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Part Number LTC1657L

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1
LTC1657L
Parallel 16-Bit Rail-to-Rail
Micropower DAC
April 2000
s
16-Bit Monotonic Over Temperature
s
3V Single Supply Operation
s
Deglitched Rail-to-Rail Voltage Output: 8nV · s
s
I
CC
: 650
µ
A Typ
s
Maximum DNL Error:
±
1LSB
s
Settling Time: 20
µ
s to
±
1LSB
s
Internal or External Reference
s
Internal Power-On Reset to 0V
s
Asynchronous CLR Pin
s
Output Buffer Configurable for Gain of 1 or 2
s
Parallel 16-Bit or 2-Byte Double Buffered Interface
s
Narrow 28-Lead SSOP Package
s
5V Version Available (LTC1657)
The LTC
®
1657L is a complete single supply, rail-to-rail
voltage output, 16-bit digital-to-analog converter (DAC) in
a 28-pin SSOP or PDIP package. It includes a rail-to-rail
output buffer amplifier, an internal 1.25V reference and a
double buffered parallel digital interface.
The LTC1657L operates from a 2.7V to 5.5V supply. It has
a separate reference input pin that can be driven by an
external reference. The full-scale output can be 1 or 2
times the reference voltage depending on how the X1/X2
pin is connected.
The LTC1657L is similar to Linear Technology Corporation's
LTC1450 12-bit V
OUT
DAC family allowing an easy up-
grade path. It is the only buffered 16-bit parallel DAC in a
28-lead SSOP package and includes an onboard reference
for stand alone performance.
FEATURES
DESCRIPTIO
N
U
, LTC and LT are registered trademarks of Linear Technology Corporation.
s
Instrumentation
s
Industrial Process Control
s
Automatic Test Equipment
s
Communication Test Equipment
APPLICATIO
N
S
U
Differential Nonlinearity
vs Input Code
CODE
0
­ 1.0
­ 0.2
­ 0.4
­ 0.6
­ 0.8
0
0.2
0.4
0.6
0.8
1.0
DNL ERROR (LSB)
16484
32768
1657 TA02
49152
65535
Final Electrical Specifications
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
BLOCK DIAGRA
W
REFLO
GND
0V TO
2.5V
2.7V TO 5.5V
16-BIT
DAC
R
R
25
REFHI
REFOUT
22
24
23
X1/X2
21
20
26
1657 TA01
V
OUT
V
CC
D15 (MSB)
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
1
2
28
27
D8
D7
DATA IN FROM
MICROPROCESSOR
DATA BUS
FROM
MICROPROCESSOR
DECODE LOGIC
FROM
SYSTEM RESET
D0 (LSB)
­
+
REFERENCE
1.25V
16-BIT
DAC
REGISTER
POWER-ON
RESET
LDAC
CLR
WR
CSMSB
CSLSB
LSB
8-BIT
INPUT
REGISTER
MSB
8-BIT
INPUT
REGISTER
2
LTC1657L
ABSOLUTE
M
AXI
M
U
M
RATINGS
W
W
W
U
PACKAGE/ORDER I
N
FOR
M
ATIO
N
W
U
U
(Note 1)
V
CC
to GND .............................................. ­ 0.5V to 7.5V
TTL Input Voltage,
REFHI, REFLO, X1/X2 .......................... ­ 0.5V to 7.5V
V
OUT
, REFOUT ............................ ­ 0.5V to (V
CC
+ 0.5V)
Operating Temperature Range
LTC1657LC ............................................. 0
°
C to 70
°
C
LTC1657LI ......................................... ­ 40
°
C to 85
°
C
Maximum Junction Temperature .......................... 125
°
C
Storage Temperature Range ................ ­ 65
°
C to 150
°
C
Lead Temperature (Soldering, 10 sec)................. 300
°
C
ORDER PART
NUMBER
Consult factory for Military grade parts.
