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Part Number CY23FS08

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FailsafeTM 2.5V/ 3.3V Zero Delay Buffer
CY23FS08
Cypress Semiconductor Corporation
·
3901 North First Street
·
San Jose
,
CA 95134
·
408-943-2600
Document #: 38-07518 Rev. *A
Revised May 12, 2004
Features
· Internal DCXO for continuous glitch-free operation
· Zero input-output propagation delay
· Low jitter (< 35 ps RMS) outputs
· Low output-output skew (< 200 ps)
· 1 MHz­200 MHz reference input
· Supports industry standard input crystals
· 200 MHz (commercial), 166 MHz (industrial) outputs
· 5V-tolerant inputs
· Phase-locked loop (PLL) Bypass Mode
· Dual Reference Inputs
· 28-pin SSOP
· Split 2.5V or 3.3V output power supplies
· 3.3V core power supply
· Industrial temperature available
Functional Description
The CY23FS08 is a FailSafe
TM
Zero Delay Buffer with two
reference clock inputs and eight phase-aligned outputs. The
device provides an optimum solution for applications where
continuous operation is required in the event of a primary clock
failure.
Continuous, glitch-free operation is achieved by using a
DCXO, which serves as a redundant clock source in the event
of a reference clock failure by maintaining the last frequency
and phase information of the reference clock.
The unique feature of the CY23FS08 is that the DCXO is in
fact the primary clocking source, which is synchronized
(phase-aligned) to the external reference clock. When this
external clock is restored, the DCXO automatically resynchro-
nizes to the external clock.
The frequency of the crystal, which will be connected to the
DCXO must be chosen to be an integer factor of the frequency
of the reference clock. This factor is set by four select lines:
S[4:1]. please see Table 1. The CY23FS08 has three split
power supplies; one for core, another for Bank A outputs and
the third for Bank B outputs. Each output power supply, except
VDDC can be connected to either 2.5V or 3.3V. VDDC is the
power supply pin for internal circuits and must be connected
to 3.3V.
Block Diagram
Pin Configuration
CLKA[1:4]
CLKB[1:4]
DCXO
Decoder
4
Failsafe
TM
Block
PLL
XIN XOUT
4
4
REF2
FBK
S[4:1]
FAIL# /SAFE
REF1
REFSEL
CLKB1
S2
S3
VDDB
CLKB2
S4
VDDB
XIN
VDDC
FAIL#/SAFE
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
CY23FS08
28 pin SSOP
REF1
REF2
VSSB
REFSEL
FBK
VSSA
CLKA1
CLKA2
S1
VDDA
9
10
11
12
13
14
VSSB
CLKB3
CLKB4
20
19
18
17
16
15
VSSA
CLKA3
CLKA4
VDDA
XOUT
CY23FS08
Document #: 38-07518 Rev. *A
Page 2 of 12
Pin Definitions
Pin Number
Pin Name
Description
1,2
REF1,REF2
5V-tolerant, reference clock inputs
[4]
.
4,5,10,11
CLKB[1:4]
Bank B clock outputs.
[1,2]
25,24,19,18
CLKA[1:4]
Bank A clock outputs.
[1,2]
27
FBK
Feedback input to the PLL.
[1,4]
23,6,7,22
S[1:4]
Frequency select pins/PLL and DCXO bypass.
[3]
14
XIN
Reference crystal input.
15
XOUT
Reference crystal output.
16
FAIL#/SAFE
Valid reference indicator. A high level indicates a valid reference input.
13
VDDC
3.3V power supply for the internal circuitry.
8,12
VDDB
2.5V or 3.3V power supply for Bank B outputs.
3,9
VSSB
Ground.
17,21
VDDA
2.5V or 3.3V power supply for Bank A outputs.
20,26
VSSA
Ground.
28
REFSEL
Reference select. Selects the active reference clock from either REF1 or REF2.
REFSEL = 1, REF1 is selected, REFSEL = 0, REF2 is selected.
Table 1. Configuration Table
S[4:1]
XTAL (MHz)
REF(MHz)
OUT(MHz)
REF:OUT
ratio
REF:XTAL
ratio
Out:XTAL ratio
Min.
Max.
Min.
Max.
Min.
Max.
