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Part Number BTS7751G

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P-DSO-28-14
Data Sheet
1
2003-03-06
TrilithIC
Data Sheet
BTS 7751 G
1
Overview
1.1
Features
· Quad D-MOS switch driver
· Free configurable as bridge or quad-switch
· Optimized for DC motor management applications
· Low R
DS ON
: 70 m
high-side switch, 45 m low-
side switch (typical values @ 25
°C)
· Maximum peak current: typ. 14 A @ 25
°C=
· Very low quiescent current: typ. 5
µA @ 25 °C=
· Small outline, enhanced power P-DSO-package
· Full short-circuit-protection
· Operates up to 40 V
· Status flag diagnosis
· Overtemperature shut down with hysteresis
· Internal clamp diodes
· Open load detection in Off-mode
· Under-voltage detection with hysteresis
· PWM frequencies up to 1 kHz
1.2
Description
The BTS 7751 G is part of the TrilithIC family containing three dies in one package:
One double high-side switch and two low-side switches. The drains of these three
vertical DMOS chips are mounted on separated lead frames. The sources are connected
to individual pins, so the BTS 7751 G can be used in H-bridge- as well as in any other
configuration. Both the double high-side and the two low-side switches of the
BTS 7751 G are manufactured in SMART SIPMOS
®
technology which combines low
R
DS ON
vertical DMOS power stages with CMOS control circuitry. The high-side switch is
fully protected and contains the control and diagnosis circuitry. Also the low-side
switches are fully protected, the equivalent standard product is the BSP 78.
In contrast to the BTS 7750 G, the BTS 7751 G offers an open load in Off-mode
detection and slightly increased current limitation.
Type
Ordering Code
Package
BTS 7751 G
Q67007-A9553
P-DSO-28-14
BTS 7751 G
Data Sheet
2
2003-03-06
1.3
Pin Configuration
(top view)
Figure 1
28 DL1
25 DL1
27 SL1
26 SL1
24 DHVS
23 SH1
22 SH1
21 SH2
20 SH2
19 DHVS
18 DL2
15 DL2
16 SL2
17 SL2
1
DL1
5
DHVS
4
N.C.
3
DL1
2
IL1
6
GND
7
IH1
8
ST
9
IH2
10
DHVS
11
DL2
14
N.C.
13
DL2
12
IL2
HS-Leadframe
LS-Leadframe
LS-Leadframe
BTS 7751 G
Data Sheet
3
2003-03-06
Pins written in bold type need power wiring.
1.4
Pin Definitions and Functions
Pin No.
Symbol
Function
1, 3, 25, 28
DL1
Drain of low-side switch1, lead frame 1
1)
2
IL1
Analog input of low-side switch1
4
N.C.
not connected
5, 10, 19, 24
DHVS
Drain of high-side switches and power supply voltage,
lead frame 2
1)
6
GND
Ground
7
IH1
Digital input of high-side switch1
8
ST
Status of high-side switches; open Drain output
9
IH2
Digital input of high-side switch2
11
N.C.
not connected
12, 14, 15, 18
DL2
Drain of low-side switch2, lead frame 3
1)
13
IL2
Analog input of low-side switch2
16,17
SL2
Source of low-side switch2
20,21
SH2
Source of high-side switch2
22,23
SH1
Source of high-side switch1
26,27
SL1
Source of low-side switch1
1)
To reduce the thermal resistance these pins are direct connected via metal bridges to the lead frame.
BTS 7751 G
Data Sheet
4
2003-03-06
1.5
Functional Block Diagram
Figure 2
Block Diagram
SH2
DHVS
ST
IL1
GND
IH1
SL2
IH2
IL2
SL1
DL2
SH1
DL1
5,10,19,24
9
7
20,21
16, 17
6
13
2
R
O1
R
O2
Biasing and Protection
Diagnosis
Driver
OUT
0
IN
0 L L
0 1 L H
1 0 H L
1 1 H H
22, 23
1,3,25,28
8
26, 27
12,14,15,18
Protection
Gate
Driver
Protection
Gate
Driver
BTS 7751 G
Data Sheet
5
2003-03-06
1.6
Circuit Description
Input Circuit
The control inputs IH1,2 consist of TTL/CMOS compatible Schmitt-Triggers with
hysteresis. Buffer amplifiers are driven by these stages and convert the logic signal into
the necessary form for driving the power output stages. The inputs are protected by ESD
clamp-diodes.
