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080400
FEATURES
Direct replacement for IBM AT computer
clock/calendar
Functionally compatible with the
DS1285/DS1287
Available as chip (DS14285, DS14285S, or
DS14285Q) or stand-alone module with
embedded lithium battery and crystal
(DS14287)
Automatic backup supply and write
protection to make external SRAM
nonvolatile
Counts seconds, minutes, hours, days, day of
the week, date, month, and year with leap
year compensation valid up to 2100
Binary or BCD representation of time,
calendar, and alarm
12- or 24-hour clock with AM and PM in
12-hour mode
Daylight Savings Time option
Multiplex bus for pin efficiency
Interfaced with software as 128 RAM
locations
14 bytes of clock and control registers
114 bytes of general purpose RAM
Programmable square wave output signal
Bus-compatible interrupt signals (
IRQ
)
Three interrupts are separately software-
maskable and testable
Time-of-day alarm once/second to
once/day
Periodic rates from 122
µ
s to 500 ms
End of clock update cycle
Optional industrial temperature version
available DS14285 DIP, SOIC, and PLCC
PIN ASSIGNMENT
DS14285/DS14287
Real Time Clock with NV RAM Control
www.dalsemi.com
DS14285 24-Pin DIP
DS14285S 24-Pin SOIC
23
X2
AD1
AD3
AD4
AD5
AD6
AD7
GND
V
CC
CEI
V
BAT
IRQ
RESET
DS
GND
R/W
AS
CS
1
2
3
4
5
6
7
8
9
10
11
12
24
22
21
20
19
18
17
16
15
14
13
X1
AD0
AD2
SQW
CEO
DS14285Q 28-Pin PLCC
AD0
AD1
AD2
AD3
AD4
AD5
CEI
V
BAT
IRQ
RESET
DS
GND
NC
R/W
X2 X1 MOT V
CCO
VC
C
SQ
W
CE
0
AD
6
NC AD
7
GND
CS AS
NC
25
24
23
22
21
20
19
5
6
7
8
9
10
11
4 3 2 1 28 27 26
12 13 14 15 16 17 18
23
NC
AD1
AD3
AD4
AD5
AD6
AD7
GND
V
CC
SQW
CEO
CEI
NC
IRQ
RESET
DS
NC
R/W
AS
CS
1
2
3
4
5
6
7
8
9
10
11
12
24
22
21
20
19
18
17
16
15
14
13
NC
AD0
AD2
V
CCO
DS14287 24-Pin
Encapsulated Package
V
CCO
DS14285/DS14287
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ORDERING INFORMATION
DS14285
RTC Chip; 24-pin DIP
DS14285N
RTC Chip; 24-pin DIP; Industrial Temp Range
DS14285S
RTC Chip; 24-pin SOIC
DS14285SN
RTC Chip; 24-pin SOIC; Industrial Temp Range
DS14285Q
RTC Chip; 28-pin PLCC
DS14285QN
RTC Chip; 28-pin PLCC; Industrial Temp Range
DS14287
RTC Module; 24-pin DIP
PIN DESCRIPTION
AD0-AD7
- Multiplexed Address/Data Bus
NC
- No Connection
MOT
- Bus Type Select (DS14285Q only)
CS
- Chip Select
AS
- Address Strobe
R/
W
-
Read/Write
Input
DS
- Data Strobe
RESET
- Reset Input
IRQ
- Interrupt Request Output
SQW
- Square Wave Output
V
CC
- +5V Supply
GND -
Ground
V
CCO
- RAM Power Supply Output
CEI
- RAM Chip Enable In
CEO
- RAM Chip Enable Out
X1, X2
- 32.768 kHz Crystal Connections
V
BAT
-
+3V
Battery
Input
DESCRIPTION
The DS14285/DS14287 Real Time Clock with NVRAM Control provides the industry standard DS1287
clock function with the additional feature of providing nonvolatile control for an external SRAM.
Functions include a nonvolatile time-of-day clock, alarm, 100-year calendar, programmable interrupt,
square wave generator, and 114 bytes of nonvolatile static RAM. For the DS14287 a lithium energy
source, quartz crystal, and write protection circuitry are contained within a 24-pin dual in-line package.