T
JMAX
= 125
°
C,
JA
= 95
°
C/ W (G)
T
JMAX
= 125
°
C,
JA
= 58
°
C/ W (N)
LTC1657LCGN
LTC1657LCN
LTC1657LIGN
LTC1657LIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TOP VIEW
GN PACKAGE
28-LEAD PLASTIC SSOP
N PACKAGE
28-LEAD PDIP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
WR
CSLSB
CSMSB
(LSB) D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
LDAC
CLR
X1/X2
V
OUT
V
CC
REFOUT
REFHI
REFLO
GND
D15 (MSB)
D14
D13
D12
D11
The
q
denotes specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25
°
C. V
CC
= 2.7V to 5.5V, V
OUT
unloaded, REFOUT tied to REFHI,
REFLO tied to GND, X1/X2 tied to GND, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DAC (Note 2)
Resolution
q
16
Bits
Monotonicity
q
16
Bits
DNL
Differential Nonlinearity
Guaranteed Monotonic (Note 3)
q
±
0.5
±
1.0
LSB
INL
Integral Nonlinearity
(Note 3)
q
±
4
±
12
LSB
ZSE
Zero Scale Error
q
0
2
mV
V
OS
Offset Error
Measured at Code 200
q
±
0.3
±
4
mV
V
OS
TC
Offset Error Tempco
±
5
µ
V/
°
C
Gain Error
q
±
2
±
16
LSB
Gain Error Drift
1
ppm/
°
C
Power Supply
V
CC
Positive Supply Voltage
For Specified Performance
q
2.7
5.5
V
I
CC
Supply Current
2.7V
V
CC
5.5V (Note 4)
q
650
1200
µ
A
Op Amp DC Performance
Short-Circuit Current Low
V
OUT
Shorted to GND
q
60
120
mA
Short-Circuit Current High
V
OUT
Shorted to V
CC
q
70
140
mA
Output Impedance to GND
Input Code = 0
q
120
275
Output Line Regulation
Input Code = 65535, V
CC
= 2.7V to 5.5V
q
3
mV/V
3
LTC1657L
The
q
denotes specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25
°
C. V
CC
= 2.7V to 5.5V, V
OUT
unloaded, REFOUT tied to REFHI,
REFLO tied to GND, X1/X2 tied to GND, unless otherwise noted.
ELECTRICAL CHARACTERISTICS
Note 1: Absolute Maximum Ratings are those values beyond which the life
of a device may be impaired.
Note 2: External reference REFHI = 1.3V, V
CC
= 3V
Note 3: Nonlinearity is defined from code 128 to code 65535 (full scale).
See Applications Information.
Note 4: Digital inputs at 0V or V
CC
.
Note 5: DAC switched between all 1s all 0s, slew rate is measured from
0.8V to 2V. V
CC
=3V.
Note 6: Guaranteed by design. Not subject to test.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
AC Performance
Voltage Output Slew Rate
(Note 5)
q
±
0.3
±
0.7
V/
µ
s
Voltage Output Settling Time
(Note 5) to 0.0015% (16-Bit Settling Time)
20
µ
s
(Note 5) to 0.012% (13-Bit Settling Time)
10
µ
s
Digital Feedthrough
0.3
nV·s
Midscale Glitch Impulse
DAC Switch Between 8000
H
and 7FFF
H
8
nV·s
Output Voltage Noise
At 1kHz
200
nV/
Hz
Spectral Density
Digital I/O (V
CC
= 3V)
V
IH
Digital Input High Voltage
q
2.0
V
V
IL
Digital Input Low Voltage
q
0.6
V
I
LEAK
Digital Input Leakage
V
IN
= GND to V
CC
q
±
10
µ
A
C
IN
Digital Input Capacitance
(Note 6)
10
pF
Switching Characteristics (V
CC
= 3V)
t
CS
CS (MSB or LSB) Pulse Width
q
60
ns
t
WR
WR Pulse Width
q
60
ns
t
CWS
CS to WR Setup
q
0
ns
t
CWH
CS to WR Hold
q
0
ns
t
DWS
Data Valid to WR Setup
q
60
ns
t
DWH
Data Valid to WR Hold
q
0
ns
t
LDAC
LDAC Pulse Width
q
60
ns
t
CLR
CLR Pulse Width
q
60
ns
Reference Output (REFOUT)
Reference Output Voltage
q
1.24
1.25
1.26
V
Reference Output
15
ppm/
°
C
Temperature Coefficient
Reference Line Regulation
V
CC
= 2.7V to 5.5V
q
±
1
mV/V
Reference Load Regulation
Measured at I
OUT
= 100
µ
A
q
3
mV/A
Short-Circuit Current
REFOUT Shorted to GND
q
50
100
mA
Reference Input
REFHI, REFLO Input Range
(Note 6) See Applications Information
X1/X2 Tied to V
OUT
q
0
V
CC
­ 1.5
V
X1/X2 Tied to GND
q
0
V
CC
/2
REFHI Input Resistance
q
16
23
k
4
LTC1657L
WR (Pin 1): Write Input (Active Low). Used with CSMSB
and/or CSLSB to control the input registers. While WR and
CSMSB and/or CSLSB are held low, data writes into the
input register.
