Intel
®
Pentium
®
III Processor with 512KB L2
Cache at 1.13GHz to 1.40GHz
Datasheet
Product Features
The Pentium
®
III
processor with 512KB L2 Cache is designed for high-performance workstations and
servers. It is binary compatible with previous Intel architecture processors. The Pentium
®
III
processor
with 512KB L2 Cache provides great performance for applications running on advanced operating
systems such as Windows* 98, Windows* NT, Windows* 2000, Windows* Me and Linux. This is
achieved by integrating the best attributes of Intel processors--the dynamic execution, Dual
Independent Bus architecture plus Intel
®
MMXTM technology and Internet Streaming SIMD
Extensions--bringing a new level of performance for systems buyers. The Pentium
®
III
processor with
512KB L2 Cache extends the power of the Pentium
®
II processor with performance headroom for
business media, communication and internet capabilities. Systems based on the Pentium
®
III
processor
with 512KB L2 Cache also include the latest features to simplify system management and lower the
cost of ownership for large and small business environments. The Pentium
®
III
processor with 512KB
L2 Cache offers great performance for today's and tomorrow's applications.
FC-PGA2 370 Package
s
Available at 1.13, 1.26 and 1.40GHz
s
512KB Advanced Transfer Cache (on-die,
full speed Level 2 (L2) cache with Error
Correcting Code (ECC))
s
Dual Independent Bus (DIB) architecture:
Separate dedicated external System Bus and
dedicated internal high-speed cache bus
s
Internet Streaming SIMD Extensions for
enhanced video, sound and 3D performance
s
Binary compatible with applications running
on previous members of the Intel
microprocessor line
s
Dynamic execution micro architecture
s
Power Management capabilities
-- System Management mode
-- Multiple low-power states
s
Optimized for 32-bit applications running on
advanced 32-bit operating systems
s
Flip Chip Pin Grid Array (FC-PGA2) packaging
technology; FC-PGA2 processors deliver high
performance with improved handling protection
and socketability
s
Integrated high performance 16KB instruction
and 16KB data, nonblocking, level one cache
s
512KB Integrated Full Speed level two cache
allows for low latency on read/store operations
s
Quad Quadword Wide (256 bit) cache data bus
provides extremely high throughput on read/
store operations.
s
8-way cache associativity provides improved
cache hit rate on reads/store operations.
s
Error-correcting code for System Bus data
s
Data Prefetch Logic
June 2002
Order Number:
249657-004
Intel
®
Pentium
®
III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
2
Datasheet
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Pentium
®
III Processor with 512KB L2 Cache may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
All rights reserved. Intel, the Intel Logo and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United
States or other countries.
Copyright © Intel Corporation, 2002
* Other names and brands may be claimed as the property of others.
Datasheet
3
Intel
®
Pentium
®
III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
Contents
1.0
Introduction
.................................................................................................................. 1
1.1
Terminology........................................................................................................... 2
1.1.1
Package and Processor Terminology ...................................................... 2
1.1.2
Processor Naming Convention................................................................. 3
1.2
Related Documents............................................................................................... 4
1.3
Revision History .................................................................................................... 4
2.0
Electrical Specifications
.......................................................................................... 5
2.1
Processor System Bus and V
REF ............................................................................................ 5
2.2
Clock Control and Low Power States.................................................................... 6
2.2.1
Normal State--State 1 ............................................................................. 7
2.2.2
AutoHALT Powerdown State--State 2..................................................... 7
2.2.3
Stop-Grant State--State 3 ....................................................................... 8
2.2.4
HALT/Grant Snoop State--State 4 .......................................................... 8
2.2.5
Sleep State--State 5................................................................................ 8
2.2.6
Deep Sleep State--State 6 ...................................................................... 9
2.2.7
Clock Control............................................................................................ 9
2.3
Power and Ground Pins ...................................................................................... 10
2.3.1
Phase Lock Loop (PLL) Power...............................................................10
2.4
Decoupling Guidelines ........................................................................................ 11
2.4.1
Processor VCC
CORE
Decoupling............................................................ 11
2.5
Processor System Bus Clock and Processor Clocking ....................................... 11
2.6
Voltage Identification ........................................................................................... 12
2.7
Processor System Bus Unused Pins................................................................... 15
2.8
Processor System Bus Signal Groups ................................................................ 15
2.8.1
Asynchronous vs. Synchronous for System Bus Signals ....................... 16
2.8.2
System Bus Frequency Select Signals ..................................................17
2.9
............................................................................................... Maximum Ratings18
2.10
Processor Voltage Level Specifications .............................................................. 18
2.11
AGTL System Bus Specifications........................................................................ 24
2.12
System Bus Timing Specifications ...................................................................... 24
3.0
Signal Quality Specifications
.............................................................................. 37
3.1
BCLK/BCLK# & PICCLK Signal Quality Specifications and Measurement Guide-
lines37
3.2
AGTL Signal Quality Specifications and Measurement Guidelines..................... 38
3.3
AGTL Signal Quality Specifications and Measurement Guidelines..................... 39
3.3.1
Overshoot/Undershoot Guidelines ......................................................... 39
3.3.2
Overshoot/Undershoot Magnitude ......................................................... 40