0000
PLL and DCXO Bypass mode
1000
8.33
30
16.67
60.00
8.33
30.00
÷2
2
1
1110
9.50
30
57.00
180.00
28.50
90.00
÷2
6
3
0101
8.50
30
6.80
24.00
1.70
6.00
÷4
4/5
1/5
1011
8.33
30
25.00
90.00
6.25
22.50
÷4
3
3/4
0011
8.33
30
2.78
10.00
2.78
10.00
x1
1/3
1/3
1001
8.33
30
8.33
30.00
8.33
30.00
x1
1
1
1111
8.00
25
32.00
100.00
32.00
100.00
x1
4
4
1100
8.00
25
64.00
200.00
64.00
200.00
x1
8
8
0001
8.33
30
1.04
3.75
2.08
7.50
x2
1/8
1/4
0110
8.33
30
4.17
15.00
8.33
30.00
x2
1/2
1
1101
8.33
30
16.67
60.00
33.33
120.00
x2
2
4
0100
8.33
30
4.17
15.00
16.67
60.00
x4
1/2
2
1010
8.33
30
12.50
45.00
50.00
180.00
x4
3/2
6
0010
8.33
30
1.39
5.00
11.11
40.00
x8
1/6
4/3
0111
8.33
30
6.25
22.50
50.00
180.00
x8
3/4
6
Notes:
1.
For normal operation, connect either one of the eight clock outputs to the FBK input.
2.
Weak pull-downs on all outputs.
3.
Weak pull-ups on these inputs.
4.
Weak pull-downs on these inputs.
CY23FS08
Document #: 38-07518 Rev. *A
Page 3 of 12
FailSafe Function
The CY23FS08 is targeted at clock distribution applications
that could or which currently require continued operation
should the main reference clock fail. Existing approaches to
this requirement have utilized multiple reference clocks with
either internal or external methods for switching between
references. The problem with this technique is that it leads to
interruptions (or glitches) when transitioning from one
reference to another, often requiring complex external circuitry
or software to maintain system stability. The technique imple-
mented in this design completely eliminates any switching of
references to the PLL, greatly simplifying system design.
The CY23FS08 PLL is driven by the crystal oscillator, which is
phase-aligned to an external reference clock so that the output
of the device is effectively phase-aligned to reference via the
external feedback loop. This is accomplished by utilizing a
digitally controlled capacitor array to pull the crystal frequency
over an approximate range of +300 ppm from its nominal
frequency.
In this mode, should the reference frequency fail (i.e., stop or
disappear), the DCXO maintains its last setting and a flag
signal (FAIL#/SAFE) is set to indicate failure of the reference
clock.
The CY23FS08 provides four select bits, S1 through S4 to
control the reference to crystal frequency ratio. The DCXO is
internally tuned to the phase and frequency of the external
reference only when the reference frequency divided by this
ratio is within the DCXO capture range. If the frequency is out
of range, a flag will be set on the FAIL#/SAFE pin notifying the
system that the selected reference is not valid. If the reference
moves in range, then the flag will be cleared, indicating to the
system that the selected reference is valid.
Table 2. FailSafe Timing Table
Parameter
Description
Conditions
Min.
Max.
Unit
t
FSL
Fail#/Safe Assert Delay
Measured at 80% to 20%, Load = 15 pF
See Figure 2
ns
t
FSH
Fail#/Safe Deassert Delay
Measured at 80% to 20%, Load = 15 pF
See Figure 2
ns
R E F
O U T
F A I L # / S A F E
t
F S L
t
F S H
Figure 1. Fail#/Safe Timing for Input Reference Failing Catastrophically
n
=
F
R E F
F
X T A L
= 4
( in a b o v e e x a m p le )
t
F S L ( m a x )
= 2
t
R E F
x n
(
)
+
2 5 n s
t
F S H ( m in )
= 1 2
t
R E F
x n
(
)
+
2 5 n s
Figure 2. Fail#/Safe Timing Formula
CY23FS08
Document #: 38-07518 Rev. *A
Page 4 of 12
Reference + 300 ppm
Reference - 300 ppm
Reference
Output + 300 ppm
Output - 300 ppm
Output
Fail#/Safe
t
FSH
Reference Off
t
FSL
Time
Freq
u
e
ncy
Volt
Figure 3. FailSafe Timing Diagram: Input Reference Slowly Drifting Out of FailSafe Capture Range
Failsafe typical frequency settling time
Initial valid Ref1=20MHz +100ppm,
then switching to REF2=20MHz
0
50
100
150
0
0.45
1.3
2.5
SETTLING TIME (ms)
O
U
TPUT FREQ
UENCY