CSLSB (Pin 2): Chip Select Least Significant Byte (Active
Low). Used with WR to control the LSB 8-bit input regis-
ters. While WR and CSLSB are held low, the LSB byte
writes into the LSB input register. Can be connected to
CSMSB for simultaneous loading of both sets of input
latches on a 16-bit bus.
CSMSB (Pin 3): Chip Select Most Significant Byte (Active
Low). Used with WR to control the MSB 8-bit input
registers. While WR and CSMSB are held low, the MSB
byte writes into the MSB input register. Can be connected
to CSLSB for simultaneous loading of both sets of input
latches on a 16-bit bus.
D0 to D7 (Pins 4 to 11): Input data for the Least Significant
Byte. Written into LSB input register when WR = 0 and
CSLSB = 0.
D8 to D15 (Pins 12 to 19): Input data for the Most Signifi-
cant Byte. Written into MSB input register when WR = 0
and CSMSB = 0.
GND (Pin 20): Ground.
REFLO (Pin 21): Lower input terminal of the DAC's inter-
nal resistor ladder. Typically connected to Analog Ground.
An input code of (0000)
H
will connect the positive input of
PI
N
FU
N
CTIO
N
S
U
U
U
the output buffer to this end of the ladder. Can be used to
offset the zero scale above ground.
REFHI (Pin 22): Upper input terminal of the DAC's internal
resistor ladder. Typically connected to REFOUT. An input
code of (FFFF)
H
will connect the positive input of the
output buffer to 1LSB below this voltage.
REFOUT (Pin 23): Output of the internal 1.25V reference.
Typically connected to REFHI to drive internal DAC resistor
ladder.
V
CC
(Pin 24): Positive Power Supply Input. 2.7V
V
CC
5.5V. Requires a 0.1
µ
F bypass capacitor to ground.
V
OUT
(Pin 25): Buffered DAC Output.
X1/X2 (Pin 26): Gain Setting Resistor Pin. Connect to GND
for G = 2 or to V
OUT
for G = 1. This pin should always be
tied to a low impedance source, such as ground or V
OUT
,
to ensure stability of the output buffer when driving
capacitive loads.
CLR (Pin 27): Clear Input (Asynchronous Active Low). A
low on this pin asynchronously resets all input and DAC
registers to 0s.
LDAC (Pin 28): Load DAC (Asynchronous Active Low).
Used to asynchronously transfer the contents of the input
registers to the DAC register which updates the output
voltage. If held low, the DAC register loads data from the
input registers which will immediately update V
OUT
.
5
LTC1657L
DIGITAL I
N
TERFACE TRUTH TABLE
U
CLR
CSMSB
CSLSB
WR
LDAC
FUNCTION
L
X
X
X
X
Clears input and DAC registers to zero
H
X
X
X
L
Loads DAC register with contents of input registers
H
X
X
X
H
Freezes contents of DAC register
H
L
H
L
X
Writes MSB byte into MSB input register
H
H
L
L
X
Writes LSB byte into LSB input register
H
L
L
L
X
Writes MSB and LSB bytes into MSB and LSB input registers
H
X
X
H
X
Inhibits write to MSB and LSB input registers
H
H
X
X
X
Inhibits write to MSB input register
H
X
H
X
X
Inhibits write to LSB input register
H
L
L
L
L
Data bus flows directly through input and DAC registers
TI
M
I
N
G DIAGRA
M
W
U
W
CSMSB
WR
LDAC
1657 TD
t
CS
CSLSB
DATA
t
CS
t
WR
t
WR
t
CWS
t
CWH
t
DWS
t
LDAC
DAC UPDATE
t
DWH
DATA VALID
DATA VALID
6
LTC1657L
Figure 1. Effect of Negative Offset
Resolution (n): Resolution is defined as the number of
digital input bits (n). It defines the number of DAC output
states (2
n
) that divide the full-scale range. Resolution does
not imply linearity.
