© Freescale Semiconductor, Inc., 2004. All rights reserved.
Freescale Semiconductor
Technical Data
MRFIC1505
Rev. 1, 08/2004
MRFIC1505/MRFIC1505A Integrated GPS
Downconverter
1.575 GHz GPS DOWNCONVERTER
This integrated circuit is intended for GPS receiver applications. The dual conversion design is implemented in Motorola's
lowcost, highperformance MOSAIC 5
. silicon bipolar process and is packaged in a lowcost surface mount LQFP48 package.
In addition to the mixers, a VCO, PLL, Crystal Oscillator, A/D converter and a loop filter are integrated onchip. Output IF is
nominally 4.1 MHz.
·
105 dB Typical Conversion Gain
·
2.7 V Operation
·
28 mA Typical Current Consumption
·
LowCost, LowProfile Plastic LQFP Package
MOSAIC 5 is a trademark of Motorola, Inc.
Ordering Information
Device
Operating Temperature
Range
Package
MRFIC1505R2
T
A
= 40 to 85
°
C
LQFP-48
MRFIC1505AR2
T
A
= 40 to 85
°
C
LQFP-48
Plastic Package
Case 932
(LQFP-48)
2
Freescale Semiconductor
Maximum Ratings
Rating
Symbol
Value
Unit
DC Supply Voltage
V
DD
5.0
Vdc
DC Supply Current
I
DD
60
mA
Operating Ambient Temperature
T
A
40 to 85
°C
Storage Temperature Range
T
stg
65 to 150
°C
Lead Soldering Temperature Range
260
°C
Note: Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the limits in the Electrical Characteristics tables.
Electrical Characteristics
(VCC = 2.7 to 3.3 V; TA = 40 to 85
°C; Enable = 2.7 V unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Total Device
Supply Voltage
V
CC
2.7
3.0
3.3
V
Supply Current
(TA = 25
°C, VCC = 2.7 V, Enable = 2.7V)
I
CC
28
36
mA
Supply Current
(TA = 25
°C, VCC = 2.7 V, Enable = 2.7V)
I
CC
2.0
4.0
mA
RF Amplifier
RF Input Frequency
f
in
1575.42
MHz
Input Impedance
Z
in
50
Input VSWR
VSWR
in
2.0
Gain
G
13
15
dB
Noise Figure
NF
2.0
dB
1.0 dB Compression (Measured at Output)
P
1dB
1.0
dBm
First Mixer
Input Frequency
f
in
1575.42
MHz
Gain
G
10
14
dB
Noise Figure
NF
13
dB
1.0 dB compression (Measured at Output)
P
1dB
-13
dBm
First Local Oscillator Frequency
f
LO1
1636.8
MHz
First Intermediate Frequenc
f
IF1
61.38
MHz
LO Leakage at IF Port
-40
dBm
LO Leakage at RF Port
-50
dBm
Output Impedance
Z
out
50
First IF Amplifier and Second Mixer
Input Frequency
f
in
61.38
MHz
Input Impedance
Z
in
230
Output Impedance
Z
out
50
Second Local Oscillator Frequency
f
LO2
65.47
MHz
Second Intermediate Frequency
f
IF2
4.092
MHz
LO Leakage at IF Port
-40
dBm
Gain
G
40
43
dB
Cascaded Noise Figure
NF
9.3
dB
1.0 dB Compression Point (Measured at Output)
P
1dB
-13
dBm
Limiting Amplifier
Second Intermediate Frequency
f
IF2
4.092
MHz
Input Signal Level
4.0
11
31
Mv
Output Voltage Swing (into 10 pf ll100 k
V
out
800
mVpp
DC Output Level
1.4
V
Gain
G
50
dB
Reference Oscillator
Reference Frequency
f
r
16.368
MHz
Reference Frequency Input Level (Crystal Output Pin)
500
mVpp
Freescale Semiconductor
3
Reference Oscillator Output Voltage Level (Into 15 pf II 10 k
)
750
mVpp
Reference Clock Input Drive Level
400
800
1500
mVpp
PLL
First Local Oscillator Frequency
f
LO1
1636.8
MHz
Second Local Oscillator Frequency
f
LO2
65.47
MHz
VCO C/N (at 10 kHz Offset)
-80
dBc/Hz
VCO Gain (TBD Varactor)
200
MHz/V
Enable
Enable Active Level
0.8 x V
CC
V
CC
V
Disable Active Level
0
0.2 x V
CC
V
Voltage Regulator
Regulator Output Voltage
(V
CC
= 2.7 to 3.3 V, I
out
= 3.0 mA)
V
O
2.1
2.3
2.5
V
MRFIC505 Temperature Sense Specs
Temperature Sensor Output Voltage @ 25
°C
1.2
1.28
1.375
V
Temperature Sensor Slope over Temperature
5.0
mV/
°C
MRFIC505A Temperature Sense Specs
Temperature Sensor Output Voltage @ 25
°C
1.270
1.395
1.463
V
Temperature Sensor Slope over Temperature
5.0
mV/
°C
Electrical Characteristics
(VCC = 2.7 to 3.3 V; TA = 40 to 85
°C; Enable = 2.7 V unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
4
Freescale Semiconductor
Figure 1 Applications Schematic (1636.8 MHz LO)
Freescale Semiconductor
5
Outline Dimensions
PLASTIC PACKAGE
CASE 932-03
(LQFP-48)
ISSUE F
A
A1
Z
0.200 AB T-U
4X
Z
0.200 AC T-U
4X
B
B1
1
12
13
24
25
36
37
48
S1
S
V
V1
DETAIL Y
9
T
U
Z
P
AE
AE
T, U, Z
DETAIL Y
Mð_
TOP & BOTTOM
L ð_
W
K
AA
E
C
H
0.
250
R
DETAIL AD
G
AUG
E
P
L
ANE
AD
G
0.080 AC
AB
AC
BASE METAL
N
J
F
D
T-U
M
0.080
Z
AC
SECTION AE-AE
NOTES:
1 DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DATUM PLANE AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
5 DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9 EXACT SHAPE OF EACH CORNER IS OPTIONAL.
DIM
MIN
MAX
MILLIMETERS
A
7.000 BSC
A1
3.500 BSC
B
7.000 BSC
B1
3.500 BSC
C
1.400
1.600
D
0.170
0.270
E
1.350
1.450
F
0.170
0.230
G
0.500 BSC
H
0.050
0.150
J
0.090
0.200
K
0.500
0.700
M
12 REF
ð_
N
0.090
0.160
P
0.250 BSC
L
0
7
R
0.150
0.250
S
9.000 BSC
S1
4.500 BSC
V
9.000 BSC
V1
4.500 BSC
W
0.200 REF
AA
1.000 REF
ð_
ð_
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