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Part Number IDT7200L

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Integrated Device Technology, Inc.
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
SEPTEMBER 1997
©
1997 Integrated Device Technology, Inc.
DSC-2679/7
1
IDT7200L
IDT7201LA
IDT7202LA
CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9, 1,024 x 9
The IDT logo is a trademark of Integrated Device Technology, Inc.
FEATURES:
·
First-In/First-Out dual-port memory
·
256 x 9 organization (IDT7200)
·
512 x 9 organization (IDT7201)
·
1,024 x 9 organization (IDT7202)
·
Low power consumption
-- Active: 770mW (max.)
--Power-down: 2.75mW (max.)
·
Ultra high speed--12ns access time
·
Asynchronous and simultaneous read and write
·
Fully expandable by both word depth and/or bit width
·
Pin and functionally compatible with 720X family
·
Status Flags: Empty, Half-Full, Full
·
Auto-retransmit capability
·
High-performance CEMOS
TM
technology
·
Military product compliant to MIL-STD-883, Class B
·
Standard Military Drawing #5962-87531, 5962-89666,
5962-89863 and 5962-89536 are listed on this function
·
Industrial temperature range (­40
°
C to +85
°
C) is
available (plastic packages only)
FUNCTIONAL BLOCK DIAGRAM
DESCRIPTION:
The IDT7200/7201/7202 are dual-port memories that load
and empty data on a first-in/first-out basis. The devices use
Full and Empty flags to prevent data overflow and underflow
and expansion logic to allow for unlimited expansion capability
in both word size and depth.
The reads and writes are internally sequential through the
use of ring pointers, with no address information required to
load and unload data. Data is toggled in and out of the devices
through the use of the Write (
W
) and Read (
R
) pins.
The devices utilize a 9-bit wide data array to allow for
control and parity bits at the user's option. This feature is
especially useful in data communications applications where
it is necessary to use a parity bit for transmission/reception
error checking. It also features a Retransmit (
RT
) capability
that allows for reset of the read pointer to its initial position
when
RT
is pulsed low to allow for retransmission from the
beginning of data. A Half-Full Flag is available in the single
device mode and width expansion modes.
These FIFOs are fabricated using IDT's high-speed CMOS
technology. They are designed for those applications requir-
ing asynchronous and simultaneous read/writes in multiproc-
essing and rate buffer applications. Military grade product is
manufactured in compliance with the latest revision of MIL-
STD-883, Class B.
For latest information contact IDT's web site at www.idt.com or fax-on-demand at 408-492-8391.
W
WRITE
CONTROL
READ
CONTROL
R
FLAG
LOGIC
EXPANSION
LOGIC
XI
WRITE
POINTER
RAM
ARRAY
256 x 9
512 x 9
1,024 x 9
READ
POINTER
DATA INPUTS
RESET
LOGIC
THREE-
STATE
BUFFERS
DATA OUTPUTS
EF
FF
XO
/
HF
RS
FL
/
RT
0
(D ­D
8
)
0
(Q ­Q
8
)
2679 drw 01
2
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATIONS
W
D
8
V
CC
D
4
1
2
28
27
D
3
D
5
3
26
D
2
D
6
4
25
D
1
D
7
5
24
D
0
FL
/
RT
6
23
XI
RS
7
22
FF
EF
8
21
Q
0
XO
/
HF
9
20
Q
1
Q
7
10
19
Q
2
Q
6
11
18
Q
3
Q
5
12
17
Q
8
Q
4
13
16
GND
R
14
15
2679 drw 02a
Reference
Order
Identifier
Code
PLASTIC DIP
(1)
P28-1
P
PLASTIC THIN DIP
P28-2
TP
CERDIP
(1)
D28-1
D
THIN CERDIP
D28-3
TD
SOIC
SO28-3
SO
CERPAK
(1)
E28-2
XE
TOP VIEW
CAPACITANCE
(T
A
= +25
°
C, f = 1.0 MHz)
Symbol
Parameter
(1)
Condition
Max.
Unit
C
IN
Input Capacitance
V
IN
= 0V
8
pF
C
OUT
Output Capacitance
V
OUT
= 0V
8
pF
NOTE:
2679 tbl 02
1. This parameter is sampled and not 100% tested.
D
2
5
D
1
6
D
0
7
XI
8
FF
9
Q
0
10
Q
1
11
NC
12
Q
2
13
D
6
D
7
NC
FL
/
RT
RS
EF
XO
/
HF
Q
7
Q
6
29
28
27
26
25
24
23
22
21
4
3
2
1
32 31 30
14 15 16 17 18 19 20
Q
3
Q
8
GND
NC
R
Q
4
Q
5
D
3
D
8
W
NC
V
CC
D
4
D
5
INDEX
2679 drw 02b
Reference
Order
Identifier
Code
LCC
(1)
L32- 1
L
PLCC
J32-1
J
TOP VIEW
ABSOLUTE MAXIMUM RATINGS
Symbol
Rating
Com'l & Ind'l
Mil.