Full-Scale Voltage (V
FS
): This is the output of the DAC
when all bits are set to 1.
Voltage Offset Error (V
OS
): Normally, the DAC offset is the
voltage at the output when the DAC is loaded with all zeros.
The DAC can have a true negative offset, but because the
part is operated from a single supply, the output cannot go
below zero. If the offset is negative, the output will remain
near 0V resulting in the transfer curve shown in Figure 1.
DEFI ITIO S
U
U
DAC CODE
1657 F01
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
0V
The offset of the part is measured at the code that corre-
sponds to the maximum offset specification:
V
OS
= V
OUT
­ [(Code)(V
FS
)/(2
n
­ 1)]
Least Significant Bit (LSB): One LSB is the ideal voltage
difference between two successive codes.
LSB = (V
FS
­ V
OS
)/(2
n
­ 1) = (V
FS
­ V
OS
)/65535
Nominal LSBs:
LTC1657L LSB = 2.5V/65535 = 38.1
µ
V
DAC Transfer Characteristic:
V
G
REFHI REFLO
CODE
REFLO
OUT
=




( )
+
·
­
65536
G = 1 for X1/X2 connected to V
OUT
G = 2 for X1/X2 connected to GND
CODE = Decimal equivalent of digital input
(0
CODE
65535)
Zero-Scale Error (ZSE): The output voltage when the
DAC is loaded with all zeros. Since this is a single supply
part, this value cannot be less than 0V.
Integral Nonlinearity (INL): End-point INL is the maxi-
mum deviation from a straight line passing through the
end points of the DAC transfer curve. Because the part
operates from a single supply and the output cannot go
below zero, the linearity is measured between full scale
and the code corresponding to the maximum offset
specification. The INL error at a given input code is
calculated as follows:
INL (In LSBs) = [V
OUT
­ V
OS
­ (V
FS
­ V
OS
)
(code/65535)]
V
OUT
= The output voltage of the DAC measured at
the given input code
Differential Nonlinearity (DNL): DNL is the difference
between the measured change and the ideal one LSB
change between any two adjacent codes. The DNL error
between any two codes is calculated as follows:
DNL = (
V
OUT
­ LSB)/LSB
V
OUT
= The measured voltage difference between
two adjacent codes
Digital Feedthrough: The glitch that appears at the analog
output caused by AC coupling from the digital inputs when
they change state. The area of the glitch is specified in
nV · s.
7
LTC1657L
used or the resistor ladder can be driven by an external
source in multiplying applications. The external reference
or source must be capable of driving the 16k (minimum)
DAC ladder resistance.
Internal reference output voltage noise spectral density
can be reduced with a bypass capacitor to ground. (Note:
The reference does not require a bypass capacitor to
ground for nominal operation.) When bypassing the refer-
ence, a small value resistor in series with the capacitor is
recommended to help reduce peaking on the output. A
10
resistor in series with a 4.7
µ
F capacitor is optimum
for reducing reference generated noise. Internal reference
output noise at 1kHz is typically 80nV/
Hz.
DAC Resistor Ladder
The high and low end of the DAC ladder resistor string
(REFHI and REFLO, respectively) are not connected inter-
nally on this part. Typically, REFHI will be connected to
REFOUT and REFLO will be connected to GND. X1/X2
connected to GND will give the LTC1657L a full-scale
output swing of 2.5V.
Either of these pins can be driven up to V
CC
­ 1.5V when
using the buffer in the gain-of-1 configuration. The resis-
tor string pins can be driven to V
CC
/2 when the buffer is in
the gain of 2 configuration. The resistance between these
two pins is typically 30k (16k min).
