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Part Number HT48E10

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HT48E10
I/O Type 8-Bit MTP MCU With EEPROM
Rev. 1.20
1
March 3, 2006
General Description
The HT48E10 is an 8-bit high performance, RISC archi-
tecture microcontroller device specifically designed for
multiple I/O control product applications.
The advantages of low power consumption, I/O flexibil-
ity, timer functions, oscillator options, HALT and
wake-up functions, watchdog timer, buzzer driver, as
well as low cost, enhance the versatility of these devices
to suit a wide range of application possibilities such as
industrial control, consumer products, subsystem con-
trollers, etc.
Features
·
Operating voltage:
f
SYS
=4MHz: 2.2V~5.5V
f
SYS
=8MHz: 3.3V~5.5V
·
Low voltage reset function
·
19 bidirectional I/O lines (max.)
·
Interrupt input shared with an I/O line
·
8-bit programmable timer/event counter with overflow
interrupt and 8-stage prescaler
·
On-chip crystal and RC oscillator
·
Watchdog Timer
·
1,000 erase/write cycles MTP program memory
·
1024
´14 program memory ROM (MTP)
·
128
´8 data memory EEPROM
·
64
´8 data memory RAM
·
Buzzer driving pair and PFD supported
·
HALT function and wake-up feature reduce power
consumption
·
4-level subroutine nesting
·
Up to 0.5
ms instruction cycle with 8MHz system clock
at V
DD
=5V
·
Bit manipulation instruction
·
14-bit table read instruction
·
63 powerful instructions
·
10
6
erase/write cycles EEPROM data memory
·
EEPROM data retention > 10 years
·
All instructions in one or two machine cycles
·
In system programming (ISP)
·
24-pin SKDIP/SOP package
Technical Document
·
Tools Information
·
FAQs
·
Application Note
-
HA0086E HT48E MCU Series - Using Assembly Language to Write to the 1K EEPROM Data Memory
-
HA0087E HT48E MCU Series - Using C Language to Write to the 1K EEPROM Data Memory
-
HA0088E HT48E MCU Series - Using Assembly Language to Write to the 2K EEPROM Data Memory
-
HA0089E HT48E MCU Series - Using C Language to Write to the 2K EEPROM Data Memory
Block Diagram
Pin Assignment
HT48E10
Rev. 1.20
2
March 3, 2006
P C 0 / I N T
O S C 2
O S C 1
R E S
V D D
M U X
P A C
P A
P O R T A
P C 1 / T M R
W D T S
P B C
P B
P O R T B
P B 0 ~ P B 7
T M R
T M R C
V S S
P r e s c a l e r
f
S Y S
B Z / B Z
P C 0
P C 1
P r o g r a m
M e m o r y
P r o g r a m
C o u n t e r
I n t e r r u p t
C i r c u i t
S T A C K
I N T C
D A T A
M e m o r y
I n s t r u c t i o n
R e g i s t e r
M
U
X
I n s t r u c t i o n
D e c o d e r
S T A T U S
A L U
S h i f t e r
T i m i n g
G e n e r a t o r
A C C
W D T O S C
W D T P r e s c a l e r
M
U
X
M
U
X
M P
E N / D I S
W D T
P C C
P C
P O R T C
P C 0 ~ P C 4
S Y S C L K / 4
P A 0 ~ P A 7
P C 3
P C 4
D a t a M e m o r y
E E P R O M
E E C R
2 4
2 3
2 2
2 1
2 0
1 9
1 8
1 7
1 6
1 5
1 4
1 3
1
2
3
4
5
6
7
8
9
1 0
1 1
1 2
H T 4 8 E 1 0
2 4 S K D I P - A / S O P - A
P B 6
P B 7
P A 4
P A 5
P A 6
P A 7
O S C 2
O S C 1
V D D
R E S
P C 2
P C 1 / T M R
P B 5
P B 4
P A 3
P A 2
P A 1
P A 0
P B 3
P B 2
P B 1 / B Z
P B 0 / B Z
V S S
P C 0 / I N T
Pad Description
Pad Name
I/O
Options
Description
PA0~PA7
I/O
Pull-high*
Wake-up
Schmitt trigger
Input
Bidirectional 8-bit input/output port. Each bit can be configured as a wake-up
input by options. Software instructions determine the CMOS output or Schmitt
trigger input with pull-high resistor (determined by pull-high options).