Unit
V
TERM
Terminal Voltage
­0.5 to +7.0
­0.5 to +7.0
V
with Respect
to GND
T
STG
Storage
­55 to +125
­65 to +155
°
C
Temperature
I
OUT
DC Output
­50 to +50
­50 to +50
mA
Current
NOTE:
2679 tbl 01
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS
may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions
above those indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for extended
periods may affect reliabilty.
RECOMMENDED OPERATING
CONDITIONS
Symbol
Parameter
Min.
Typ.
Max. Unit
V
CCM
Military Supply
4.5
5.0
5.5
V
Voltage
V
CCC
Commercial Supply
4.5
5.0
5.5
V
Voltage
GND
Supply Voltage
0
0
0
V
V
IH
(1)
Input High Voltage
2.0
--
--
V
Commercial
V
IH
(1)
Input High Voltage
2.2
--
--
V
Military
V
IL
(2)
Input Low Voltage
--
--
0.8
V
Commercial and
Military
T
A
Operating Temperature
0
--
70
°
C
Commercial
T
A
Operating Temperature
­40
--
85
°
C
Industrial
T
A
Operating Temperature
­55
--
125
°
C
Military
NOTES:
2679 tbl 03
1. V
IH
= 2.6V for
XI
input (commercial).
V
IH
= 2.8V for
XI
input (military).
2. 1.5V undershoots are allowed for 10ns once per cycle.
NOTE:
1. The 600-mil-wide DIP (P28-1 and D28-1), CERPACK and LCC are not available for the 7200.
3
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS
(Commercial: V
CC
= 5V
±
10%, T
A
= 0
°
C to +70
°
C; Industrial: V
CC
= 5V
±
10%, T
A
= ­40
°
C to +85
°
C; Military: V
CC
= 5V
±
10%, T
A
= ­55
°
C to +125
°
C)
IDT7200L
IDT7200L
IDT7201LA
IDT7201LA
IDT7202LA
IDT7202LA
Com'l & Ind'l
(1)
Military
t
A
= 12, 15, 20, 25, 35 ns
t
A
= 20, 30, 40 ns
Symbol
Parameter
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
I
LI
(2)
Input Leakage Current (Any Input)
­1
--
1
­10
--
10
µ
A
I
LO
(3)
Output Leakage Current
­10
--
10
­10
--
10
µ
A
V
OH
Output Logic "1" Voltage I
OH
= ­2mA
2.4
--
--
2.4
--
--
V
V
OL
Output Logic "0" Voltage I
OL
= 8mA
--
--
0.4
--
--
0.4
V
I
CC1
(4,5,6)
Active Power Supply Current
--
--
125
--
--
140
mA
I
CC2
(4,6,7)
Standby Current (
R
=
W
=
RS
=
FL
/
RT
=V
IH
)
--
--
15
--
--
20
mA
I
CC3
(L)
(4,6,7)
Power Down Current
--
--
0.5
--
--
0.9
mA
2679 tbl 04
NOTES:
2679 tbl 05
1. Industrial temperature range product for the 25 ns speed grade is available as a standard device. All other speed grades are available by special order.
2. Measurements with 0.4
V
IN
V
CC
.
3.
R
V
IH
, 0.4
V
OUT
V
CC
.
4. Tested with outputs open (I
OUT
= 0).
5. RCLK and WCLK toggle at 20 MHz and data inputs switch at 10 MHz.
6. I
CC
measurements are made with outputs open.
7. All Inputs = V
CC
- 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz.
IDT7200L
IDT7200L
IDT7201LA
IDT7201LA
IDT7202LA
IDT7202LA
Commercial
Military
t
A
= 50 ns
t
A
= 50, 65, 80, 120 ns
Symbol
Parameter
Min.
Typ.
Max.
Min.
Typ.
Max.
