DS-CPC5620/5621-R0.E
www.clare.com
1
Preliminar
y
Features
·
Superior voice solution with high power option, low
noise, no automatic gain control circuit, and excel-
lent part-to-part gain accuracy
·
Data access arrangement (DAA) solution for modems at
speeds up to V.92
·
3.3 or 5 V power supply operation
·
Caller ID signal reception function
·
Easy interface with modem ICs and voice CODECs
·
Worldwide dial-up telephone network compatibility
·
Supplied application circuit complies with the
requirements of TIA/EIA/IS-968 (FCC part 68),
UL1950, UL60950, EN60950, IEC60950,
EN55022B, CISPR22B, EN55024, and TBR-21
·
Complies with UL1577
·
Line-side circuit powered from telephone line
·
Compared to other silicon DAA solutions, LITELINK:
-
Uses fewer passive components
-
Takes up less printed-circuit board space
-
Uses less telephone line power
-
Offers simplified operation
-
Is a single-chip solution
Applications
·
Computer telephony and gateways, such as VoIP
·
PBXs
·
Satellite and cable set-top boxes
·
V.92 (and other standard) modems
·
Fax machines
·
Voicemail systems
·
Embedded modems for POS terminals, automated
banking, remote metering, vending machines, secu-
rity, and surveillance
Description
LITELINK III is a single-package silicon phone line
interface/DAA used in voice and data communication
applications to make connections between host equip-
ment and telephone networks.
LITELINK provides a high-voltage isolation barrier, AC
and DC phone line termination, switchhook, 2-wire to
4-wire hybrid, ring detection, and on-hook signal
detection. LITELINK can be used in both differential
and single-ended signal applications.
LITELINK uses on-chip optical components and a few
inexpensive external components to form a complete
voice or high-speed data phone line interface.
LITELINK eliminates the need for the large isolation
transformers or capacitors used in other interface con-
figurations. It incorporates the required high-voltage
isolation barrier in the surface-mount SOIC package.
The CPC5620 (half-wave ring detect) and CPC5621
(full-wave ring detect) PLIs build upon Clare's
LITELINK II line, with improved insertion loss control,
improved noise performance, and lower minimum cur-
rent draw from the phone line.
Ordering Information
Figure 1. CPC5620/CPC5621 Block Diagram
Part Number
Description
CPC5620A
32-pin PLI with half-wave ring detect, tubed
CPC5620ATR
32-pin PLI with half-wave ring detect, tape
and reel
CPC5621A
32-pin PLI with full-wave ring detect, tubed
CPC5621ATR
32-pin PLI with full-wave ring detect, tape and
reel
Transconductance
Stage
2-4 Wire Hybrid
AC/DC Termination
Hookswitch
Isolation Barrier
Vref
Gain Trim
Vref
Gain Trim
Snoop Amplifier
Receive
Isolation
Amplifier
Transmit
Isolation
Amplifier
TIP+
RING-
Transmit
Diff.
Amplifier
Receive
Diff.
Amplifier
CID/
RING
MUX
Tx+
Tx-
OH
RING
MODE
CID
Rx+
Rx-
Current Limit Control
AC Impedance Control
VI Slope Control
C
SNOOP
C
SNOOP
R
SNOOP
R
SNOOP
CPC5620/CPC5621
LITELINKTM III Phone Line Interface IC (DAA)
CPC5620/CPC5621
2
www.clare.com
R0.E
Preliminar
y
1 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Resistive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1.1 Resistive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Reactive Termination Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2.1 Reactive Termination Application Circuit Part List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 Using LITELINK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Switch Hook Control (On-hook and Off-hook States) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2 On-hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.1 Ring Signal Reception via the Snoop Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.2.2 Polarity Reversal Detection with CPC5621 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.2.3 On-hook Caller ID Signal Reception . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3 Off-Hook Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.1 Receive Signal Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.3.2 Transmit Signal Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 Start-up Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5 DC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5.1 Non-Current Limited Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5.2 Current Limited Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6 AC Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6.1 Resistive Termination Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6.2 Reactive Termination Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6.3 Mode Pin Usage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 LITELINK Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Clare, Inc. Design Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Third Party Design Resources. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6 LITELINK Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7 Manufacturing Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2 Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.1 Moisture Reflow Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3.2 Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.4 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
CPC5620/CPC5621
Rev. 0.E
www.clare.com
3
Preliminar
y
1. Electrical Specifications
1.1 Absolute Maximum Ratings
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at these or
any other conditions beyond those indicated in the opera-
tional sections of this data sheet is not implied. Exposure of
the device to the absolute maximum ratings for an
extended period may degrade the device and affect its reli-
ability.