The inputs IL1 and IL2 are connected to the internal gate-driving units of the N-channel
vertical power-MOS-FETs.
Output Stages
The output stages consist of an low
R
DS ON
Power-MOS H-bridge. In H-bridge
configuration, the D-MOS body diodes can be used for freewheeling when commutating
inductive loads. If the high-side switches are used as single switches, positive and
negative voltage spikes which occur when driving inductive loads are limited by
integrated power clamp diodes.
Short Circuit Protection
The outputs are protected against
­ output short circuit to ground
­ output short circuit to the supply voltage, and
­ overload (load short circuit).
An internal OP-Amp controls the Drain-Source-Voltage by comparing the DS-Voltage-
Drop with an internal reference voltage. Above this trippoint the OP-Amp reduces the
output current depending on the junction temperature and the drop voltage.
In the case of overloaded high-side switches the status output is set to low.
The fully protected low-side switches have no status output.
Overtemperature Protection
The high-side and the low-side switches also incorporate an overtemperature protection
circuit with hysteresis which switches off the output transistors. In the case of the high-
side switches, the status output is set to low.
Under voltage-Lockout (UVLO)
When
V
S
reaches the switch-on voltage
V
UVON
the IC becomes active with a hysteresis.
The High-Side output transistors are switched off if the supply voltage
V
S
drops below
the switch off value
V
UVOFF.
BTS 7751 G
Data Sheet
6
2003-03-06
Open Load Detection
Open load is detected by voltage measurement in Off state. If the output voltage exceeds
a specified level the error flag is set with a delay.
Status Flag
The status flag output is an open drain output with Zener-diode which requires a pull-up
resistor, c.f. the application circuit on page 14. Various errors as listed in the table
"Diagnosis" are detected by switching the open drain output ST to low. Forward current
in the integrated body diode of the high-side switch may cause undefined voltage levels
at the corresponding status output. The open load detection can be used to detect a
short to Vs as long as both low-side switches are off and R
OL
is disconnected from 5V
by BCR192W.
2
Truth table and Diagnosis (valid only for the High-Side-Switches)
Flag
IH1
IH2
SH1
SH2
ST Remarks
Inputs
Outputs
Normal operation;
identical with functional truth table
0
0
1
1
0
1
0
1
L
L
H
H
L
H
L
H
1
1
1
1
stand-by mode
switch2 active
switch1 active
both switches
active
Open load at high-side switch 1
Open load at high-side switch 2
0
1
X
X
X
X
0
1
Z
H
X
X
X
X
Z
H
0
1
0
1
detected
detected
Overtemperature high-side switch1
0
1
X
X
L
L
X
X
1
0
detected
Overtemperature high-side switch2
X
X
0
1
X
X
L
L
1
0
detected
Overtemperature both high-side switches
0
X
1
0
1
X
L
L
L
L
L
L
1
0
0
detected
detected
Under voltage
X
X
L
L
1
not detected
Inputs:
Outputs:
Status:
0 = Logic LOW
Z = Output in tristate condition
1 = No error
1 = Logic HIGH
L = Output in sink condition
0 = Error
X = don't care
H = Output in source condition
X = Voltage level undefined
BTS 7751 G
Data Sheet
7
2003-03-06
3
Electrical Characteristics
3.1
Absolute Maximum Ratings
­ 40
°C <
T
j
< 150
°C
Parameter
Symbol
Limit Values Unit Remarks
min.
max.
High-Side-Switches (Pins DHVS, IH1,2 and SH1,2)
Supply voltage
V
S
­ 0.3
42
V
­
Supply voltage for full short
circuit protection
V
S(SCP)
28
V
HS-drain current*
I
S
­ 7.5
**
A
T
A
= 25°C;
t
P
< 100 ms
HS-input current
I
IH
­ 5
5
mA
Pin IH1 and IH2
HS-input voltage
V
IH
­ 10
16
V
Pin IH1 and IH2
Note: * single pulse ** internally limited
Status Output ST
Status pull up voltage
V
ST
­ 0.3
5.4
V
Status Output current
I
ST
­ 5
5
mA
Pin ST
Low-Side-Switches (Pins DL1,2, IL1,2 and SL1,2)
Drain-Source-Clamp voltage
V
DSL
42
­
V
V
IL
= 0 V;
I
D
1 mA
Supply voltage for short
circuit protection
V
DSL(SCP)
30
V
V
IL
= 5 V
20
V
V
IL
= 10 V
LS-drain current*
I
DL
­ 7.5
**
A
T
A
= 25°C;
t
P
< 100 ms
LS-input voltage
V
IL
­ 0.3
10
V
­
Note: * single pulse ** internally limited
Temperatures
Junction temperature
T
j
­ 40
150
°C
­
Storage temperature
T
stg
­ 55
150
°C
­
BTS 7751 G
Data Sheet
8
2003-03-06
Note: Maximum ratings are absolute ratings; exceeding any one of these values may
cause irreversible damage to the integrated circuit.
