MPXV6115VC6U
Rev 1, 05/2005
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2005. All rights reserved.
High Temperature Accuracy
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPXV6115VC6U sensor integrates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration
make the Freescale Semiconductor, Inc. pressure sensor a logical and
economical choice for the system designer.
The MPXV6115VC6U piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Figure 1
shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
Features
·
Improved Accuracy at High Temperature
·
1.5% Maximum Error over 0
° to 85°C
·
Ideally suited for Microprocessor or Microcontroller-Based Systems
·
Temperature Compensated from -40
° to +125°C
·
Durable Thermoplastic (PPS) Surface Mount Package
Typical Applications
·
Vacuum Pump Monitoring
·
Brake Booster Monitoring
Figure 1. Fully Integrated Pressure Sensor Schematic
ORDERING INFORMATION
Device
Type
Options
Case
No.
MPX Series
Order No.
Packing
Options
Device Marking
Ported
Element
Vacuum,
Axial Port
482A
MPXV6115VC6U
Rails
MPXV6115V
MPXV6115VC6U
INTEGRATED
PRESSURE SENSOR
-115 TO 0 kPA (-16.7 TO 2.2 psi)
0.2 TO 4.6 VOLTS OUTPUT
MPXV6115VC6U
CASE 482A-01
PIN NUMBER
(1)
1. Pins 1, 5, 6, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is denoted by the
notch in the lead.
1
N/C
5
N/C
2
V
S
6
N/C
3
GND
7
N/C
4
V
OUT
8
N/C
SMALL OUTLINE PACKAGE
Sensing
Element
GND
V
out
V
S
Pins 4, 5, and 6 are no connects
Thin Film
Temperature
Compensation
And
Gain Stage #1
Gain Stage #2
And
Ground
Reference
Shift Circuitry
MPXV6115VC6U
Sensors
2
Freescale Semiconductor
Table 1. Maximum Ratings
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating
Symbol
Value
Units
Maximum Pressure (P1
>P2)
P
max
400
kPa
Storage Temperature
T
stg
-40
° to +125°
°C
Operating Temperature
T
A
-40
° to +125°
°C
Output Source Current @ Full Scale Output
(2)
2. Maximum Output Current is controlled by effective impedance from V
out
to Gnd or V
out
to V
S
in the application circuit.
I
o
+
0.5
mAdc
Output Sink Current @ Minimum Pressure Offset
(2)
I
o
-
-0.5
mAdc
Table 2. Operating Characteristics (V
S
= 5.0 Vdc, T
A
= 25
°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
P
OP
-115
--
0
kPa
Supply Voltage
(1)
1. Device is ratiometric within this specified excitation range.
V
S
4.75
5.0
5.25
Vdc
Supply Current
I
o
--
6.0
10
mAdc
Full Scale Output
(2)
(0 to 85
°C)
@ V
S
= 5.0 Volts
(P
diff
= 0 kPa)
2. Full Scale Output (V
FSO
) is defined as the output voltage at the maximum or full rated pressure.
V
FSO
4.534
4.6
4.665
Vdc
Full Scale Span
(3)
(0 to 85
°C)
@ V
S
= 5.0 Volts
3. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
V
FSS
--
4.4
--
Vdc
Accuracy
(4)
(0 to 85
°C)
4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25
°C due to all sources of error including the following:
· Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
· Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
· Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25
°C.
· TcSpan:
Output deviation over the temperature range of 0
° to 85°C, relative to 25°C.
· TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0
° to 85°C, relative to 25°C.
--
--
--
±1.5
%V
FSS
Sensitivity
V/P
--
38.26
--
mV/kPa
Response Time
(5)
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
t
R
--
1.0
--
ms
Warm-Up Time
(6)
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
--
--
20
--
ms
Offset Stability
(7)
7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
--
--
±0.5
--
%V
FSS
MPXV6115VC6U
Sensors
Freescale Semiconductor
3
Figure 2. Cross Sectional Diagram SOP
(Not to Scale)
Figure 2
illustrates the absolute sensing chip in the basic
Small Outline chip carrier (Case 482).
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 3
shows a typical application circuit (output source
current operation).
Figure 4. Output versus Absolute Pressure
Figure 4
shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85
°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The
MPXV6115VC6U pressure sensor operating characteristics,
internal reliability and qualification tests are based on use of
dry air as the pressure media. Media other than dry air may
have adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluorosilicone
Gel Die Coat
Wire
Bond
Differential Sensing
Element
Thermoplastic
Case
Stainless
Steel Cap
Lead
Frame
P1
P2
Die Bond
Die
V
S
Pin 2
+5.0 V
GND Pin 3
V
out
Pin 4
MPXV6115VC6U
to ADC
100 nF
51 K
47 pF
Max
Transfer Function:
V
out
= V
S
*[(0.007652*P) + 0.92]
± (Pressure error)
Min
V
out
vs. Vacuum
Transfer Function MPXV6115VC6U
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
Ou
tp
u
t
(
V
ol
ts
)
*Temp Factor*0.007652*V
S
)
V
S
= 5.0 V
± 0.25 Vdc
TEMP = 0-85
° C
-115
-95
-75
-55
-35
-15
0
MPXV6115VC6U
Sensors
4
Freescale Semiconductor
Nominal Transfer Value:
V
out
= V
S
x (0.007652 x P + 0.92)
± (Pressure Error x Temp. Factor x 0.007652 x V
S
)
V
S
= 5.0 ± 0.25 Vdc
Temperature in °C
4.0
3.0
2.0
0.0
1.0
-40
-20
0
20
40
60
130
120
100
80
Pressure in kPa
(below atmospheric)
1.950
1.725
1.500
-1.500
-1.725
-1.950
0
-115
-100
-85
-45
-30
-15
0
Pressure Error (max)
- 40
3
0 to 85
1
125
2
NOTE: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
140
Pre
ssu
re Er
ro
r (k
Pa)
Temperature Error Band
Pressure Error Band
MPXV6115VC6U
Temp. Multiplier
Error Limits for Pressure
± 1.725 kPa
-115 to 0 kPa
Transfer Function (MPXV6115VC6U)
MPXV6115VC6U
Sensors
Freescale Semiconductor
5
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
Figure 5. SOP Footprint (Case 482A)
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP
2.54
0.300
7.62
inch
mm
PACKAGE DIMENSIONS
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0°
7°
0°
7°
N
0.444
0.448
11.28
11.38
S
0.709
0.725
18.01
18.41
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5° TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010)
A
T
-A-
-B-
N
S
PIN 1 IDENTIFIER
H
SEATING
PLANE
-T-
W
C
M
J
K
V
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0°
7°
0°
7°
N
0.444
0.448
11.28
11.38
S
0.709
0.725
18.01
18.41
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5° TYPICAL DRAFT.
S
D
8 PL
G
4
5
8
1
S
B
M
0.25 (0.010)
A
T
-A-
-B-
N
S
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV6115VC6U
Sensors
6
Freescale Semiconductor
MPXV6115VC6U
Sensors
Freescale Semiconductor
7
NOTES
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MPXV6115VC6U
Rev. 1
05/2005
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