Unit
I
LI
(2)
Input Leakage Current (Any Input)
­1
--
1
­10
--
10
µ
A
I
LO
(3)
Output Leakage Current
­10
--
10
­10
--
10
µ
A
V
OH
Output Logic "1" Voltage I
OH
= ­2mA
2.4
--
--
2.4
--
--
V
V
OL
Output Logic "0" Voltage I
OL
= 8mA
--
--
0.4
--
--
0.4
V
I
CC1
(4,5,6)
Active Power Supply Current
--
50
80
--
70
100
mA
I
CC2
(4,6,7)
Standby Current (
R
=
W
=
RS
=
FL
/
RT
=V
IH
)
--
5
8
--
8
15
mA
I
CC3
(L)
(4,6,7)
Power Down Current
--
--
0.5
--
--
0.9
mA
AC TEST CONDITIONS
Input Pulse Levels
GND to 3.0V
Input Rise/Fall Times
5ns
Input Timing Reference Levels
1.5V
Output Reference Levels
1.5V
Output Load
See Figure 1
2679 tbl 08
4
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS
(1)
(Commercial: V
CC
= 5V
±
10%, T
A
= 0
°
C to +70
°
C; Industrial: V
CC
= 5V
±
10%, T
A
= ­40
°
C to +85
°
C; Military: V
CC
= 5V
±
10%, T
A
= ­55
°
C to +125
°
C)
Commercial
Com'l & Mil. Com'l & Ind'l
(2)
Military
Com'l
7200L12
7200L15
7200L20
7200L25
7200L30
7200L35
7201LA12 7201LA15
7201LA20
7201LA25
7201LA30 7201LA35
7202LA12 7202LA15
7202LA20
7202LA25
7202LA30 7202LA35
Symbol
Parameter
Min. Max. Min. Max.
Min.
Max.
Min.
Max.
Min. Max. Min. Max. Unit
t
S
Shift Frequency
--
50
--
40
--
33.3
--
28.5
--
25
--
22.2 MHz
t
RC
Read Cycle Time
20
--
25
--
30
--
35
--
40
--
45
--
ns
t
A
Access Time
--
12
--
15
--
20
--
25
--
30
--
35
ns
t
RR
Read Recovery Time
8
--
10
--
10
--
10
--
10
--
10
--
ns
t
RPW
Read Pulse Width
(3)
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
RLZ
Read Pulse Low to Data Bus at Low Z
(4)
3
--
5
--
5
--
5
--
5
--
5
--
ns
t
WLZ
Write Pulse High to Data Bus at Low Z
(4,5)
3
--
5
--
5
--
5
--
5
--
10
--
ns
t
DV
Data Valid from Read Pulse High
5
--
5
--
5
--
5
--
5
--
5
--
ns
t
RHZ
Read Pulse High to Data Bus at High Z
(4)
--
12
--
15
--
15
--
18
--
20
--
20
ns
t
WC
Write Cycle Time
20
--
25
--
30
--
35
--
40
--
45
--
ns
t
WPW
Write Pulse Width
(3)
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
WR
Write Recovery Time
8
--
10
--
10
--
10
--
10
--
10
--
ns
t
DS
Data Set-up Time
9
--
11
--
12
--
15
--
18
--
18
--
ns
t
DH
Data Hold Time
0
--
0
--
0
--
0
--
0
--
0
--
ns
t
RSC
Reset Cycle Time
20
--
25
--
30
--
35
--
40
--
45
--
ns
t
RS
Reset Pulse Width
(3)
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
RSS
Reset Set-up Time
(4)
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
RSR
Reset Recovery Time
8
--
10
--
10
--
10
--
10
--
10
--
ns
t
RTC
Retransmit Cycle Time
20
--
25
--
30
--
35
--
40
--
45
--
ns
t
RT
Retransmit Pulse Width
(3)
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
RTS
Retransmit Set-up Time
(4)
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
RTR
Retransmit Recovery Time
8
--
10
--
10
--
10
--
10
--
10
--
ns
t
EFL
Reset to Empty Flag Low
--
12
--
25
--
30
--
35
--
40
--
45
ns
t
HFH,FFH
Reset to Half-Full and Full Flag High
--
17
--
25
--
30
--
35
--
40
--
45
ns
t
RTF
Retransmit Low to Flags Valid
--
20
--
25
--
30
--
35
--
40
--
45
ns
t
REF
Read Low to Empty Flag Low
--
12
--
15
--
20
--
25
--
30
--
30
ns
t
RFF
Read High to Full Flag High
--
14
--
15
--
20
--
25
--
30
--
30
ns
t
RPE
Read Pulse Width after
EF
High
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
WEF
Write High to Empty Flag High
--
12
--
15
--
20
--
25
--
30
--
30
ns
t
WFF
Write Low to Full Flag Low
--
14
--
15
--
20
--
25
--
30
--
30
ns
t
WHF
Write Low to Half-Full Flag Low
--
17
--
25
--
30
--
35
--
40
--
45
ns
t
RHF
Read High to Half-Full Flag High
--
17
--
25
--
30
--
35
--
40
--
45
ns
t
WPF
Write Pulse Width after
FF
High
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
XOL
Read/Write to
XO
Low
--
12
--
15
--
20
--
25
--
30
--
35
ns
t
XOH
Read/Write to
XO
High
--
12
--
15
--
20
--
25
--
30
--
35
ns
t
XI
XI
Pulse Width
(3)
12
--
15
--
20
--
25
--
30
--
35
--
ns
t
XIR
XI
Recovery Time
8
--
10
--
10
--
10
--
10
--
10
--
ns
t
XIS
XI
Set-up Time
8
--
10
--
10
--
10
--
10
--
10
--
ns
NOTES:
2679 tbl 06
1. Timings referenced as in AC Test Conditions.
3. Pulse widths less than minimum value are not allowed.
2. Industrial temperature range is available by special order for
4. Values guaranteed by design, not currently tested.
speed grades faster than 25ns.