Note: In the operating range the functions given in the circuit description are fulfilled.
Thermal Resistances (one HS-LS-Path active)
LS-junction case
R
thjC L
­
20
K/W measured to pin 3 or 12
HS-junction case
R
thjC H
­
20
K/W measured to pin 19
Junction ambient
R
thja
= T
j(HS)
/(P
(HS)
+P
(LS)
)
R
thja
­
60
K/W device soldered to
reference PCB with
6 cm
2
cooling area
ESD Protection (Human Body Model acc. MIL STD 883D, method 3015.7 and EOS/
ESD assn. standard S5.1 - 1993)
Input LS-Switch
V
ESD
­
2
kV
Input HS-Switch
V
ESD
­
1
kV
Status HS-Switch
V
ESD
­
2
kV
Output LS and HS-Switch
V
ESD
­
8
kV
all other pins connected
to Ground
3.2
Operating Range
­ 40
°C <
T
j
< 150
°C
Parameter
Symbol
Limit Values Unit
Remarks
min.
max.
Supply voltage
V
S
V
UVOFF
42
V
After
V
S
rising
above
V
UVON
Input voltages
V
IH
­ 0.3
15
V
­
Input voltages
V
IL
­ 0.3
10
V
­
Output current
I
ST
0
2
mA
­
Junction temperature
T
j
­ 40
150
°C
­
3.1
Absolute Maximum Ratings (cont'd)
­ 40
°C <
T
j
< 150
°C
Parameter
Symbol
Limit Values Unit Remarks
min.
max.
BTS 7751 G
Data Sheet
9
2003-03-06
3.3
Electrical Characteristics
I
SH1
=
I
SH2
=
I
SL1
=
I
SL2
= 0 A; ­ 40
°C <
T
j
< 150
°C; 8 V <
V
S
< 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
Unit Test Condition
min.
typ.
max.
Current Consumption HS-switch
Quiescent current
I
S
­
5
8
µA
IH1 = IH2 = 0 V
T
j
= 25
°C
­
­
12
µA
IH1 = IH2 = 0 V
Supply current
I
S
­
2.2
4.2
mA
IH1 or IH2 = 5 V
V
S
= 12 V
­
4.4
8.4
mA
IH1 and IH2 = 5 V
V
S
= 12 V
Leakage current of
high-side switch
I
SH LK
­
­
6
µA
V
IH
=
V
SH
= 0 V
Leakage current through
logic GND in free wheeling
condition
I
LKCL
=
I
FH
+
I
SH
­
­
10
mA
I
FH
= 3 A
Current Consumption LS-switch
Input current
I
IL
­
8
30
µA
V
IL
= 5 V;
normal operation
­
160
300
µA
V
IL
= 5 V;
failure mode
Leakage current of low-side
switch
I
DL LK
­
2
10
µA
V
IL
= 0 V
Under Voltage Lockout (UVLO) HS-switch
Switch-ON voltage
V
UVON
­
­
4.8
V
V
S
increasing
Switch-OFF voltage
V
UVOFF
1.8
­
3.5
V
V
S
decreasing
Switch ON/OFF hysteresis
V
UVHY
­
1
­
V
V
UVON
­
V
UVOFF
BTS 7751 G
Data Sheet
10
2003-03-06
Output stages
Inverse diode of high-side
switch; Forward-voltage
V
FH
­
0.8
1.2
V
I
FH
= 3 A
Inverse diode of low-side
switch; Forward-voltage
V
FL
­
0.8
1.2
V
I
FL
= 3 A
Static drain-source
on-resistance of high-side
switch
R
DS ON H
­
70
90
m
I
SH
= 1 A
T
j
= 25
°C
Static drain-source
on-resistance of low-side
switch
R
DS ON L
­
45
60
m
I
SL
= 1 A;
V
GL
= 5 V
T
j
= 25
°C
Static path on-resistance
R
DS ON
­
­
285
m
R
DS ON H
+ R
DS ON L
I
SH
= 1 A;
Short Circuit of high-side switch to GND
Initial peak SC current
I
SCP H
15
23
A
T
j
= ­ 40 °C
11.5
18
A
T
j
= + 25 °C
8
11.5
A
T
j
= + 150 °C
Short Circuit of high-side switch to
V
S
Output pull-down-resistor
R
O
8
15
35
k
V
DSL
= 3 V
Short Circuit of low-side switch to
V
S
Initial peak SC current
I
SCP L
23
28
34
A
T
j
= ­ 40
°C
18
22
27
A
T
j
= 25
°C
11.5
14
18
A
T
j
= 150
°C
Note:
Integrated protection functions are designed to prevent IC destruction under fault conditions. Protection
functions are not designed for continuous or repetitive operation.