DELTA (ppm)
Figure 4. FailSafe Reference Switching Behavior
CY23FS08
Document #: 38-07518 Rev. *A
Page 5 of 12
Figure 5. FailSafe Effective Loop Bandwidth (min)
R E F 1
R E F 2
R E F S E L
0 m s
1 .4 m s
0 d e g
-1 8 0 d e g
0 m s
Figure 6. Sample Timing of Muxing Between Two Reference Clocks 180°C Out of Phase and Resulting Output
Phase Offset Typical Settling Time (105 MHz)
CY23FS08
Document #: 38-07518 Rev. *A
Page 6 of 12
0ms
1.4 ms
0
190fs/cy
190 fsec/cycle = 0.125 mradian/cycle
Figure 7. Resulting Output Dphase/Cycle Typical Rate of Change (105 MHz)
t
1
t
2
D u ty C y c le - t
D C
t
S R (O )
S le w R a te - t
(S R )
V
D D
0 V
2 0 %
8 0 %
8 0 %
2 0 %
V
D D
/2
V
D D
/2
V
D D
/2
V
D D
0 V
O u tp u t-O u tp u t S k e w - t
S K (O )
V
D D
/2
V
D D
/2
t
S K (O )
t
S R (O )
P a rt to P a rt S k e w - t
S K (P P )
F B K ,
P a rt 1
V
D D
/2
t
S K (P P )
V
D D
/2
F B K ,
P a rt 2
S ta tic P h a s e O ffs e t - t
(
)
R E F
V
D D
/2
t
(
)
V
D D
/2
F B K
CY23FS08
Document #: 38-07518 Rev. *A
Page 7 of 12
XTAL Selection Criteria and Application Example
Choosing the appropriate XTAL will ensure the FailSafe device
will be able to span an appropriate frequency of operation.
Also, the XTAL parameters will determine the holdover
frequency stability. Critical parameters are as follows. Our
recommendation is to choose:
· Low C0/C1 ratio (240 or less) so that the XTAL has enough
range of pullability.
· Low temperature frequency variation
· Low manufacturing frequency tolerance
· Low aging.
C0 is the XTAL shunt capacitance (3 pF ­ 7 pF typ.).
C1 is the XTAL motional capacitance (10 fF ­ 30 fF typ).
The capacitive load as "seen" by the XTAL is across its
terminals. It is named Clmin (for minimum value), and Clmax
(for maximum value).These are used for calculating the pull
range.
Please note that the Cl range "center" is approximately 20 pF,
but we may not want a XTAL calibrated to that load. This is
because the pullability is not linear, as represented in the
equation above. Plotting the pullability of the XTAL shows this
expected behavior as shown in Figure 8. In this example,
specifying a XTAL calibrated to 14 pF load provides a
balanced ppm pullability range around the nominal frequency.
Notes:
5.
The above example shows the maximum range the FailSafe internal capacitor array is capable of (0 to 48.6 pF).Cypress recommends the min./max capacitor
array values be programmed to a narrower range such as 6 pF­30 pF, or 7.5 pF­27 pF. This ensures the XTAL operates between series resonance and
anti-resonance. Please contact Cypress for choosing these range settings.
Clmin = (12 pF IC input cap + 0 pF pulling cap+ 6 pF trace cap on board)/2 = 9 pF
Clmax = (12 pF IC input cap + 48 pF pulling cap+ 6 pF trace cap on board)/2 = 33 pF
Pull Range =(fClmin­fClmax)/fClmin = ((C1)/2)[(1/(C0+Clmin))­(1/(C0+Clmax))]
Pull Range in ppm = ((C1)/2)[(1/(C0+Clmin))­(1/(C0+Clmax))] × 10
6
Example:
[5]
Figure 8. Frequency vs. Cload Behavior for Example XTAL
Pullability Range Vs. Cload
(Normalized to 14pF Cload)
-400.00
-300.00
-200.00
-100.00
0.00
100.00
200.00
300.00
400.00
6
8 10 12 14 16 18 20 22 24 26 28 30 32 34
Cload (pF)
Delta Freq. from nom
C0/C1 = 200
C0/C1 = 300
C0/C1 = 400
CY23FS08
Document #: 38-07518 Rev. *A
Page 8 of 12
Calculated value of the pullability range for the XTAL with
C0/C1 ratio of 200, 300 and 400 are shown in Table 3. For this
calculation Cl(min) = 8pF and Cl(max)= 32pF has been used.
Using a XTAL that has a nominal frequency specified at load
capacitance of 14pF, almost symmetrical pullability range has
been obtained.
Next, it is important to calculate the pullability range including
error tolerances. This would be the capture range of the input
reference frequency that the FailSafe device and XTAL combi-
nation would reliably span.