5. Only applies to read data flow-through mode.
5
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
AC ELECTRICAL CHARACTERISTICS
(1)
(Continued)
(Commercial: V
CC
= 5V
±
10%, T
A
= 0
°
C to +70
°
C; Industrial: V
CC
= 5V
±
10%, T
A
= ­40
°
C to +85
°
C; Military: V
CC
= 5V
±
10%, T
A
= ­55
°
C to +125
°
C)
Military
Com'l & Mil.
Military
(2)
7200 L40
7200L50
7200L65
7200L80
7200L120
7201LA40
7201LA50
7201LA65
7201LA80
7201LA120
7202LA40
7202LA50
7202LA65
7202LA80
7202LA120
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Unit
t
S
Shift Frequency
--
20
--
15
--
12.5
--
10
--
7
MHz
t
RC
Read Cycle Time
50
--
65
--
80
--
100
--
140
--
ns
t
A
Access Time
--
40
--
50
--
65
--
80
--
120
ns
t
RR
Read Recovery Time
10
--
15
--
15
--
20
--
20
--
ns
t
RPW
Read Pulse Width
(3)
40
--
50
--
65
--
80
--
120
--
ns
t
RLZ
Read Pulse Low to Data Bus at Low Z
(4)
5
--
10
--
10
--
10
--
10
--
ns
t
WLZ
Write Pulse High to Data Bus at Low Z
(4, 5)
10
--
15
--
15
--
20
--
20
--
ns
t
DV
Data Valid from Read Pulse High
5
--
5
--
5
--
5
--
5
--
ns
t
RHZ
Read Pulse High to Data Bus at High Z
(4)
--
25
--
30
--
30
--
30
--
35
ns
t
WC
Write Cycle Time
50
--
65
--
80
--
100
--
140
--
ns
t
WPW
Write Pulse Width
(3)
40
--
50
--
65
--
80
--
120
--
ns
t
WR
Write Recovery Time
10
--
15
--
15
--
20
--
20
--
ns
t
DS
Data Set-up Time
20
--
30
--
30
--
40
--
40
--
ns
t
DH
Data Hold Time
0
--
5
--
10
--
10
--
10
--
ns
t
RSC
Reset Cycle Time
50
--
65
--
80
--
100
--
140
--
ns
t
RS
Reset Pulse Width
(3)
40
--
50
--
65
--
80
--
120
--
ns
t
RSS
Reset Set-up Time
(4)
40
--
50
--
65
--
80
--
120
--
ns
t
RSR
Reset Recovery Time
10
--
15
--
15
--
20
--
20
--
ns
t
RTC
Retransmit Cycle Time
50
--
65
--
80
--
100
--
140
--
ns
t
RT
Retransmit Pulse Width
(3)
40
--
50
--
65
--
80
--
120
--
ns
t
RTS
Retransmit Set-up Time
(4)
40
--
50
--
65
--
80
--
120
--
ns
t
RTR
Retransmit Recovery Time
10
--
15
--
15
--
20
--
20
--
ns
t
EFL
Reset to Empty Flag Low
--
50
--
65
--
80
--
100
--
140
ns
t
HFH,FFH
Reset to Half-Full and Full Flag High
--
50
--
65
--
80
--
100
--
140
ns
t
RTF
Retransmit Low to Flags Valid
--
50
--
65
--
80
--
100
--
140
ns
t
REF
Read Low to Empty Flag Low
--
30
--
45
--
60
--
60
--
60
ns
t
RFF
Read High to Full Flag High
--
35
--
45
--
60
--
60
--
60
ns
t
RPE
Read Pulse Width after
EF
High
40
--
50
--
65
--
80
--
120
--
ns
t
WEF
Write High to Empty Flag High
--
35
--
45
--
60
--
60
--
60
ns
t
WFF
Write Low to Full Flag Low
--
35
--
45
--
60
--
60
--
60
ns
t
WHF
Write Low to Half-Full Flag Low
--
50
--
65
--
80
--
100
--
140
ns
t
RHF
Read High to Half-Full Flag High
--
50
--
65
--
80
--
100
--
140
ns
t
WPF
Write Pulse Width after
FF
High
40
--
50
--
65
--
80
--
120
--
ns
t
XOL
Read/Write to
XO
Low
--
40
--
50
--
65
--
80
--
120
ns
t
XOH
Read/Write to
XO
High
--
40
--
50
--
65
--
80
--
120
ns
t
XI
XI
Pulse Width
(3)
40
--
50
--
65
--
80
--
120
--
ns
t
XIR
XI
Recovery Time
10
--
10
--
10
--
10
--
10
--
ns
t
XIS
XI
Set-up Time
10
--
15
--
15
--
15
--
15
--
ns
NOTES:
