alarm settings and control for the DS1558 reside within registers 7FFF2h­7FFF5h. Register 7FFF6h
contains two alarm-enable bits: alarm enable (AE) and alarm in backup enable (ABE). The AE and ABE
bits must be set as described below for the
IRQ
/FT output to be activated for a matched alarm condition.
The alarm can be programmed to activate on a specific day of the month or repeat every day, hour,
minute, or second. It can also be programmed to go off while the DS1558 is in the battery-backed state of
operation to serve as a system wake-up. Alarm mask bits AM1­AM4 control the alarm mode. Table 3
shows the possible settings. Configurations not listed in the table default to the once-per-second mode to
notify the user of an incorrect alarm setting.
DS1558
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Table 3. ALARM MASK BITS
AM4
AM3
AM2
AM1
ALARM RATE
1
1
1
1
Once per second
1
1
1
0
When seconds match
1
1
0
0
When minutes and seconds match
1
0
0
0
When hours, minutes, and seconds match
0
0
0
0
When date, hours, minutes, and seconds match
When the RTC register values match alarm register settings, AF is set to a 1. If AE is also set to a 1, the
alarm condition activates the
IRQ
/FT pin. The
IRQ
/FT signal is cleared by a read or write to the flags
register (address 7FFF0h). When
CE
is active, the
IRQ
/FT signal can be cleared by having the address
stable for as short as 15ns and either
OE
or
WE
active, but is not guaranteed to be cleared unless t
RC
is
fulfilled (Figure 2). Once the address has been selected for at least 15ns, the
IRQ
/FT signal can be cleared
immediately, but is not guaranteed to be cleared until t
RC
is fulfilled (Figure 3). The alarm flag is also
cleared by a read or write to the flags register, but the flag does not change states until the end of the
read/write cycle and the
IRQ
/FT signal has been cleared.
The
IRQ
/FT pin can also be activated in the battery-backed mode. The
IRQ
/FT goes low if an alarm
occurs and both ABE and AE are set. The ABE and AE bits are cleared during the power-up transition,
but an alarm generated during power-up sets AF. Therefore, the AF bit can be read after system power-up
to determine if an alarm was generated during the power-up sequence. Figure 4 illustrates alarm timing
during the backup-battery mode and power-up states.
Figure 2. CLEARING IRQ WAVEFORMS ACTIVE
Figure 3. CLEARING IRQ WAVEFORMS
DS1558
10 of 18
Figure 4. BACKUP MODE ALARM WAVEFORMS
USING THE WATCHDOG TIMER
The watchdog timer can be used to detect an out-of-control processor. The user programs the watchdog
timer by setting the desired amount of timeout into the 8-bit watchdog register (address 7FFF7h). The
five watchdog register bits BMB4­BMB0 store a binary multiplier and the two lower-order bits
RB1­RB0 select the resolution, where 00 = 1/16 second, 01 = 1/4 second, 10 = 1 second, and
11 = 4 seconds. The watchdog timeout value is then determined by the multiplication of the 5-bit
multiplier value with the 2-bit resolution value. (For example: writing 00001110 in the watchdog register
= 3 x 1 second or 3 seconds.) If the processor does not reset the timer within the specified period, the
watchdog flag (WF) is set and a processor interrupt is generated and stays active until either WF is read
or the watchdog register (7FFF7h) is read or written.
The MSB of the watchdog register is the watchdog steering bit (WDS). When set to a 0, the watchdog
activates the
IRQ
/FT output when the watchdog times out. WDS should not be written to a 1, and should
be initialized to a 0 if the watchdog function is enabled.
The watchdog timer resets when the processor performs a read or write of the watchdog register. The
timeout period then starts over. The watchdog timer is disabled by writing a value of 00h to the watchdog
register. The watchdog function is automatically disabled upon power-up and the watchdog register is
cleared.
POWER-ON DEFAULT STATES
Upon application of power to the device, the following register bits are set to a 0:
WDS = 0, BMB0­BMB4 = 0, RB0­RB1 = 0, AE = 0, and ABE = 0
All other bits are undefined.
DS1558
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ABSOLUTE MAXIMUM RATINGS*
Voltage Range on Any Pin Relative to Ground
-0.3V to +6.0V
Storage Temperature Range
-55
°C to +125°C
Soldering Temperature Range
See IPC/JEDEC J-STD-020A
*This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operation
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time can affect reliability.