3.3.3
Overshoot/Undershoot Pulse Duration................................................... 40
3.3.4
Activity Factor .........................................................................................40
3.3.5
Reading Overshoot/Undershoot Specification Tables............................ 41
3.3.6
Determining if a System Meets the Overshoot/Undershoot Specifications
42
3.4
Non-AGTL Signal Quality Specifications and Measurement Guidelines............. 44
3.4.1
Overshoot/Undershoot Guidelines ......................................................... 44
3.4.2
Ringback Specification ........................................................................... 45
3.4.3
Settling Limit Guideline........................................................................... 45
4
Datasheet
Intel
®
Pentium
®
III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
4.0
Thermal Specifications and Design Considerations
................................. 47
4.1
Thermal Specifications........................................................................................ 47
4.1.1
THERMTRIP# Requirement................................................................... 47
4.1.2
Thermal Diode........................................................................................ 48
4.2
Thermal Metrology .............................................................................................. 48
5.0
Mechanical Specifications
................................................................................... 49
5.1
FC-PGA2 Mechanical Specifications .................................................................. 49
5.2
Recommended Mechanical Keep-Out Zones ..................................................... 52
5.3
Processor Markings ............................................................................................ 53
5.4
Processor Signal Listing...................................................................................... 54
6.0
Boxed Processor Specifications
....................................................................... 70
6.1
Mechanical Specifications................................................................................... 71
6.1.1
Mechanical Specifications for the FC-PGA2 Package ........................... 71
6.1.2
Boxed Processor Heatsink Weight......................................................... 72
6.2
Thermal Specifications........................................................................................ 73
6.2.1
Boxed Processor Cooling Requirements ............................................... 73
6.2.2
Boxed Processor Thermal Cooling Solution Clip ................................... 73
6.3
Electrical Requirements for the Boxed Intel® Pentium® III Processor with 512KB
L2 Cache74
6.3.1
Electrical Requirements ......................................................................... 74
7.0
Processor Signal Description
............................................................................. 76
7.1
Alphabetical Signals Reference .......................................................................... 76
7.2
Signal Summaries ............................................................................................... 84
Datasheet
5
Intel
®
Pentium
®
III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
List of Figures
1
Integrated Heat Spreader (IHS) ............................................................................ 1
2
AGTL Bus Topology .............................................................................................. 6
3
Stop Clock State Machine ..................................................................................... 7
4
PLL Filter Specification........................................................................................ 10
5
Differential/Single-Ended Clocking Example....................................................... 12
6
V
TT
Power Good and Bus Select Interconnect Diagram .....................................14
7
BSEL[1:0] Example for a System Design............................................................ 17
8
Vcc Static & Transient Tolerance ........................................................................ 22
9
Clock Waveform .................................................................................................. 32
10
BCLK/BCLK#, PICCLK, and TCK Generic Clock Waveform .............................. 32
11
System Bus Valid Delay Timings ........................................................................ 33
12
System Bus Setup and Hold Timings.................................................................. 33
13
System Bus Reset and Configuration Timings.................................................... 34
14
Platform Power-On Sequence and Timings ........................................................ 34
16
Test Timings (TAP Connection) .......................................................................... 35
15
Power-On Reset and Configuration Timings....................................................... 35
17
Test Reset Timings ............................................................................................. 36
18
BCLK/BCLK#, PICCLK Generic Clock Waveform at the Processor Pins ...........38
19
Low to High AGTL Receiver Ringback Tolerance............................................... 39
20
Maximum Acceptable AGTL Overshoot/Undershoot Waveform ......................... 43
21
Non-AGTL Overshoot/Undershoot, Settling Limit, and Ringback 1 .................... 44
22
Package Dimensions........................................................................................... 50
23
FC-PGA2 IHS Flatness Specification.................................................................. 52
24
Volumetric Keep-Out ........................................................................................... 52
25
Component Keep-Out .........................................................................................53
26
Top Side Processor Markings ............................................................................. 53
27
Intel® Pentium® III processor with 512KB L2 Cache Pinout .............................. 54
28
Conceptual Boxed Intel® Pentium® III Processor with 512KB L2 Cache for the
PGA370 Socket70
29
Comparison between FC-PGA and FC-PGA2 package...................................... 71
31
Dimensions of Mechanical Step Feature in Heatsink Base................................. 72
30
Side View of Space Requirements for the Boxed Processor .............................. 72
32
Thermal Airspace Requirement for all Boxed Intel® Pentium® III Processor with
512KB L2 Cache Fan Heatsinks in the PGA370 Socket73
33
Boxed Processor Fan Heatsink Power Cable Connector Description................. 74
34
Motherboard Power Header Placement Relative to the Boxed Intel® Pentium® III
Processor with 512KB L2 Cache75
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