PB0/BZ
PB1/BZ
PB2~PB7
I/O
Pull-high*
PB0 or BZ
PB1 or BZ
Bidirectional 8-bit input/output port. Software instructions determine the
CMOS output or Schmitt trigger input with pull-high resistor (determined by
pull-high options).
The PB0 and PB1 are pin-shared with BZ and BZ, respectively. Once the
PB0 or PB1 is selected as buzzer driving outputs, the output signals come
from an internal PFD generator (shared with timer/event counter).
VSS
¾
¾
Negative power supply, ground
PC0/INT
PC1/TMR
PC2
I/O
Pull-high*
Bidirectional I/O lines. Software instructions determine the CMOS output or
Schmitt trigger input with pull-high resistor (determined by 1-bit pull-high op-
tions). The external interrupt and timer input are pin-shared with PC0 and
PC1, respectively. The external interrupt input is activated on a high to low
transition.
RES
I
¾
Schmitt trigger reset input. Active low.
VDD
¾
¾
Positive power supply
OSC1
OSC2
I
O
Crystal or RC
OSC1and OSC2 are connected to an RC network or Crystal (determined by
options) for the internal system clock. In the case of RC operation, OSC2 is
the output terminal for 1/4 system clock.
Note:
²*² All pull-high resistors are controlled by an option bit.
Absolute Maximum Ratings
Supply Voltage ...........................V
SS
-0.3V to V
SS
+6.0V
Storage Temperature ............................
-50°C to 125°C
Input Voltage..............................V
SS
-0.3V to V
DD
+0.3V
Operating Temperature...........................
-40°C to 85°C
Note: These are stress ratings only. Stresses exceeding the range specified under
²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.
D.C. Characteristics
Ta=25
°C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
DD
Conditions
V
DD
Operating Voltage
¾
f
SYS
=4MHz
2.2
¾
5.5
V
¾
f
SYS
=8MHz
3.3
¾
5.5
V
I
DD1
Operating Current (Crystal OSC)
3V
No load, f
SYS
=4MHz
¾
0.6
1.5
mA
5V
¾
2
4
mA
I
DD2
Operating Current (RC OSC)
3V
No load, f
SYS
=4MHz
¾
0.8
1.5
mA
5V
¾
2.5
4
mA
I
DD3
Operating Current
(Crystal OSC, RC OSC)
5V
No load, f
SYS
=8MHz
¾
4
8
mA
I
STB1
Standby Current (WDT Enabled)
3V
No load*, system HALT
¾
¾
10
mA
5V
¾
¾
15
mA
HT48E10
Rev. 1.20
3
March 3, 2006
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
DD
Conditions
I
STB2
Standby Current (WDT Disabled)
3V
No load*, system HALT
¾
¾
3
mA
5V
¾
¾
5
mA
V
IL1
Input Low Voltage for I/O Ports
¾
¾
0
¾
0.3V
DD
V
V
IH1
Input High Voltage for I/O Ports
¾
¾
0.7V
DD
¾
V
DD
V
V
IL2
Input Low Voltage (RES)
¾
¾
0
¾
0.4V
DD
V
V
IH2
Input High Voltage (RES)
¾
¾
0.9V
DD
¾
V
DD
V
V
LVR
Low Voltage Reset Voltage
¾
LVR enabled
2.7
3.0
3.3
V
I
OL
I/O Port Sink Current
3V
V
OL
=0.1V
DD
4
8
¾
mA
5V
10
20
¾
mA
I
OH
I/O Port Source Current
3V
V
OH
=0.9V
DD
-2
-4
¾
mA
5V
-5
-10
¾
mA
R
PH
Pull-high Resistance
3V
¾
20
60
100
k
W
5V
¾
10
30
50
k
W
Note:
²*² All tests are conducted with the I/O pins setup as outputs and set to a low value.