3.3
Electrical Characteristics (cont'd)
I
SH1
=
I
SH2
=
I
SL1
=
I
SL2
= 0 A; ­ 40
°C <
T
j
< 150
°C; 8 V <
V
S
< 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
Unit Test Condition
min. typ.
max.
BTS 7751 G
Data Sheet
11
2003-03-06
Thermal Shutdown
Thermal shutdown junction
temperature
T
j SD
155
180
190
°C
­
Thermal switch-on junction
temperature
T
j SO
150
170
180
°C
­
Temperature hysteresis
T
­
10
­
°C
T
=
T
jSD
­
T
jSO
Status Flag Output ST of high-side switch
Low output voltage
V
ST L
­
0.2
0.6
V
I
ST
= 1.6 mA
Leakage current
I
ST LK
­
­
10
µA
V
ST
= 5 V
Zener-limit-voltage
V
ST Z
5.4
­
V
I
ST
= 1.6 mA
Open load detection in Off condition
Open load detection
voltage
V
OUT(OL)
1.8
2.8
4
V
Switching times of high-side switch
Turn-ON-time;
to 90%
V
SH
t
ON
­
85
180
µs
R
Load
= 12
V
S
= 12 V
Turn-OFF-time;
to 10%
V
SH
t
OFF
­
80
180
µs
R
Load
= 12
V
S
= 12 V
Slew rate on 10 to 30%
V
SH
dV/dt
ON
­
­
1.2
V/
µs R
Load
= 12
V
S
= 12 V
Slew rate off 70 to 40%
V
SH
-dV/
dt
OFF
­
­
1.5
V/
µs R
Load
= 12
V
S
= 12 V
Note:
switching times are not subject to produvtion tests - specified by design
3.3
Electrical Characteristics (cont'd)
I
SH1
=
I
SH2
=
I
SL1
=
I
SL2
= 0 A; ­ 40
°C <
T
j
< 150
°C; 8 V <
V
S
< 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
Unit Test Condition
min.
typ.
max.
BTS 7751 G
Data Sheet
12
2003-03-06
Note: The listed characteristics are ensured over the operating range of the integrated
circuit. Typical characteristics specify mean values expected over the production
spread. If not otherwise specified, typical characteristics apply at
T
A
= 25
°C and
the given supply voltage.