Calculating the capture range involves subtracting error
tolerances as follows:
Parameter........................................................ f error (ppm)
Manufacturing frequency tolerance ...................................15
Temperature stability ..........................................................30
Aging ................................................................................... 3
Board/trace variation ........................................................... 5
Total ....................................................................................53
Example: Capture Range for XTAL with C0/C1 Ratio of 200
Negative Capture Range
= ­385 ppm + 53 ppm = ­332 ppm
Positive Capture Range = 333 ppm ­ 53 ppm = +280 ppm
It is important to note that the XTAL with lower C0/C1 ratio has
wider pullability/capture range as compared to the higher
C0/C1 ratio. This will help the user in selecting the appropriate
XTAL for use in the FailSafe application.
Table 3. Pullability Range from XTAL with Different C0/C1
Ratio
C0/C1 Ratio
Cload(min.)
Cload(max.)
Pullability
Range
200
8.0
32.0
­385 333
300
8.0
32.0
­256 222
400
8.0
32.0
­192 166
Absolute Maximum Conditions
Parameter
Description
Condition
Min.
Max.
Unit
V
DD
Supply Voltage
­0.5
4.6
V
V
IN
Input Voltage
Relative to V
SS
­0.5
V
DD
+0.5
VDC
T
S
Temperature, Storage
Non Functional
­65
+150
°C
T
A
Temperature, Operating Ambient
Commercial Grade
0
70
°C
Industrial Grade
­40
85
°C
T
J
Temperature, Junction
Functional
125
°C
ESD
HBM
ESD Protection (Human Body Model)
MIL-STD-883, Method 3015
2000
V
Ø
JC
Dissipation, Junction to Case
Mil-Spec 883E Method 1012.1
36.17
°C/W
Ø
JA
Dissipation, Junction to Ambient
JEDEC (JESD 51)
100.6
°C/W
UL­94
Flammability Rating
At 1/8 in.
V­0
MSL
Moisture Sensitivity Level
1
Multiple Supplies: The Voltage on any input or I/O pin cannot exceed the power pin during power-up. Power supply sequencing is NOT required.
Recommended Pullable Crystal Specifications
[6]
Parameter
Name
Comments
Min.
Typ.
Max.
Unit
F
NOM
Nominal crystal frequency
Parallel resonance, fundamental mode,
AT cut
8.00
­
30.00
MHz
C
LNOM
Nominal load capacitance
­
14
­
pF
R
1
Equivalent series resistance (ESR)
Fundamental mode
­
­
25
R
3
/R
1
Ratio of third overtone mode ESR to
fundamental mode ESR
Ratio used because typical R
1
values
are much less than the maximum spec
3
­
­
DL
Crystal drive level
No external series resistor assumed
­
0.5
2
mW
F
3SEPLI
Third overtone separation from 3*F
NOM
High side
300
­
­
ppm
F
3SEPLO
Third overtone separation from 3*F
NOM
Low side
­
­
­150
ppm
C
0
Crystal shunt capacitance
­
­
7
pF
C
0
/C
1
Ratio of shunt to motional capacitance
180
­
250
C
1
Crystal motional capacitance
14.4
18
21.6
fF
Note:
6.
Ecliptek ECX-5788-13.500M, ECX-5807-19.440M, ECX-5872-19.53125M, ECX-5806-18.432M, ECX-5808-27.000M, ECX-5884-17.664M,
ECX-5883-16.384M,ECX-5882-19.200M,ECX-5880-24.576M meet these specifications.
CY23FS08
Document #: 38-07518 Rev. *A
Page 9 of 12
Table 4. Operating Conditions for FailSafe Commercial/Industrial Temperature Devices
Parameter
Description
Min. Max. Unit
V
DDC
3.3V Supply Voltage
3.135 3.465
V
V
DDA,
V
DDB
2.5V Supply Voltage Range
2.375 2.625
V
3.3V Supply Voltage Range
3.135 3.465
V
T
A
Ambient Operating Temperature, Commercial
0
70
°C
Ambient Operating Temperature, Industrial
­40
85
°C
C
L
Output Load Capacitance (Fout < 100 MHz)
30
pF
Output Load Capacitance (Fout > 100 MHz)
15
pF
C
IN
Input Capacitance (except XIN)
7
pF
C
XIN
Crystal Input Capacitance (all internal caps off)
10
13
pF
T
PU
Power-up time for all VDDs to reach minimum specified voltage (power ramps must be monotonic) 0.05
500
ms
Table 5. Electrical Characteristics for FailSafe Commercial/Industrial Temperature Devices
Parameter
Description
Test Conditions
Min.