The DS14285 requires an external quartz crystal connected to the X1 and X2 pins as well as an external
energy source connected to the V
BAT
pin. A standard 32.768 kHz quartz crystal can be directly connected
to the DS14285 via pins 1 and 2 (X1, X2). The crystal selected for use should have a specified load
capacitance (C
L
) of 6 pF. For more information on crystal selection and crystal layout considerations,
please consult Application Note 58, "Crystal Considerations with Dallas Real-time Clocks."
The DS14285/DS14287 uses its backup energy source and battery-backup controller to make a standard
CMOS static RAM nonvolatile during power-fail conditions. During power fail, the DS14285/DS14287
automatically write-protects the external SRAM and provides a V
CC
output sourced from its internal
battery.
DS14285/DS14287
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For the DS14287 the internal lithium cell is electrically isolated from the clock and memory when
shipped from the factory. This isolation is removed after the first application of V
CC,
allowing the lithium
cell to provide data retention to the clock, internal RAM, V
CCO
and
CEO
on subsequent power-downs.
Care must be taken after this isolation has been broken to avoid inadvertently discharging the lithium cell
through the V
CCO
and
CEO
pins.
OPERATION
The block diagram in Figure 1 shows the pin connections with the major internal functions of the
DS14285/DS14287. The following paragraphs describe the function of each pin.
SIGNAL DESCRIPTIONS
GND, V
CC
- DC power is provided to the device on these pins. V
CC
is the +5 volt input.
SQW (Square Wave Output) - The SQW pin can output a signal from one of 13 taps provided by the 15
internal divider stages of the real time clock. The frequency of the SQW pin can be changed by
programming Register A as shown in Table 1. The SQW signal can be turned on and off using the SQWE
bit in Register B. The SQW signal is not available when V
CC
is less than 4.25 volts typical.
AD0-AD7 (Multiplexed Bi-directional Address/Data Bus) - Multiplexed buses save pins because
address information and data information time-share the same signal paths. The addresses are present
during the first portion of the bus cycle and the same pins and signal paths are used for data in the second
portion of the cycle. Address/data multiplexing does not slow the access time of the DS14285/DS14287
since the bus change from address to data occurs during the internal RAM access time. Addresses must be
valid prior to the falling edge of AS/ALE, at which time the DS14285/DS14287 latches the address from
AD0 to AD6. Valid write data must be present and held stable during the latter portion of the DS or
WR
pulses. In a read cycle the DS14285/DS14287 outputs 8 bits of data during the latter portion of the DS or
RD
pulses. The read cycle is terminated and the bus returns to a high impedance state as DS transitions
low in the case of Motorola timing or as
RD
transitions high in the case of Intel timing.
MOT (Mode Select) - The MOT pin offers the flexibility to choose between to bus types. When
connected to V
CC
, Motorola bus timing is selected. When connected to GND or left disconnected, Intel
bus timing is selected. The pin has an internal pull-down resistance of approximately 20 K
. This pin is
on the DS14285Q only.
AS (Address Strobe Input) - A positive going address strobe pulse serves to demultiplex the bus. The
falling edge of AS/ALE causes the address to be latched within the DS14285/DS14287.
DS (Data Strobe or Read Input) - For the DS14285Q the DS/
RD
pin has two modes of operation
depending on the level of the MOT pin. When the MOT pin is connected to V
CC
, Motorola bus timing is
selected. In this mode DS is a positive pulse during the latter portion of the bus cycle and is called Data
Strobe. During read cycles, DS signifies the time that the DS14285Q is to drive the bidirectional bus. In
write cycles the trailing edge of DS causes the DS14285Q to latch the written data. When the MOT pin is
connected to GND, Intel bus timing is selected. In this mode the DS pin is called Read(
RD
).
RD
identifies
the time period when the DS14285Q drives the bus with read data. The
RD
signal is the same definition
as the Output Enable (
OE
) signal on a typical memory.
The DS14285, DS14285S and DS14287 do not have a MOT pin and therefore operate only in Intel bus
timing mode.
DS14285/DS14287
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R/
W
(Read/Write Input) - The R/
W
pin also has two modes of operation. When the MOT pin is
connected to V
CC
for Motorola timing, R/
W
is at a level which indicates whether the current cycle is a
read or write. A read cycle is indicated with a high level on R/
W
while DS is high. A write cycle is
indicated when R/
W
is low during DS.