Switching times of low-side switch
Turn ON time to 10%
V
DL
V
IL
= 0 to 10 V
t
ON
­
65
150
µs
R
Load
= 10
V
S
= 12 V
Turn OFF time;
to 90%
V
DL
t
OFF
­
55
150
µs
R
Load
= 10
V
S
= 12 V
Slew rate on 70 to 50%
V
SH
V
IL
= 0 to 10 V
-dV/dt
ON
­
­
1.5
V/
µs R
Load
= 4.7
V
S
= 12 V
Slew rate off 50 to 70%
V
SH
V
IL
= 0 to 10 V
dV/dt
OFF
­
­
1.5
V/
µs R
Load
= 4.7
V
S
= 12 V
Note:
switching times are not subject to produvtion tests - specified by design
Control Inputs of high-side switches GH 1, 2
H-input voltage
V
IH High
­
­
2.5
V
­
L-input voltage
V
IH Low
1
­
­
V
­
Input voltage hysteresis
V
IH HY
­
0.3
­
V
­
H-input current
I
IH High
15
30
60
µA
V
IH
= 5 V
L-input current
I
IH Low
5
­
20
µA
V
IH
= 0.4 V
Input series resistance
R
I
2.7
4
5.5
k
­
Zener limit voltage
V
IH Z
5.4
­
­
V
I
IH
= 1.6 mA
Control Inputs GL1, 2
Gate-threshold-voltage
V
IL th
0.9
1.7
2.2
V
I
DL
= 2 mA
3.3
Electrical Characteristics (cont'd)
I
SH1
=
I
SH2
=
I
SL1
=
I
SL2
= 0 A; ­ 40
°C <
T
j
< 150
°C; 8 V <
V
S
< 18 V
unless otherwise specified
Parameter
Symbol
Limit Values
Unit Test Condition
min. typ.
max.
BTS 7751 G
Data Sheet
13
2003-03-06
Figure 3
Test Circuit
HS-Source-Current
Named during Short
Circuit
Named during Leakage-
Cond.
I
SH1,2
I
SCP H
I
DL LK
SH2
DHVS
ST
IL1
GND
IH1
SL2
5,10,19,24
9
7
20,21
16,17
6
13
2
R
O1
R
O2
Biasing and Protection
22,23
1,3,25,28
8
IH2
IL2
26,27
12,14,15,18
SL1
DL2
SH1
DL1
I
GND
I
LKCL
V
S
=12V
C
L
100µF
C
S
470nF
I
FH1,2
I
S
I
SH2
I
DL2
I
SH1
I
DL1
I
DL LK 2
I
DL LK 1
V
DSL1
-V
FL1
V
DSL2
-V
FL2
-V
FH2
V
DSH2
-V
FH1
V
DSH1
V
UVON
V
UVOFF
I
SL2
I
SL1
I
SCP L 1
I
SCP L 2
V
IL2
V
IL th 2
V
IL1
V
IL th 1
V
ST
V
STL
V
STZ
V
IH1
V
IH2
Gate
Driver
Gate
Driver
Diagnosis
I
ST
I
ST LK
I
IH1
I
IH1
I
IL1
I
IL2
Protection
Gate
Driver
Protection
Gate
Driver
BTS 7751 G
Data Sheet
14
2003-03-06
Figure 4
Application Circuit
SH2
DHVS
ST
IL1
GND
IH1
SL2
5,10,19,24
9
7
20,21
16,17
6
13
2
TLE
4278G
V
S
=12V
D01
Z39
C
S
10µF
C
D
47nF
D
I
Q
Reset
Watchdog
C
Q
22µF
V
CC
WD R
GND
µP
Protection
Gate
Driver
Protection
Gate
Driver
R
O1
R
O2
Biasing and Protection
M
22,23
1,3,25,28
8
IH2
IL2
26,27
12,14,15,18
SL1
DL2
SH1
DL1
R
Q
100 k
R
S
10 k
Gate
Driver
Gate
Driver
Diagnosis
In case of V
DSL
<-0.6V or reverse battery the current into the µC might be limited by external resitors to protect the µC
optional for
open load
in off
R
OL
1 k
to µC
BCR192W
BTS 7751 G
Data Sheet
15
2003-03-06
4
Package Outlines
1
14
15
28
18.1
-0.4
Index Marking
1)
2.45
-0.1
7.6
10.3
±0.3
-0.2
0.2
2.65 max
-0.2
1.27
0.23
+0.09
0.1
0.4
0.35 x 45°
+0.8
+0.15
0.35
2)
8° max
0.2 28x
1)
2) Does not include dambar protrusion of 0.05 max per side
1) Does not include plastic or metal protrusions of 0.15 max rer side
GPS05123
P-DSO-28-14
(Plastic Transistor Single Outline Package)
G
P
S
051
23
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book "Package Information".
Dimensions in mm
SMD = Surface Mounted Device
BTS 7751 G
Data Sheet
16
2003-03-06
Edition 2003-01
Published by Infineon Technologies AG,
St.-Martin-Strasse 53,
D-81669 München, Germany
©
Infineon Technologies AG 3/13/03.
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as a guarantee of
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infi-
neon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.