Voltage Output
The output buffer for the LTC1657L can be configured for
two different gain settings. By tying the X1/X2 pin to GND,
the gain is set to 2. By tying the X1/X2 pin to V
OUT
, the gain
is set to unity.
The LTC1657L rail-to-rail buffered output can source or
sink 5mA to within 500mV of the positive supply voltage
or ground at room temperature. The output stage is
equipped with a deglitcher that results in a midscale glitch
impulse of 8nV · s. The output swings to within a few
millivolts of either supply rail when unloaded and has an
equivalent output resistance of 40
when driving a load to
the rails.
Parallel Interface
The data on the input of the DAC is written into the DAC's
input registers when Chip Select (CSLSB and/or CSMSB)
and WR are at a logic low. The data that is written into the
input registers will depend on which of the Chip Selects
are at a logic low (see Digital Interface Truth Table). If WR
and CSLSB are both low and CSMSB is high, then only
data on the eight LSBs (D0 to D7) is written into the input
registers. Similarly, if WR and CSMSB are both low and
CSLSB is high, then only data on the eight MSBs (D8 to
D15) is written into the input registers. Data is written into
both the Least Significant Data Bits (D0 to D7) and the Most
Significant Bits (D8 to D15) at the same time if WR, CSLSB
and CSMSB are low. If WR is high or both CSMSB and
CSLSB are high, then no data is written into the input
registers.
Once data is written into the input registers, it can be
written into the DAC register. This will update the analog
voltage output of the DAC. The DAC register is written by
a logic low on LDAC. The data in the DAC register will be
held when LDAC is high.
When WR, CSLSB, CSMSB and LDAC are all low, the
registers are transparent and data on pins D0 to D15 flows
directly into the DAC register.
For an 8-bit data bus connection, tie the MSB byte data
pins to their corresponding LSB byte pins (D15 to D7, D14
to D6, etc).
Power-On Reset
The LTC1657L has an internal power-on reset that resets
all internal registers to 0's on power-up (equivalent to the
CLR pin function).
Reference
The LTC1657L includes an internal 1.25V reference, giv-
ing the LTC1657L a full-scale range of 2.5V in the gain-of-
2 configuration. The onboard reference in the LTC1657L is
not internally connected to the DAC's reference resistor
string but is provided on an adjacent pin for flexibility.
Because the internal reference is not internally connected
to the DAC resistor ladder, an external reference can be
OPERATIO
N
U
8
LTC1657L
APPLICATIO
N
S I
N
FOR
M
ATIO
N
W
U
U
U
Rail-to-Rail Output Considerations
In any rail-to-rail DAC, the output swing is limited to
voltages within the supply range.
If the DAC offset is negative, the output for the lowest
codes limits at 0V as shown in Figure 1b.
Similarly, limiting can occur near full scale when the REF
pin is tied to V
CC
/2. If V
REF
= V
CC
/2 and the DAC full-scale
error (FSE) is positive, the output for the highest codes
limits at V
CC
as shown in Figure 1c. No full-scale limiting
can occur if V
REF
is less than (V
CC
­ FSE)/2.
Offset and linearity are defined and tested over the region
of the DAC transfer function where no output limiting can
occur.
Figure 2. Effects of Rail-to-Rail Operation On a DAC Transfer Curve. (a) Overall Transfer Function (b) Effect of Negative
Offset for Codes Near Zero Scale (c) Effect of Positive Full-Scale Error for Input Codes Near Full Scale When V
REF
= V
CC
/2
1657 F02
INPUT CODE
(b)
OUTPUT
VOLTAGE
NEGATIVE
OFFSET
0V
32768
0
65535
INPUT CODE
OUTPUT
VOLTAGE
(a)
V
REF
= V
CC
/2
V
CC
V
CC
V
REF
= V
CC
/2
(c)
INPUT CODE
OUTPUT
VOLTAGE
POSITIVE
FSE
9
LTC1657L
This circuit shows how to measure negative offset. Since
LTC1657L operates on a single supply, if its offset is
negative, the output for code 0 limits at 0V. To measure
TYPICAL APPLICATIO
N
U
µ
P
5:19
2
3
1
28
27
DATA 10:15
CSLSB
CSMSB
WR
LDAC
CLR
REFOUT
V
CC
X1/X2
GND
REFHI
REFLO
LTC1657L
VOUT
22
23
24
25
R1
100k
3V
­3V
0.1
µ
F
26
21
20
1657 TA03
this negative offset, a negative supply is needed. Connect
resister R1 as shown in the figure, the output voltage is the
offset when code 0 is loaded in.