2679 tbl 07
1. Timings referenced as in AC Test Conditions
4. Values guaranteed by design, not currently tested.
2. Speed grades 65, 80 and 120 not available in the CERPACK
5. Only applies to read data flow-through mode.
3. Pulse widths less than minimum value are not allowed.
6
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
ongoing write operations. After Read Enable (
R
) goes high,
the Data Outputs (Q
0
­ Q
8
) will return to a high impedance
condition until the next Read operation. When all data has
been read from the FIFO, the Empty Flag (
EF
) will go low,
allowing the "final" read cycle but inhibiting further read
operations with the data outputs remaining in a high imped-
ance state. Once a valid write operation has been accom-
plished, the Empty Flag (
EF
) will go high after t
WEF
and a valid
Read can then begin. When the FIFO is empty, the internal
read pointer is blocked from
R
so external changes in
R
will not
affect the FIFO when it is empty.
FIRST LOAD/RETRANSMIT (
FL
FL
/
RT
RT
)
This is a dual-purpose input. In the Depth Expansion Mode,
this pin is grounded to indicate that it is the first loaded (see
Operating Modes). In the Single Device Mode, this pin acts as
the restransmit input. The Single Device Mode is initiated by
grounding the Expansion In (
XI
).
The IDT7200/7201A/7202A can be made to retransmit
data when the Retransmit Enable control (
RT
) input is pulsed
low. A retransmit operation will set the internal read pointer to
the first location and will not affect the write pointer. Read
Enable (
R
) and Write Enable (
W
) must be in the high state
during retransmit. This feature is useful when less than 256/
512/1,024 writes are performed between resets. The retrans-
mit feature is not compatible with the Depth Expansion Mode
and will affect the Half-Full Flag (
HF
), depending on the
relative locations of the read and write pointers.
EXPANSION IN (
XI
XI
)
This input is a dual-purpose pin. Expansion In (
XI
) is
grounded to indicate an operation in the single device mode.
Expansion In (
XI
) is connected to Expansion Out (
XO
) of the
previous device in the Depth Expansion or Daisy Chain Mode.
OUTPUTS:
FULL FLAG (
FF
FF
)
The Full Flag (
FF
) will go low, inhibiting further write
operation, when the write pointer is one location less than the
read pointer, indicating that the device is full. If the read
pointer is not moved after Reset (
RS
), the Full-Flag (
FF
) will go
low after 256 writes for IDT7200, 512 writes for the IDT7201A
and 1,024 writes for the IDT7202A.
EMPTY FLAG (
EF
EF
)
The Empty Flag (
EF
) will go low, inhibiting further read
operations, when the read pointer is equal to the write pointer,
indicating that the device is empty.
EXPANSION OUT/HALF-FULL FLAG (
XO
XO
/
HF
HF
)
This is a dual-purpose output. In the single device mode,
when Expansion In (
XI
) is grounded, this output acts as an
indication of a half-full memory.
After half of the memory is filled and at the falling edge of
the next write operation, the Half-Full Flag (
HF
) will be set low
and will remain set until the difference between the write
2679 drw 03
30pF*
1.1K
5V
TO
OUTPUT
PIN
680
or equivalent circuit
Figure 1. Output Load
* Includes scope and jig capacitances.
SIGNAL DESCRIPTIONS
INPUTS:
DATA IN (D
0
­ D
8
)
Data inputs for 9-bit wide data.
CONTROLS:
RESET (
RS
RS
)
Reset is accomplished whenever the Reset (
RS
) input is
taken to a low state. During reset, both internal read and write
pointers are set to the first location. A reset is required after
power up before a write operation can take place. Both the
Read Enable (
RR
) and Write Enable (
W
W
) inputs must be in
the high state during the window shown in Figure 2, (i.e.,
t
RSS
before the rising edge of
RS
RS
) and should not change
until t
RSR
after the rising edge of
RS
RS
. Half-Full Flag (
HF
HF
)
will be reset to high after Reset (
RS
RS
).