RECOMMENDED DC OPERATING CONDITIONS
(V
CC
= 3.3V ±10% or 5V ±10%, T
A
= -40°C to +85°C)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Logic 1 Voltage (All Inputs)
V
CC
= +5V
±10%
V
IH
2.2
V
CC
+ 0.3V
V
1
V
CC
= +3.3V
±10%
V
IH
2.0
V
CC
+ 0.3V
V
1
Logic 0 Voltage (All Inputs)
V
CC
= +5V
±10%
V
IL
-0.3
+0.8
1
V
CC
= +3.3V
±10%
V
IL
-0.3
+0.6
1
Battery Voltage
V
BAT
2.5
3.3
3.7
V
DS1558
12 of 18
DC ELECTRICAL CHARACTERISTICS
(
V
CC
= +3.3V ±10% or +5V ±10%, T
A
= -40°C to +85°C)
PARAMETER
SYMBOL
MIN
TYP
MAX UNITS NOTES
Active Supply Current, +5V
I
CC
6
25
mA
2, 3
Active Supply Current, +3.3V
I
CC
4
15
mA
2, 3
TTL Standby, +5V (
CE
= V
IH
)
I
CC1
3
6
mA
2, 3
TTL Standby, +3.3V (
CE
= V
IH
)
I
CC1
2
6
mA
2, 3
CMOS Standby Current, +5V
(
CE
³ V
CC
- 0.2V)
I
CC2
2
6
mA
2, 3
CMOS Standby Current, +3.3V
(
CE
³ V
CC
- 0.2V)
I
CC2
1
2
mA
2, 3
Input Leakage Current
(Any Input)
I
IL
-1
+1
mA
Output Leakage Current
(Any Output)
I
OL
-1
+1
mA
Output Logic 1 Voltage
(I
OUT
= -1.0mA)
V
OH
2.4
V
1
Output Logic 0 Voltage
I
OUT
= 2.1mA, DQ0­DQ7
Outputs
V
OL1
0.4
V
1
I
OUT
= 7.0mA,
IRQ
/FT and
RST
Outputs
V
OL2
0.4
V
1, 5
Write Protection Voltage, +5V
V
PF
4.25
4.37
4.50
V
1
Write Protection Voltage, +3.3V
V
PF
2.80
2.88
2.97
V
1
Battery Switchover Voltage, +5V
V
SO
V
BAT
V
1
Battery Switchover Voltage, +3.3V
V
SO
V
PF
V
1, 4
Battery Current OSC On
I
OSC
0.3
0.5
µA
6,7
Battery Current OSC Off
I
BACKUP
100
nA
7
Output Voltage I
CCO
= 70mA, +5V
V
CC01
V
CC1
- 0.3
V
Output Voltage I
CCO
= 40mA, +3.3V
V
CC01
V
CC1
- 0.3
V
Output Voltage I
CCO
= 10µA
V
CC02
V
BAT
- 0.2
V
BAT
- 0.031
V
10
CRYSTAL SPECIFICATIONS
*
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS NOTES
Nominal Frequency
F
O
32.768
kHz
Series Resistance
ESR
45
k
Load Capacitance
C
L
6
pF
*The crystal, traces, and crystal input pins should be isolated from RF generating signals. Refer to Application Note 58 "Crystal Considerations
for Dallas Real-Time Clocks" for additional specifications.
