ChipFind - Datasheet

Part Number MPXM2053

Download:  PDF   ZIP
MPXM2053 SERIES
1
Sensor Device Data
Freescale Semiconductor
50 kPa
On- Chip Temperature
Compensated & Calibrated
Silicon Pressure Sensors
The MPXM2053 device is a silicon piezoresistive pressure sensor providing a highly
accurate and linear voltage output -- directly proportional to the applied pressure. The
sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin--film
resistor network integrated on--chip. The chip is laser trimmed for precise span and offset
calibration and temperature compensation.
Features
· Temperature Compensated Over 0°C to +85°C
· Available in Easy--to--Use Tape & Reel
· Ratiometric to Supply Voltage
· Gauge Ported & Non Ported Options
Application Examples
· Pump/Motor Controllers
· Robotics
· Level Indicators
· Medical Diagnostics
· Pressure Switching
· Non--Invasive Blood Pressure Measurement
Figure 1 shows a block diagram of the internal circuitry on the stand--alone pressure
sensor chip.
Figure 1. Temperature Compensated Pressure Sensor Schematic
V
S
3
X--ducer
SENSING
ELEMENT
THIN FILM
TEMPERATURE
COMPENSATION
AND
CALIBRATION
CIRCUITRY
2
4
V
out+
V
out--
1
GND
VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly proportional to the differential
pressure applied.
The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly,
output voltage increases as increasing vacuum is applied to the vacuum side (P2)
relative to the pressure side (P1).
Preferred devices are Freescale Semiconductor recommended choices for future use and best overall value.
MPXM2053
Rev. 2, 10/2004
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2004. All rights reserved.
MPXM2053
SERIES
0 to 50 kPa (0 to 7.25 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
PIN NUMBER
1
2
Gnd
+V
out
3
4
V
S
--V
out
Freescale Semiconductor Preferred Device
MPXM2053D/DT1
CASE 1320
MPXM2053GS/GST1
CASE 1320A
SCALE 1:1
SCALE 1:1
MPAK PACKAGE
2
Sensor Device Data
Freescale Semiconductor
MPXM2053 SERIES
MAXIMUM RATINGS
(NOTE)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
P
max
200
kPa
Storage Temperature
T
stg
--40 to +125
°C
Operating Temperature
T
A
--40 to +125
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS
(V
S
= 10 Vdc, T
A
= 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
(1)
P
OP
0
--
50
kPa
Supply Voltage
(2)
V
S
--
10
16
Vdc
Supply Current
I
o
--
6.0
--
mAdc
Full Scale Span
(3)
V
FSS
38.5
40
41.5
mV
Offset
(4)
V
off
--1.0
--
1.0
mV
Sensitivity
V/P
--
0.8
--
mV/kPa
Linearity
(5)
--
--0.6
--
0.4
%V
FSS
Pressure Hysteresis
(5)
(0 to 50 kPa)
--
--
±0.1
--
%V
FSS
Temperature Hysteresis
(5)
(--40°C to +125°C)
--
--
±0.5
--
%V
FSS
Temperature Effect on Full Scale Span
(5)
TCV
FSS
--2.0
--
2.0
%V
FSS
Temperature Effect on Offset
(5)
TCV
off
--1.0
--
1.0
mV
Input Impedance
Z
in
1000
--
2500
Output Impedance
Z
out
1400
--
3000
Response Time
(6)
(10% to 90%)
t
R
--
1.0
--
ms
Warm--Up
--
--
20
--
ms
Offset Stability
(7)
--
--
±0.5
--
%V
FSS
NOTES:
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self--heating.
3. Full Scale Span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
· Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
· Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
· Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
· TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
· TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative
to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXM2053 SERIES
3
Sensor Device Data
Freescale Semiconductor
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: V
out
= V
off
+ sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives
the "best case" linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the "worst case" error
(often more desirable in error budget calculations) and the cal-
culations are more straightforward for the user. Freescale
Semiconductor's specified pressure sensor linearities are
based on the end point straight line method measured at the
midrange pressure.
Figure 2. Linearity Specification Comparison
LEAST
SQUARE
DEVIATION
RELA
TI
VE
VOL
T
AGE
O
UTPUT
PRESSURE (% FULLSCALE)
0
50
100
END POINT
STRAIGHT LINE FIT
EXAGGERATED
PERFORMANCE
CURVE
LEAST SQUARES FIT
STRAIGHT LINE
DEVIATION
OFFSET
ON--CHIP TEMPERATURE COMPENSATION and CALIBRATION
Figure 3 shows the minimum, maximum and typical output
characteristics of the MPXM2053 series at 25°C. The output
is directly proportional to the differential pressure and is es-
sentially a straight line.
A silicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the silicon diaphragm.