10
LTC1657L
0.386 ­ 0.393*
(9.804 ­ 9.982)
GN28 (SSOP) 1098
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
1
2
3
4
5
6
7
8
9 10 11 12
0.229 ­ 0.244
(5.817 ­ 6.198)
0.150 ­ 0.157**
(3.810 ­ 3.988)
20
21
22
23
24
25
26
27
28
19 18 17
13 14
1615
0.016 ­ 0.050
(0.406 ­ 1.270)
0.015
±
0.004
(0.38
±
0.10)
×
45
°
0
°
­ 8
°
TYP
0.0075 ­ 0.0098
(0.191 ­ 0.249)
0.053 ­ 0.069
(1.351 ­ 1.748)
0.008 ­ 0.012
(0.203 ­ 0.305)
0.004 ­ 0.009
(0.102 ­ 0.249)
0.0250
(0.635)
BSC
0.033
(0.838)
REF
PACKAGE DESCRIPTIO
N
U
GN Package
28-Lead Plastic SSOP (Narrow 0.150)
(LTC DWG # 05-08-1641)
Dimensions in inches (millimeters) unless otherwise noted.
11
LTC1657L
N28 1098
0.255
±
0.015*
(6.477
±
0.381)
1.370*
(34.789)
MAX
3
4
5
6
7
8
9
10
11
12
21
13
14
15
16
18
17
19
20
22
23
24
25
26
2
27
1
28
0.020
(0.508)
MIN
0.125
(3.175)
MIN
0.130
±
0.005
(3.302
±
0.127)
0.065
(1.651)
TYP
0.045 ­ 0.065
(1.143 ­ 1.651)
0.018
±
0.003
(0.457
±
0.076)
0.005
(0.127)
MIN
0.100
(2.54)
BSC
0.009 ­ 0.015
(0.229 ­ 0.381)
0.300 ­ 0.325
(7.620 ­ 8.255)
0.325
+0.035
­0.015
+0.889
­0.381
8.255
(
)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
PACKAGE DESCRIPTIO
N
U
N Package
28-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
Dimensions in inches (millimeters) unless otherwise noted.
12
LTC1657L
PART NUMBER
DESCRIPTION
COMMENTS
LTC1446(L)
Dual 12-Bit V
OUT
DACs in SO-8 Package
V
CC
= 5V (3V), V
OUT
= 0V to 4.095V (0V to 2.5V)
LTC1450(L)
Single 12-Bit V
OUT
DACs with Parallel Interface
V
CC
= 5V (3V), V
OUT
= 0V to 4.095V (0V to 2.5V)
LTC1458(L)
Quad 12-Bit Rail-to-Rail Output DACs
V
CC
= 5V (3V), V
OUT
= 0V to 4.095V (0V to 2.5V)
with Added Functionality
LTC1650
Single 16-Bit V
OUT
Industrial DAC in 16-Pin SO
V
CC
=
±
5V, Low Power, Deglitched, 4-Quadrant Multiplying V
OUT
LTC1655(L)
Single 16-Bit V
OUT
DAC with Serial Interface in SO-8
V
CC
= 5V (3V), Low Power, Deglitched, V
OUT
= 0V to 4.096V (0V to 2.5V)
LTC1657
Single 16-Bit V
OUT
DAC with Parallel Interface
V
CC
= 5V, Low Power, Deglitched, V
OUT
= 0V to 4.096V
with Internal Reference
©
LINEAR TECHNOLOGY CORPORATION 2000
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
q
FAX: (408) 434-0507
q
www.linear-tech.com
1657Li LT/TP 0400 4K · PRINTED IN USA
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