DS1558
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READ CYCLE, AC CHARACTERISTICS
(V
CC
= +3.3V ±10% or +5V ±10%, T
A
= -40°C to +85°C)
V
CC
= +5.5V ±10%
V
CC
= +3.3V ±10%
PARAMETER
SYMBOL
MIN
MAX
MIN
MAX
UNITS NOTES
Read Cycle Time
t
RC
70
120
ns
Address Access Time
t
AA
70
120
ns
CE
to DQ Low-Z
t
CEL
5
5
ns
CE
Access Time
t
CEA
70
120
ns
CE
Data Off Time
t
CEZ
25
40
ns
OE
to DQ Low-Z
t
OEL
5
5
ns
OE
Access Time
t
OEA
35
100
ns
OE
Data Off Time
t
OEZ
25
35
ns
Output Hold from
Address
t
OH
5
5
ns
CE
to
CER
Propagation
Delay, +5V
t
CEPD
15
ns
OE
to
OER
Propagation
Delay, +5V
t
OEPD
20
ns
CE
to
CER
Propagation
Delay, +3.3V
t
CEPD
30
ns
OE
to
OER
Propagation
Delay, +3.3V
t
OEPD
40
ns
Figure 5. READ CYCLE TIMING DIAGRAM
DS1558
14 of 18
WRITE CYCLE, AC CHARACTERISTICS
(
V
CC
= +3.3V ±10% or +5V ±10%, T
A
= -40°C to +85°C)
V
CC
= +5.0V ±10%
V
CC
= +3.3V ±10%
PARAMETER
SYMBOL
MIN
MAX
MIN
MAX
UNITS NOTES
Write Cycle Time
t
WC
70
120
ns
Address Access Time
t
AS
0
0
ns
WE
Pulse Width
t
WEW
50
100
ns
CE
Pulse Width
t
CEW
60
110
ns
Data Setup Time
t
DS
30
80
ns
Data Hold Time
t
DH1
5
5
ns
8
Data Hold Time
t
DH2
5
5
ns
9
Address Hold Time
t
AH1
5
0
ns
8
Address Hold Time
t
AH2
5
5
ns
9
WE
Data Off Time
t
WEZ
25
40
ns
Write Recovery Time
t
WR
5
10
ns
Figure 6. WRITE CYCLE TIMING, WRITE-ENABLE CONTROLLED
DS1558
15 of 18
Figure 7. WRITE CYCLE TIMING, CHIP-ENABLE CONTROLLED
DS1558
16 of 18
POWER-UP/DOWN CHARACTERISTICS
(V
CC
= +5V
±
10%,
T
A
= -40°C to +85°C
)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
CE
or
WE
at V
IH
,
Before Power-Down
t
PD
0
ms
V
CC
Fall Time: V
PF(MAX)
to V
PF(MIN)
t
F
300
ms
V
CC
Fall Time: V
PF(MIN)
to V
SO
t
FB
10
ms
V
CC
Rise Time: V
PF(MIN)
to V
PF(MAX)
t
R
0
ms
V
PF
to
RST
High
t
REC
40
200
ms
Figure 8. +5V POWER-UP/DOWN WAVEFORM TIMING
DS1558
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POWER-UP/DOWN CHARACTERISTICS
(V
CC
= +3.3V
±
10%,
T
A
= -40°C to +85°C
)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS NOTES
CE
or
WE
at V
IH
,
Before Power-Down
t
PD
0
ms
V
CC
Fall Time: V
PF(MAX)
to V
PF(MIN)
t
F
300
ms
V
CC
Rise Time: V
PF(MIN)
to V
PF(MAX)
t
R
0
ms
V
PF
to
RST
High
t
REC
40
200
ms
Figure 9. +3.3V POWER-UP/DOWN WAVEFORM TIMING
CAPACITANCE
(
T
A
= +25
°C
)
PARAMETER
SYMBOL
MIN
TYP
MAX
UNITS
NOTES
Capacitance On All Input Pins
C
IN
7
pF
1
Capacitance On
IRQ
/FT,
RST
, and
DQ Pins
C
IO
10
pF
1
DS1558
18 of 18
AC TEST CONDITIONS
Output Load:
25pF
Input Pulse Levels:
0V to +3V
Timing Measurement Reference Levels:
Input: +1.5V
Output: +1.5V
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltage referenced to ground.
2) Typical values are at +25
°C and nominal supplies.
3) Outputs are open.
4) Battery switchover occurs at the lower of either the battery voltage or V
PF
.
5) The
IRQ
/FT and
RST
outputs are open drain.
6) Using the recommended crystal on X1 and X2.
7) V
CCO
,
CER
, and
OER
pins open.
8) t
AH1
, t
DH1
are measured from WE going high.
9) t
AH2
, t
DH2
are measured from CE going high.
10) Typical measured with V
BAT
at 3.0V. Typical with I
CCO
= 100µA and V
BAT
= 3.0V is V
BAT
- 0.322.