Figure 3. Output versus Pressure Differential
OUTPUT
(
m
Vdc
)
kPa
PSI
40
35
30
25
15
10
5
0
--5
0
12.5
1.8
25
3.6
37.5
5.4
50
7.25
SPAN
RANGE
(TYP)
OFFSET
(TYP)
20
MAX
TYP
MIN
V
S
= 10 Vdc
T
A
= 25°C
P1 > P2
ORDERING INFORMATION
Device Type
Options
Case No
Device Type
Options
Case No.
MPXM2053D
Non--ported
1320
MPXM2053DT1
Non--ported, Tape and Reel
1320
MPXM2053GS
Ported
1320A
MPXM2053GST1
Ported, Tape and Reel
1320A
4
Sensor Device Data
Freescale Semiconductor
MPXM2053 SERIES
PACKAGE DIMENSIONS
CASE 1320--02
ISSUE A
MPAK, STYLE 1
DIM
MIN
MAX
INCHES
A
.155
.165
A1
.002
.010
b
.014
.018
b1
.120
.130
D
.245
.255
E
.475
.485
e
e/2
L
.038
.048
E1
.325
.335
0
7
.025 BSC
.050 BSC
°
°
NOTES:
1. DIMENSIONS ARE IN INCHES.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M--1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSION. MOLD FLASH OR
PROTRUSION SHALL NOT EXCEED .006" PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.
5. DIMENSIONS "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE .008 MAXIMUM.
b1
E
e/2
e
A
M
0.004
B
C
A
0.006
B
C
4X
b
2X
A
M
0.004
B
C
E1
A
C
0.004
DETAIL E
SEATING
PLANE
GAGE
PLANE
DETAIL E
L
A1
.014
B
D
A
PIN 1
PIN 4
STYLE 1:
PIN 1. GND
2. +Vout
3. Vs
4. --Vout
MPXM2053 SERIES
5
Sensor Device Data
Freescale Semiconductor
PACKAGE DIMENSIONS
CASE 1320A--02
ISSUE O
MPAK, STYLE 1
DIM
MIN
MAX
INCHES
A
.377
.397
A1
.002
.010
b
.014
.018
b1
.120
.130
D
.245
.255
E
.475
.485
e
e/2
L
.013
.023
E1
.325
.335
0
7
.025 BSC
.050 BSC
°
°
NOTES:
1. DIMENSIONS ARE IN INCHES.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M--1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSION. MOLD FLASH OR
PROTRUSION SHALL NOT EXCEED .006" PER SIDE.
4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.
5. DIMENSIONS "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE .008 MAXIMUM.
b1
E
e/2
e
A
M
0.004
B
C
A
0.006
B
C
4X
b
2X
A
M
0.004
B
C
E1
A
C
0.004
DETAIL E
SEATING
PLANE
GAGE
PLANE
DETAIL E
L
A1
.014
B
D
A
M
.283
.293
N
.363
.373
P
.107
.117
S
.192
.202
N
S
P
6
Sensor Device Data
Freescale Semiconductor
MPXM2053 SERIES
NOTES
MPXM2053 SERIES
7
Sensor Device Data
Freescale Semiconductor
NOTES
8
Sensor Device Data
Freescale Semiconductor
MPXM2053 SERIES
Information in this document is provided solely to enable system and software implementers to use
Freescale Semiconductor products. There are no express or implied copyright licenses granted
hereunder to design or fabricate any integrated circuits or integrated circuits based on the
information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to any
products herein. Freescale Semiconductor makes no warranty, representation or guarantee
regarding the suitability of its products for any particular purpose, nor does Freescale
Semiconductor assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability, including without limitation consequential or
incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data
sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including "Typicals", must be validated for each customer
application by customer's technical experts. Freescale Semiconductor does not convey any
license under its patent rights nor the rights of others. Freescale Semiconductor products are not
designed, intended, or authorized for use as components in systems intended for surgical implant
into the body, or other applications intended to support or sustain life, or for any other application in
which the failure of the Freescale Semiconductor product could create a situation where personal
injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for
any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale
Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless
against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such unintended or
unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent
regarding the design or manufacture of the part.
Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc. 2004. All rights reserved.
How to Reach Us:
Home Page:
www.freescale.com
E--mail:
support@freescale.com
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, CH370
1300 N. Alma School Road
Chandler, Arizona 85224
+1--800--521--6274 or +1--480--768--2130
support@freescale.com
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
support@freescale.com
Japan:
Freescale Semiconductor Japan Ltd.
Technical Information Center
3--20--1, Minami--Azabu, Minato--ku
Tokyo 106--0047, Japan
0120 191014 or +81 3 3440 3569
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1--800--441--2447 or 303--675--2140
Fax: 303--675--2150
LDCForFreescaleSemiconductor@hibbertgroup.com
MPXM2053
Rev. 2
10/2004