When the MOT pin is connected to GND for Intel timing, the R/
W
signal is an active low signal called
WR
. In this mode the R/
W
pin has the same meaning as the Write Enable signal (
WE
) on generic
RAMs.
CS
(Chip Select Input) - The Chip Select signal must be asserted low for a bus cycle in the
DS14285/DS14287 to be accessed.
CS
must be kept in the active state during DS for Motorola timing
and during
RD
and
WR
for Intel timing. Bus cycles which take place without asserting
CS
will latch
addresses but no access will occur. When V
CC
is below 4.25 volts, the DS14285/DS14287 internally
inhibits access cycles by internally disabling the
CS
input. This action protects both the real time clock
data and RAM data during power outages.
IRQ
(Interrupt Request Output) - The
IRQ
pin is an active low output of the DS14285/DS14287 that
can be used as an interrupt input to a processor. The
IRQ
output remains low as long as the status bit
causing the interrupt is present and the corresponding interrupt-enable bit is set. To clear the
IRQ
pin the
processor program normally reads the C register. The
RESET
pin also clears pending interrupts.
When no interrupt conditions are present, the
IRQ
level is in the high impedance state. Multiple
interrupting devices can be connected to an
IRQ
bus. The
IRQ
bus is an open drain output and requires an
external pull-up resistor.
RESET
(Reset Input) - The
RESET
pin has no effect on the clock, calendar, or RAM. On power-up the
RESET
pin can be held low for a time in order to allow the power supply to stabilize. The amount of time
that
RESET
is held low is dependent on the application. However, if
RESET
is used on power-up, the
time
RESET
is low should exceed 200 ms to make sure that the internal timer that controls the
DS14285/DS14287 on power-up has timed out. When
RESET
is low and V
CC
is above 4.25 volts, the
following occurs:
A.
Periodic Interrupt Enable (PEI) bit is cleared to 0.
B.
Alarm Interrupt Enable (AIE) bit is cleared to 0.
C.
Update Ended Interrupt Flag (UF) bit is cleared to 0.
D.
Interrupt Request Status Flag (IRQF) bit is cleared to 0.
E.
Periodic Interrupt Flag (PF) bit is cleared to 0.
F.
The device is not accessible until
RESET
is returned high.
G.
Alarm Interrupt Flag (AF) bit is cleared to 0.
H.
IRQ
pin is in the high impedance state.
I.
Square Wave Output Enable (
SQWE
) bit is cleared to 0.
J.
Update Ended Interrupt Enable (UIE) is cleared to 0.
K.
CEO
is driven high.
DS14285/DS14287
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In a typical application
RESET
can be connected to V
CC
. This connection will allow the DS14287 to go in
and out of power fail without affecting any of the control registers.
CEI
(External RAM Chip Enable Input, active low) -
CEI
should be driven low to enable the external
RAM.
CEI
is internally pulled up with a 50k
resistor.
CEO
(External RAM Chip Enable Output, active low) - When V
CC
is greater than 4.25 volts (typical),
CEO
will reflect
CEI
provided the
RESET
is at a logic high. When V
CC
is less than 4.25 volts (typical),
CEO
will be forced to an inactive level regardless of
CEI
.
V
CCO
(External RAM Power Supply Output) - V
CCO
provides the higher of V
CC
or V
BAT
through an
internal switch to power an external RAM.
DS14285 Only
X1, X2 - Connections for a standard 32.768 kHz quartz crystal. The internal oscillator circuitry is
designed for operation with a crystal having a specified load capacitance (CL) of 6 pF. The crystal is
connected directly to the X1 and X2 pins. There is no need for external capacitors or resistors. Note: X1
and X2 are very high impedance nodes. It is recommended that they and the crystal be guardringed with
ground and that high frequency signals be kept away from the crystal area. For more information on
crystal selection and crystal layout considerations, please consult Application Note 58, "Crystal
Considerations with Dallas Real Time Clocks."
V
BAT
Battery input for any standard 3-volt lithium cell or other energy source. See the Power-Up/Down
section for considerations in selecting the size of the external energy source
The battery should be connected directly to the V
BAT
pin. A diode must not be placed in series with the
battery to the VBAT pin. Furthermore, a diode is not necessary because reverse charging current
protection circuitry is provided internal to the device and has passed the requirements of Underwriters
Laboratories for UL listing.
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