WRITE ENABLE (
W
W
)
A write cycle is initiated on the falling edge of this input if the
Full Flag (
FF
) is not set. Data set-up and hold times must be
adhered to with respect to the rising edge of the Write Enable
(
W
). Data is stored in the RAM array sequentially and
independently of any on-going read operation.
After half of the memory is filled and at the falling edge of
the next write operation, the Half-Full Flag (
HF
) will be set to
low and will remain set until the difference between the write
pointer and read pointer is less than or equal to one half of the
total memory of the device. The Half-Full Flag (
HF
) is then
reset by the rising edge of the read operation.
To prevent data overflow, the Full Flag (
FF
) will go low,
inhibiting further write operations. Upon the completion of a
valid read operation, the Full Flag (
FF
) will go high after t
RFF
,
allowing a valid write to begin. When the FIFO is full, the
internal write pointer is blocked from
W
, so external changes
in
W
will not affect the FIFO when it is full.
READ ENABLE (
RR
)
A read cycle is initiated on the falling edge of the Read
Enable (
R
) provided the Empty Flag (
EF
) is not set. The data
is accessed on a First-In/First-Out basis, independent of any
7
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
pointer and read pointer is less than or equal to one half of the
total memory of the device. The Half-Full Flag (
HF
) is then
reset by using rising edge of the read operation.
In the Depth Expansion Mode, Expansion In (
XI
) is con-
nected to Expansion Out (
XO
) of the previous device. This
output acts as a signal to the next device in the Daisy Chain
by providing a pulse to the next device when the previous
device reaches the last location of memory.
DATA OUTPUTS (Q
0
­ Q
8
)
Data outputs for 9-bit wide data. This data is in a high
impedance condition whenever Read (
R
) is in a high state.
W
RS
R
EF
HF
,
FF
t
RSC
t
RS
t
RSS
t
RSS
t
RSR
t
EFL
t
HFH
, t
FFH
2679 drw 04
NOTES:
1.
EF
,
FF
,
HF
may change status during Reset, but flags will be valid at t
RSC
.
2.
W
and
R
= V
IH
around the rising edge of
RS
.
Figure 2. Reset
LAST WRITE
R
IGNORED
WRITE
FIRST READ
ADDITIONAL
READS
FIRST
WRITE
W
FF
t
WFF
t
RFF
2679 drw 06
Figure 4. Full Flag From Last Write to First Read
t
A
R
t
RC
DATA OUT VALID
DATA OUT VALID
t
RPW
t
RLZ
t
DV
t
A
t
RHZ
t
RR
t
WC
t
WR
t
WPW
DATA IN VALID
DATA IN VALID
t
DS
t
DH
Q
0
­ Q
8
2679 drw 05
W
D
0
­ D
8
Figure 3. Asynchronous Write and Read Operation
8
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
LAST READ
R
IGNORED
READ
FIRST WRITE
ADDITIONAL
WRITES
FIRST
READ
W
EF
t
WEF
2679 drw 07
VALID
VALID
t
A
DATA OUT
REF
t
Figure 5. Empty Flag From Last Read to First Write
Figure 8. Minimum Timing for an Full Flag Coincident Write Pulse
FF
R
W
t
RFF
t
WPF
2679 drw 10
EF
W
R
t
WEF
t
RPE
2679 drw 09
Figure 7. Minimum Timing for an Empty Flag Coincident Read Pulse
Figure 6. Retransmit
t
RTC
t
RT
t
RTS
RT
W
,
R
HF
,
EF
,
FF
t
RTR
FLAG VALID
2679 drw 08
RTF
t
9
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
R
W
HF
t
RHF
2679 drw 11
HALF-FULL OR LESS
MORE THAN HALF-FULL
HALF-FULL OR LESS
t
WHF
Figure 9. Half-Full Flag Timing
R
W
XO
2679 drw 12
WRITE TO
LAST PHYSICAL
LOCATION
t
XOL
t
XOH
READ FROM
LAST PHYSICAL
LOCATION
t
XOL
t
XOH
Figure 10. Expansion Out
W
R
XI
WRITE TO
FIRST PHYSICAL
LOCATION
t
XIS
READ FROM
FIRST PHYSICAL
LOCATION
t
XIS
t
XI
t
XIR
2679 drw 13
Figure 11. Expansion In
OPERATING MODES:
Care must be taken to assure that the appropriate flag is
monitored by each system (i.e.
FF
is monitored on the device
where
W
is used;
EF
is monitored on the device where
R
is
used). For additional information, refer to Tech Note 8:
Oper-
ating FIFOs on Full and Empty Boundary Conditions
and
Tech Note 6:
Designing with FIFOs.
Single Device Mode
A single IDT7200/7201A/7202A may be used when the
application requirements are for 256/512/1,024 words or less.
