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Part Number CY25000

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Programmable Spread Spectrum
Clock Generator for EMI Reduction
CY25000
PRELIMINARY
Cypress Semiconductor Corporation
·
3901 North First Street
·
San Jose
·
CA 95134
·
408-943-2600
Document #: 38-07424 Rev. *A
Revised December 14, 2002
Features
Benefits
· Wide operating output (SSCLK) frequency range
-- 3­200 MHz
Services most PC peripherals, networking, and consumer appli-
cations.
· Programmable spread spectrum with nominal
30-kHz modulation frequency.
-- Center spread: ±0.25% to ±2.5%
-- Down spread: ­0.5% to ­5.0%
Provides wide range of spread percentages for maximum EMI
reduction, to meet regulatory agency Electro Magnetic Compli-
ance (EMC) requirements. Reduces development and manufac-
turing costs and time-to-market.
· Input frequency range
-- External crystal: 8­30 MHz fundamental crystals.
-- External reference: 8­166 MHz Clock
Eliminates the need for expensive and difficult to use higher order
crystals.
· Integrated phase-locked loop (PLL)
Internal PLL to generate up to 200-MHz output. Able to generate
custom frequencies from an external crystal or a driven source.
· Programmable crystal load capacitor tuning array
Enables fine-tuning of output clock frequency by adjusting C
Load
of the crystal. Eliminates the need for external C
Load
capacitors.
· Low cycle-to-cycle Jitter
Suitable for most PC, consumer, and networking applications
· 3.3V operation
Application compatibility in standard and low-power systems.
· Spread spectrum On/Off function
Provides ability to enable or disable spread spectrum with an ex-
ternal pin.
· Power-down or Output Enable function
Enables low-power state or output clocks to High-Z state.
Logic Block Diagram
XIN/CLKIN
Dividers
PLL
OSC.
REFCLK
VSS
SSCLK
VDD
SSON
XOUT
MUX
Output
and
with
Modulation Control
Programmable Configuration
C
XIN
1
8
3
7
6
5
2
4
C
XOUT
8-pin SOIC
CY25000
Pin Configuration
1
2
3
4
XOUT
SSCLK
VSS
SSON
REFCLK
5
6
7
8
VDD
XIN/CLKIN
PD#/OE
PD#/OE
PRELIMINARY
CY25000
Document #: 38-07424 Rev. *A
Page 2 of 9
General Description
The CY25000 is a Spread Spectrum Clock Generator (SSCG)
IC used for the purpose of reducing Electro Magnetic Interfer-
ence (EMI) found in today's high-speed digital electronic sys-
tems.
The device uses a Cypress proprietary Phase-Locked Loop
(PLL) and Spread Spectrum Clock (SSC) technology to syn-
thesize and modulate the frequency of the input clock. By fre-
quency modulating the clock, the measured EMI at the funda-
mental and harmonic frequencies are greatly reduced. This
reduction in radiated energy can significantly reduce the cost
of complying with regulatory agency requirements (EMC) and
improve time to market without degrading system perfor-
mance.
The CY25000 uses a factory-programmable configuration
memory array to synthesize output frequency, spread %, crys-
tal load capacitor, reference clock on/off and PD#/OE options.
The spread % is factory programmed to either center spread
or down spread with various spread percentages. The range
for center spread is from ±0.25% to ±2.50%. The range for
down spread is from ­0.5% to ­5.0%. Contact the factory for
smaller or larger spread % amounts if required.
The input to the CY25000 can be either a crystal or a clock
signal. The input frequency range for crystals is 8­30 MHz,
and for clock signals is 8­166 MHz.
The CY25000 has two clock outputs, REFCLK and SSCLK.
The non-spread spectrum REFCLK output has the same fre-
quency as the input of the CY25000. The frequency modulated
SSCLK output can be programmed from 3­200 MHz.
The CY25000 products are available in an 8-pin SOIC
(150-mil) package with a commercial operating temperature
range of 0 to 70
°
C.
Absolute Maximum Rating
Supply Voltage (VDD) .......................................­0.5 to +7.0V
DC Input Voltage...................................... ­0.5V to V
DD
+ 0.5
Storage Temperature (Non-Condensing) .... ­55
°
C to +125
°
C
Junction Temperature ................................ ­40
°
C to +125
°
C
Data Retention @ Tj=125
°
C................................. > 10 Years
Package Power Dissipation...................................... 350 mW
Static Discharge Voltage.......................................... > 2000V
(per MIL-STD-883, Method 3015)
Pin Description
Pin
Name
Description
1
XIN/CLKIN
Crystal input or reference clock input
2
VDD
3.3V voltage supply
3
PD#/OE
Power-down pin: Active LOW. If PD# = 0, SSCLK and REFCLK are three-stated.
Output Enable pin: Active HIGH. If OE = 1, SSCLK and REFCLK are enabled.
User has the option of choosing either PD# or OE function.
4
VSS
GND
5
SSCLK
Spread spectrum clock output
6
REFCLK
Buffered reference output.
7
SSON
Spread spectrum control. 1 = Spread on. 0 = Spread off.