A.C. Characteristics
Ta=25
°C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
V
DD
Conditions
f
SYS1
System Clock (Crystal OSC)
¾
2.2V~5.5V
400
¾
4000
kHz
¾
3.3V~5.5V
400
¾
8000
kHz
f
SYS2
System Clock (RC OSC)
¾
2.2V~5.5V
400
¾
4000
kHz
¾
3.3V~5.5V
400
¾
8000
kHz
f
TIMER
Timer I/P Frequency (TMR)
¾
2.2V~5.5V
0
¾
4000
kHz
¾
3.3V~5.5V
0
¾
8000
kHz
t
WDTOSC
Watchdog Oscillator Period
3V
¾
45
90
180
ms
5V
¾
32
65
130
ms
t
WDT1
Watchdog Time-out Period
(WDT OSC)
3V
Without WDT prescaler
11
23
46
ms
5V
8
17
33
ms
t
WDT2
Watchdog Time-out Period
(System Clock)
¾
Without WDT prescaler
¾
1024
¾
t
SYS
t
RES
External Reset Low Pulse Width
¾
¾
1
¾
¾
ms
t
SST
System Start-up Timer Period
¾
Wake-up from HALT
¾
1024
¾
t
SYS
t
INT
Interrupt Pulse Width
¾
¾
1
¾
¾
ms
HT48E10
Rev. 1.20
4
March 3, 2006
HT48E10
Rev. 1.20
5
March 3, 2006
Functional Description
Execution Flow
The HT48E10 system clock is derived from either a
crystal or an RC oscillator and is internally divided into
four non-overlapping clocks. One instruction cycle con-
sists of four system clock cycles.
Instruction fetching and execution are pipelined in such
a way that a fetch takes an instruction cycle while de-
coding and execution takes the next instruction cycle.
This pipelining scheme ensures that instructions are ef-
fectively executed in one cycle. If an instruction changes
the contents of the program counter, such as subroutine
calls or jumps, in which case, two cycles are required to
complete the instruction.
Program Counter
- PC
The program counter (PC) controls the sequence in
which the instructions stored in the program ROM are
executed and its contents specify a full range of pro-
gram memory.
After accessing a program memory word to fetch an in-
struction code, the contents of the program counter are
incremented by one. The program counter then points to
the memory word containing the next instruction code.
When executing a jump instruction, conditional skip ex-
ecution, loading into the PCL register, subroutine call or
return from subroutine, initial reset, internal interrupt,
external interrupt or return from interrupt, the PC man-
ages the program transfer by loading the address corre-
sponding to each instruction.
The conditional skip is activated by instructions. Once
the condition is met, the next instruction, fetched during
the current instruction execution, is discarded and a
dummy cycle replaces it to get the proper instruction.
Otherwise proceed with the next instruction.
The lower byte of the program counter (PCL) is a read-
able and writeable register (06H). Moving data into the
PCL performs a short jump. The destination will be
within the 256 locations.
When a control transfer takes place, an additional
dummy cycle is required.
Mode
Program Counter
*9
*8
*7
*6
*5
*4
*3
*2
*1
*0
Initial Reset
0
0
0
0
0
0
0
0
0
0
External Interrupt
0
0
0
0
0
0
0
1
0
0
Timer/Event Counter Overflow
0
0
0
0
0
0
1
0
0
0
Skip
Program Counter+2
Loading PCL
*9
*8
@7
@6
@5
@4
@3
@2
@1
@0
Jump, Call Branch
#9
#8
#7
#6
#5
#4
#3
#2
#1
#0
Return from Subroutine
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
Program Counter
Note: *9~*0: Program counter bits
S9~S0: Stack register bits
#9~#0: Instruction code bits
@7~@0: PCL bits
T 1
T 2
T 3
T 4
T 1
T 2
T 3
T 4
T 1
T 2
T 3
T 4
F e t c h I N S T ( P C )
E x e c u t e I N S T ( P C - 1 )
F e t c h I N S T ( P C + 1 )
E x e c u t e I N S T ( P C )
F e t c h I N S T ( P C + 2 )
E x e c u t e I N S T ( P C + 1 )
P C
P C + 1
P C + 2
S y s t e m C l o c k
O S C 2 ( R C o n l y )
P C
Execution Flow