These devices are in a Single Device Configuration when the
Expansion In (
XI
) control input is grounded (see Figure 12).
Depth Expansion
The IDT7200/7201A/7202A can easily be adapted to appli-
cations when the requirements are for greater than 256/512/
1,024 words. Figure 14 demonstrates Depth Expansion using
three IDT7200/7201A/7202As. Any depth can be attained by
adding additional IDT7200/7201A/7202As. These FIFOs
operate in the Depth Expansion mode when the following
conditions are met:
1. The first device must be designated by grounding the First
Load (
FL
) control input.
2. All other devices must have
FL
in the high state.
3. The Expansion Out (
XO
) pin of each device must be tied
to the Expansion In (
XI
) pin of the next device. See Figure
14.
4. External logic is needed to generate a composite Full Flag
(
FF
) and Empty Flag (
EF
). This requires the ORing of all
EF
s and ORing of all
FF
s (i.e. all must be set to generate
the correct composite
FF
or
EF
). See Figure 14.
5. The Retransmit (
RT
) function and Half-Full Flag (
HF
) are
not available in the Depth Expansion Mode.
For additional information, refer to Tech Note 9:
Cascad-
ing FIFOs or FIFO Modules.
10
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
USAGE MODES:
Width Expansion
Word width may be increased simply by connecting the
corresponding input control signals of multiple devices. Sta-
tus flags (
EF
,
FF
and
HF
) can be detected from any one
device. Figure 13 demonstrates an 18-bit word width by using
two IDT7200/7201A/7202As. Any word width can be attained
by adding additional IDT7200/7201A/7202As (Figure 13).
Bidirectional Operation
Applications which require data buffering between two
systems (each system capable of Read and Write operations)
can be achieved by pairing IDT7200/7201A/7202As as shown
in Figure 16. Both Depth Expansion and Width Expansion
may be used in this mode.
Data Flow-Through
Two types of flow-through modes are permitted, a read
flow-through and write flow-through mode. For the read flow-
through mode (Figure 17), the FIFO permits a reading of a
single word after writing one word of data into an empty FIFO.
The data is enabled on the bus in (t
WEF
+ t
A
) ns after the rising
edge of
W
, called the first write edge, and it remains on the
bus until the
R
line is raised from low-to-high, after which the
bus would go into a three-state mode after t
RHZ
ns. The
EF
line
would have a pulse showing temporary deassertion and then
would be asserted.
In the write flow-through mode (Figure 18), the FIFO
permits the writing of a single word of data immediately after
reading one word of data from a full FIFO. The
R
line causes
the
FF
to be deasserted but the
W
line being low causes it to
be asserted again in anticipation of a new data word. On the
rising edge of
W
, the new word is loaded in the FIFO. The
W
line must be toggled when
FF
is not asserted to write new data
in the FIFO and to increment the write pointer.
Compound Expansion
The two expansion techniques described above can be
applied together in a straightforward manner to achieve large
FIFO arrays (see Figure 15).
IDT
7200/
7201A/
7202A
XI
XI
9
9
18
9
18
HF
HF
9
DATA
WRITE (
W
)
FULL FLAG (
FF
)
RESET (
RS
)
(D)
IN
READ (
R
)
EMPTY FLAG (
EF
)
RETRANSMIT (
RT
)
DATA
(Q)
OUT
IDT
7200/
7201A/
7202A
Figure 13. Block Diagram of 256 x 18, 512 x 18, 1,024 x 18 FIFO Memory Used in Width Expansion Mode
WRITE (
W
)
DATA IN (D)
FULL FLAG (
FF
)
RESET (
RS
)
9
READ (
R
)
9
DATA OUT (Q)
EMPTY FLAG (
EF
)
RETRANSMIT (
RT
)
EXPANSION IN (
XI
)
(
HF
)
IDT
7200/
7201A/
7202A
(HALF­FULL FLAG)
2679 drw 14
Figure 12. Block Diagram of Single 256 x 9, 512 x 9, 1,024 x 9 FIFO
2679 drw 15
11
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
TABLE I--RESET AND RETRANSMIT
Single Device Configuration/Width Expansion Mode
Inputs
Internal Status
Outputs
Mode
RS
RS
RT
RT
XI
XI
Read Pointer
Write Pointer
EF
EF
FF
FF
HF
HF
Reset
0
X
0
Location Zero
Location Zero
0
1
1
Retransmit
1
0
0
Location Zero
Unchanged
X
X
X
Read/Write
1
1
0
Increment
(1)
Increment
(1)
X
X
X
NOTE:
