EGP50A THRU EGP50G
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
Reverse Voltage - 50 to 400 Volts Forward Current - 5.0 Amperes
FEATURES
Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
Glass passivated cavity-free junction
Superfast recovery time for high efficiency
Low forward voltage, high
current capability
Low leakage current
High surge current capability
High temperature metallurgically bonded construction
High temperature soldering guaranteed:
300°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic over solid glass body
Terminals: Axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.03 ounce, 0.8 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
EGP
EGP
EGP
EGP
EGP
EGP
SYMBOLS
50A
50B
50C
50D
50F
50G
UNITS
Maximum recurrent peak reverse voltage
V
RRM
50
100
150
200
300
400
Volts
Maximum RMS voltage
V
RMS
35
70
105
140
210
280
Volts
Maximum DC blocking voltage
V
DC
50
100
150
200
300
400
Volts
Maximum average forward rectified current
0.375" (9.5mm) lead length at T
L
=55°C
I
(AV)
5.0 Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load
I
FSM
150.0
Amps
Maximum instantaneous forward voltage at 5.0A
V
F
0.95 1.25
Volts
Maximum DC reverse current
T
A
=25°C 5.0
at rated DC blocking voltage
T
A
=125°C
I
R
50.0
µ
A
Maximum reverse recovery time
(NOTE 1)
trr
50.0
ns
Typical thermal resistance
(NOTE 2)
R
JA
20.0
R
JL
5.0
°C\W
Typical junction capacitance
(NOTE 3)
C
J
95
75
pF
Operating junction and storage temperature range
T
J,
T
STG
-65 to +150
°C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, Irr=0.25A
(2) Thermal resistance from junction to ambient and from junction of lead at 0.375" (9.5mm) lead length,
both leads measured attached to heat sinks
(3) Measured at 1.0 MH
Z
and applied reverse voltage of 4.0 Volts
4/98
Case Style GP20
Dimensions in inches and (millimeters)
*
Glass-plastic encapsulation technique is covered by
Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306
P
A
TENT
ED*
®
0.210 (5.3)
0.190 (4.8)
DIA.
0.042 (1.07)
0.037 (0.94)
DIA.
1.0 (25.4)
MIN.
0.375 (9.5)
0.285 (7.2)
1.0 (25.4)
MIN.
175
1
10
100
0
25
50
75
100
125
150
6.0
0
25
50
75
100
125
150
175
0
1.0
2.0
3.0
4.0
5.0
0.4
0.6
0.8
1.2
1.4
1.6
1.8
1.0
0.01
0.1
1
10
50
0.2
0.01
0.1
1
10
100
0.1
1.0
10
100
0.1
1
10
100
1,000
0
30
60
90
120
150
180
210
0
20
40
60
80
100
0.001
0.01
0.1
1
10
100
FIG. 1 - MAXIMUM FORWARD CURRENT
DERATING CURVE
LEAD TEMPERATURE, °C
A
VERA
GE FOR
W
ARD RECTIFIED
CURRENT
, AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
NUMBER OF CYCLES AT 60 H
Z
PEAK FOR
W
ARD SURGE CURRENT
,
AMPERES
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE LEAKAGE
CHARACTERISTICS
INST
ANT
ANEOUS FOR
W
ARD CURRENT
,
AMPERES
INST
ANT
ANEOUS REVERSE LEAKA
GE CURRENT
,
MICR
O
AMPERES
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAP
A
CIT
ANCE, pF
REVERSE VOLTAGE, VOLTS
T
J
=T
J
max.
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
T
J
=150°C
T
J
=125°C
T
J
=75°C
T
J
=25°C
T
J
=25°C
T
J
=150°C
PULSE WIDTH=300
µ
s
1% DUTY CYCLE
T
J
=25°C
f=1.0 MH
Z
Vsig=50mVp-p
RESISTIVE OR
INDUCTIVE LOAD
COPPER HEATSINKS
0.375" (9.5mm)
T
L
RATINGS AND CHARACTERISTIC CURVES EGP50A THRU EGP50G
EGP50A - EGP50D
EGP50F & EGP50G
EGP50A-EGP50D
EGP50F & EGP50G
FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
TRANSIENT THERMAL
IMPED
ANCE,
°
CW
t, PULSE DURATION, sec.
L
1
PDF 
ZIP