8
XOUT
Crystal output. Leave this pin floating if external clock is used.
Operating Conditions
Parameter
Description
Min.
Typ.
Max.
Unit
V
DD
Supply Voltage
3.13
3.30
3.45
V
T
A
Ambient Temperature
0
70
°C
C
LOAD
Max. Load Capacitance @ pin 5 and pin 6
15
pF
F
ref
External Reference Crystal
(Fundamental tuned crystals only)
8
30
MHz
External Reference Clock
8
166
MHz
F
SSCLK
SSCLK output frequency, C
LOAD
= 15 pF
3
200
MHz
F
REFCLK
REFCLK output frequency, C
LOAD
= 15 pF
8
166
MHz
t
PU
Power-up time for all VDD's to reach minimum
specified voltage (power ramps must be monotonic)
0.05
500
ms
PRELIMINARY
CY25000
Document #: 38-07424 Rev. *A
Page 3 of 9
DC Electrical Characteristics
Parameter
Description
Condition
Min.
Typ.
Max.
Unit
I
OH
Output High Current
V
OH
= V
DD
­ 0.5, V
DD
= 3.3V (source)
12
24
mA
I
OL
Output Low Current
V
OL
= 0.5, V
DD
= 3.3V (sink)
12
24
mA
V
IH
Input High Voltage
CMOS levels, 70% of V
DD
0.7V
DD
V
V
IL
Input Low Voltage
CMOS levels, 30% of V
DD
0.3V
DD
V
I
IH
Input High Current,
PD#/OE and SSON pins
V
in
= V
DD
10
µ
A
I
IL
Input Low Current,
PD#/OE and SSON pins
V
in
= V
SS
10
µ
A
I
OZ
Output Leakage Current
Three-state output, PD#/OE = 0
­10
10
µ
A
C
XIN
/C
XOUT
[1, 2]
Programmable Capaci-
tance at pin 1 and pin 8
Capacitance at minimum setting
12
pF
Capacitance at maximum setting
60
pF
C
IN
[1]
Input Capacitance at pin 3
and pin 7
Input pins excluding XIN and XOUT
5
7
pF
I
VDD
Supply Current
V
DD
= 3.45V, Fin = 30 MHz,
REFCLK = 30 MHz, SSCLK = 66 MHz,
C
LOAD
= 15 pF, PD#/OE = SSON = V
DD
25
35
mA
I
DDS
Stand by current
V
DD
= 3.45V, Device powered down with
PD#/OE = 0V
15
30
µ
A
AC Electrical Characteristics
[1]
Parameter
Description
Condition
Min.
Typ.
Max.
Unit
DC
Output Duty Cycle
SSCLK, Measured at V
DD
/2
45
50
55
%
Output Duty Cycle
REFCLK, Measured at V
DD
/2
Duty Cycle of CLKIN = 50%.
40
50
60
%
SR1
Rising Edge Slew Rate
SSCLK from 3 to 100 MHz; REFCLK
from 10 to 100 MHz. 20%­80% of V
DD
0.7
1.1
1.5
V/ns
SR2
Falling Edge Slew Rate
SSCLK from 3 to 100 MHz; REFCLK
from 10 to 100 MHz. 80%­20% of V
DD
0.7
1.1
1.5
V/ns
SR3
Rising Edge Slew Rate
SSCLK from 100 to 200 MHz; REFCLK
from 100 to 166 MHz 20%­80% of V
DD
1.2
1.6
2.0
V/ns
SR4
Falling Edge Slew Rate
SSCLK from 100 to 200 MHz; REFCLK
from 100 to 166 MHz 80%­20% of V
DD
1.2
1.6
2.0
V/ns
tj1
Peak Cycle-to-Cycle Jitter.
SSCLK pin
SSCLK = 200 MHz. Spread on
100
200
ps
SSCLK = 66 MHz. Spread on
150
300
ps
SSCLK = 14.3 MHz. Spread on
200
400
ps
tj2
Peak Cycle-to-Cycle Jitter,
REFCLK
REFCLK output only
100
200
ps
t
STP
Power-down Time
(pin3 = PD#)
Time from falling edge on PD# to stopped
outputs (Asynchronous)
150
300
ns
T
OE1
Output Disable Time
(pin3 = OE)
Time from falling edge on OE to stopped
outputs (Asynchronous)
150
300
ns
T
OE2
Output Enable Time
(pin3 = OE)
Time from rising edge on OE to outputs
at a valid frequency (Asynchronous)
150
300
ns
t
PU1
Power-up Time,
Crystal is used
Time from rising edge on PD# to outputs
at valid frequency (Asynchronous)
3
5
ms
t
PU2
Power-up Time,
Reference clock is used
Time from rising edge on PD# to outputs
at valid frequency (Asynchronous)
2
3
ms
Notes:
1.
Guaranteed by characterization, not 100% tested.
2.
Contact factory for desired crystal load programming.
PRELIMINARY
CY25000
Document #: 38-07424 Rev. *A
Page 4 of 9
Programming Description
The customers planning to use the CY25000 need to provide
the programming information described as "ENTER DATA" in
Table 1 and should contact local Cypress Sales.