2679 tbl 09
1. Pointer will increment if flag is High.
Figure 14. Block Diagram of 768 x 9, 1,536 x 9, 3,072 x 9 FIFO Memory (Depth Expansion)
D
W
IDT
7200/
7201A/
7202A
FF
EF
FL
XO
RS
FULL
EMPTY
V
CC
R
9
9
9
9
XI
9
Q
IDT
7200/
7201A/
7202A
IDT
7200/
7201A/
7202A
FF
EF
FL
XO
XI
FF
EF
FL
XO
XI
TABLE II--RESET AND FIRST LOAD TRUTH TABLE
Depth Expansion/Compound Expansion Mode
Inputs
Internal Status
Outputs
Mode
RS
RS
FL
FL
XI
XI
Read Pointer
Write Pointer
EF
EF
FF
FF
Reset First Device
0
0
(1)
Location Zero
Location Zero
0
1
Reset All Other Devices
0
1
(1)
Location Zero
Location Zero
0
1
Read/Write
1
X
(1)
X
X
X
X
NOTE:
2679 tbl 10
1.
XI
is connected to
XO
of previous device. See Figure 14.
RS
= Reset Input,
FL
/
RT
= First Load/Retransmit,
EF
= Empty Flag Output,
FF
= Flag Full Output,
XI
= Expansion Input,
HF
= Half-Full Flag Output
2679 drw 16
12
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
IDT7200/
IDT7201A/
IDT7202A
DEPTH
EXPANSION
BLOCK
R
,
W
,
RS
· · ·
· · ·
· · ·
D
0
­D
N
Q
0
­Q
8
Q
9
­Q
17
Q
9
­Q
17
Q
0
­Q
8
D
0
-D
8
D
9
-D
N
D
9
-D
17
D
18
-D
N
D
(N-8)
-D
N
D
(N-8)
-D
N
Q
(N-8)
-Q
N
Q
(N-8)
-Q
N
IDT7200/
IDT7201A/
IDT7202A
DEPTH
EXPANSION
BLOCK
IDT7200/
IDT7201A/
IDT7202A
DEPTH
EXPANSION
BLOCK
2679 drw 17
Figure 15. Compound FIFO Expansion
NOTES:
1. For depth expsansion block see section on Depth Expansion and Figure 14.
2. For Flag detection see section on Width Expansion and Figure 13.
Figure 17. Read Data Flow-Through Mode
W
DATA
R
t
RPE
IN
EF
DATA
OUT
t
WLZ
t
WEF
t
A
t
REF
DATA VALID
OUT
2679 drw 19
Figure 16. Bidirectional FIFO Mode
IDT
7201A
R
B
EF
B
HF
B
W
A
FF
A
W
B
FF
B
SYSTEM A
SYSTEM B
Q
B 0-8
D
B 0-8
Q
A 0-8
R
A
HF
A
EF
A
IDT
7200/
7201A/
7202A
D
A 0-8
IDT
7200/
7201A/
7202A
2679 drw 18
13
IDT7200/7201A/7202A CMOS ASYNCHRONOUS FIFO
256 x 9, 512 x 9 and 1,024 x 9
MILITARY, INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES
R
DATA
W
IN
FF
DATA
OUT
t
DS
t
DH
t
A
t
WFF
t
RFF
t
WPF
DATA
IN
VALID
DATA
OUT
VALID
2679 drw 20
Figure 18. Write Data Flow-Through Mode
NOTES:
1. Industrial temperature range is available for plastic packages by special order for speed grades faster than 25 ns.
2. "A" to be included for 7201 and 7202 ordering part number.
IDT
XXXX
Device Type
XXX
Speed
X
Power
X
Package
X
Process/
Temperature
Range
Blank
I
B
7200
7201
7202
12
15
20
25
30
35
40
50
65
80
120
Commercial (0
°
C to +70
°
C)
Industrial (­40
°
C to +85
°
C)
Military (­55
°
C to +125
°
C)
Compliant to MIL-STD-883, Class B
256 x 9-Bit FIFO
512 x 9-Bit FIFO
1,024 x 9-Bit FIFO
Commercial Only
Commercial Only
Commercial and Industrial
Military Only
Commercial Only
Military Only
LA
Low Power
P
TP
D
TD
J
SO
L
XE
Plastic DIP
Plastic Thin DIP
CERDIP
Thin CERDIP
Plastic Leaded Chip Carrier
SOIC
Leadless Chip Carrier
CERPACK
Access Time (t
A
)
Speed in Nanoseconds
2679 drw 21
Military only--
except XE
package
Blank
I
B
(1)
P28-1
P28-2
D28-1
D28-3
J32-1
SO28-3
L32-1
E28-2
PLCC
LCC
(7201 & 7202 Only)
(7201 & 7202 Only)
(7201 & 7202 Only)
(7201 & 7202 Only)
(2)
ORDERING INFORMATION