Typ.
Max.
Unit
V
IL
Input Low Voltage
CMOS Levels, 30% of V
DD
0.3xV
DD
V
V
IH
Input High Voltage
CMOS Levels, 70% of V
DD
0.7xV
DD
V
I
IL
Input Low Current
V
IN
=V
SS
(100k pull-up only)
50
µA
I
IH
Input High Current
V
IN
=V
DD
(100k pull-down only)
50
µA
I
OL
Output Low Current
V
OL
=0.5V, V
DD
= 2.5V
18
mA
V
OL
=0.5V, V
DD
= 3.3V
20
mA
I
OH
Output High Current
V
OH
=V
DD
­0.5V, V
DD
= 2.5V
18
mA
V
OH
=V
DD
­0.5V, V
DD
= 3.3V
20
mA
I
DDQ
Quiescent Current
All Inputs grounded, PLL and DCXO in
bypass mode, Reference Input = 0
250
µA
Table 6. Switching Characteristics for FailSafe Commercial/Industrial Temperature Devices
Parameter
[8]
Description
Test Conditions
Min.
Max.
Unit
f
REF
Reference Frequency
Commercial Grade
1.04
200
MHz
Industrial Grade
1.04
166.7
MHz
f
OUT
Output Frequency
15-pF Load, Commercial Grade
1.70
200
MHz
15-pF Load, Industrial Grade
1.70
166.7
MHz
f
XIN
DCXO Frequency
8.0
30
MHz
t
DC
Duty Cycle
Measured at V
DD
/2
47
53
%
t
SR(I)
Input Slew Rate
Measured on REF1 Input, 30% to 70% of V
DD
0.5
4.0
V/ns
t
SR(O)
Output Slew Rate
Measured from 20% to 80% of V
DD
= 3.3V, 15 pF Load
0.8
4.0
V/ns
Measured from 20% to 80% of V
DD
=2.5V, 15 pF Load
0.4
3.0
V/ns
t
SK(O)
Output to Output Skew All outputs equally loaded, measured at V
DD
/2
200
ps
t
SK(IB)
Intrabank Skew
All outputs equally loaded, measured at V
DD
/2
75
ps
t
SK(PP)
Part to Part Skew
Measured at V
DD
/2
500
ps
t
(
)
[7]
Static Phase Offset
Measured at V
DD
/2
250
ps
t
D(
)
[7]
Dynamic Phase Offset Measured at V
DD
/2
200
ps
t
J(CC)
Cycle-to-Cycle Jitter
Load = 15 pF, f
OUT
6.25 MHz
200
ps
35
ps
RMS
t
LOCK
PLL Lock Time
Stable power supply, valid clock at REF
1.0
ms
Note:
7.
The
t
(
)
reference feedback input delay is guaranteed for a maximum 4:1 input edge ratio between the two signals as long as
t
SR(I) is maintained.
8.
Parameters guaranteed by design and characterization, not 100% tested in production.
9.
Includes typical board trace capacitance of 6­7pF each XIN, XOUT.
CY23FS08
Document #: 38-07518 Rev. *A
Page 10 of 12
Ordering Information
Part Number
Package Type
Product Flow
CY23FS08OI
28-pin SSOP
Industrial, ­40°C to 85°C
CY23FS08OIT
28-pin SSOP ­ Tape and Reel
Industrial, ­40°C to 85°C
CY23FS08OC
28-pin SSOP
Commercial, 0°C to 70°C
CY23FS08OCT
28-pin SSOP ­ Tape and Reel
Commercial, 0°C to 70°C
CY23FS08
Document #: 38-07518 Rev. *A
Page 11 of 12
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Cypress products are not warranted nor intended to be used for medical, life-support, life-saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress.
Package Drawing and Dimensions
FailSafe is a trademark of Cypress Semiconductor. All product and company names mentioned in this document are the trademarks
of their respective holders.
28-Lead (5.3 mm) Shrunk Small Outline Package O28
51-85079-*C
CY23FS08
Document #: 38-07518 Rev. *A
Page 12 of 12
Document History Page
Document Title: CY23FS08 FailsafeTM 2.5V/ 3.3V Zero Delay Buffer
Document #: 38-07518 Rev. *A
REV.
ECN NO.
Issue
Date
Orig. of
Change
Description of Change
**
123699
04/23/03
RGL
New Data Sheet
*A
224067
See ECN
RGL/ZJX Changed the XTAL Specifications table.