Additional information on the CY25000 can be obtained from
the Cypress web site at www.cypress.com.
Product Functions
Input Frequency (XIN, pin 1 and XOUT
,
pin 8)
The input to the CY25000 can be a crystal or a clock. The input
frequency range for crystals is 8 to 30 MHz, and for clock sig-
nal is 8 to 166 MHz.
C
XIN
and C
XOUT
(pin 1 and pin 8)
The load capacitors at pin 1 (C
XIN
) and pin 8 (C
XOUT
) can be
programmed from 12 pF to 60 pF with 0.5-pF increments. The
programmed value of these on-chip crystal load capacitors are
the same (XIN = XOUT = 12 to 60 pF).
The required values of C
XIN
and C
XOUT
can be calculated us-
ing the following formula:
C
XIN
= C
XOUT
= 2C
L
- C
P
Where C
L
is the crystal load capacitor as specified by the crys-
tal manufacturer and C
P
is the parasitic PCB capacitance.
For example, if a fundamental 16-MHz crystal with C
L
of 16 pF
is used and C
P
is 2 pF, C
XIN
and C
XOUT
can be calculated as:
C
XIN
= C
XOUT
= (2 x 16) ­ 2 = 30 pF.
If using a driven reference, set C
XIN
and
C
XOUT
to the mini-
mum value 12 pF.
Output Frequency, SSCLK Output (SSCLK, pin 5)
The modulated frequency at the SSCLK output is produced by
synthesizing the input reference clock. The modulation can be
stopped by SSON digital control input (SSON = LOW, no mod-
ulation). If modulation is stopped, the clock frequency is the
nominal value of the synthesized frequency without modula-
tion (spread % = 0). The range of synthesized clock is from
3­200 MHz.
Spread Percentage (SSCLK, pin 5)
The SSCLK frequency can be programmed at any percentage
value from ±0.25% to ±2.5% for Center Spread and from
­0.5% to ­5.0% Down Spread.
Reference Output (REFOUT, pin 6)
The reference clock output has the same frequency and the
same phase as the input clock. This output can be pro-
grammed to be enabled (clock on) or disabled (High-Z, clock
off). If this output is not needed, it is recommended that users
request the disabled (High-Z, Clock Off) option.
Frequency Modulation
The frequency modulation is programmed at 30 kHz for all
SSCLK frequencies from 3 to 200 MHz. Contact the factory if
a higher modulation frequency is required.
Power-down or Output Enable (PD# or OE, pin 3):
Users can select either PD# or OE function which are also
factory programmable.
Table 1.
Pin
Function
Input
Frequency
C
XIN
and
C
XOUT
Output
Frequency
Spread
Percent
Reference
Output
Power-down or
Output Enable
Frequency
Modulation
Pin Name
XIN and XOUT
XIN and
XOUT
SSCLK
SSCLK
REFOUT
PD#/OE
SSCLK
Pin#
1 and 8
1 and 8
5
5
6
3
5
Units
MHz
pF
MHz
%
On or Off
Select PD# or OE
kHz
Program
Value
ENTER
DATA
ENTER
DATA
ENTER
DATA
ENTER
DATA
ENTER
DATA
ENTER
DATA
30
Application Circuit
[3, 4, 5]
Notes:
3.
Since the load capacitors (C
XIN
and C
XOUT
) are provided by the CY25000, no external capacitors are needed on the XIN
and XOUT pins to match the crystal
load capacitor (C
L
). Only a single 0.1-
µ
F bypass capacitor is required on the V
DD
pin.
4.
If an external clock is used, apply the clock to XIN (pin 1) and leave XOUT (pin 8) floating (unconnected).
5.
If SSON (pin 7) is LOW (V
SS
), the frequency modulation will be stopped on SSCLK pin (pin 5).
1
2
3
4
VDD
XOUT
VSS
SSCLK
REFCLK
5
6
7
8
XIN
SSON
CY
2
5000
Power
0.1
µ
F
VDD
VDD
PD#/OE
Crystal
PRELIMINARY
CY25000
Document #: 38-07424 Rev. *A
Page 5 of 9
Switching Waveforms
Duty Cycle Timing (DC = t
1A
/t
1B
)
t
1A
t
1B
OUTPUT
Output Rise/Fall Time (SSCLK and REFCLK)
OUTPUT
Tr
V
DD
0V
Tf
Output Rise time (Tr) = (0.6 x V
DD
)/SR1 (or SR3)
Output Fall time (Tf) = (0.6 x V
DD
)/SR2 (or SR4)
Refer to AC Electrical Characteristics table for SR (Slew Rate) values.
Power-down Timing and Power-up Timing
CLKOUT
V
DD
t
PU
t
STP
V
IL
V
IH
POWER-
DOWN
0V
(Asynchronous
)
High Impedance
Output Enable/Disable Timing
CLKOUT
V
DD
T
OE1
V
IL
V
IH
OUTPUT
ENABLE
0V
(Asynchronous
)
High Impedance
T
OE2