1.2 Performance
Parameter
Minimum
Maximum
Unit
Isolation Voltage
1500
-
V
RMS
Continuous Tip to Ring
Current (R
ZDC
= 5.2
)
150
mA
Total Package Power Dis-
sipation
1
W
Operating temperature
0
+85
°C
Storage temperature
-40
+125
°C
Soldering temperature
-
+220
°C
Parameter
Minimum
Typical
Maximum
Unit
Conditions
DC Characteristics
Operating Voltage V
DD
3.0
-
5.50
V
Host side
Operating Current I
DD
-
-
10
mA
Host side
Operating Voltage V
DDL
2.8
-
3.2
V
Line side, derived from tip and ring
Operating Current I
DDL
-
7
8
mA
Line side, drawn from tip and ring while off-hook
On-hook Characteristics
Metallic DC Resistance
10
-
-
M
Tip to ring, 100 Vdc applied
Longitudinal DC Resistance
10
-
-
M
150 Vdc applied from tip and ring to Earth ground
Ring Signal Detect Level
5
-
-
V
RMS
68 Hz ring signal applied to tip and ring
Ring Signal Detect Level
28
-
-
V
RMS
15 Hz ring signal applied across tip and ring
Snoop Circuit Frequency Response
166
-
>4000
Hz
-3 dB corner frequency @ 166 Hz, in Clare applica-
tion circuit
Snoop Circuit CMRR
-
-40
-
dB
120 V
RMS
60 Hz common-mode signal across tip
and ring
Ringer Equivalence
-
0.1B
-
REN
Longitudinal Balance
60
-
-
dB
Per FCC part 68.3
Off-Hook Characteristics
AC Impedance
-
600
-
Tip to ring, using resistive termination application
circuit
Longitudinal Balance
40
-
-
dB
Per FCC part 68.3
Return Loss
-
26
-
dB
Into 600
at 1800 Hz
Transmit and Receive Characteristics
Frequency Response
30
-
4000
Hz
-3 dB corner frequency 30 Hz
Trans-Hybrid Loss
-
36
-
dB
Into 600
at 1800 Hz, with C18 in the resistive ter-
mination application circuit
CPC5620/CPC5621
4
www.clare.com
Rev. 0.E
Preliminar
y
Transmit and Receive Insertion Loss
-0.4
0
0.4
dB
30 Hz to 4 kHz, for resistive termination application
circuit with MODE de-asserted and for reactive ter-
mination application circuit with MODE asserted.
Average In-band Noise
-
-126
-
dBm/Hz
4 kHz flat bandwidth
Harmonic Distortion
-
-80
-
dB
-3 dBm, 600 Hz, 2
nd
harmonic
Transmit Level
-
0
2.2
V
P-P
Single-tone sine wave. Or 0 dBm into 600
.
Receive Level
-
-
2.2
V
P-P
Single-tone sine wave. Or 0 dBm into 600
.
RX+/RX- Output Drive Current
-
-
0.5
mA
Sink and source
TX+/TX- Input Impedance
60
90
120
k
Isolation Characteristics
Isolation Voltage
1500
-
-
V
RMS
Line side to host side
Surge Rise Time
2000
-
-
V/
µ
S
No damage via tip and ring
MODE, OH, and CID Control Logic Inputs
Input Threshold Voltage
0.8
-
2.0
V
High Level Input Current
-120
-
0
µ
A
V
IN
V
DD
Low Level Input Current
-
-
-120
µ
A
V
IN
=GND
RING Output Logic Levels
Output High Voltage
V
DD
-0.4
-
-
V
I
OUT
= -400
µ
A
Output Low Voltage
-
-
0.4
V
I
OUT
= 1 mA
Specifications subject to change without notice. All performance characteristics based on the use of Clare application circuits. Functional operation of the device at
conditions beyond those specified here is not implied. All specifications at 25 °C
Parameter
Minimum
Typical
Maximum
Unit
Conditions
CPC5620/CPC5621
Rev. 0.E
www.clare.com
5
Preliminar
y
1.3 Pin Description
Figure 2. Pinout
Pin
Name
Function
1
VDD
Host (CPE) side power supply
2
TXSM
Transmit summing junction
3
TX-
Negative differential transmit signal to DAA
from host
4
TX+
Positive differential transmit signal to DAA from
host
5
TX
Transmit differential amplifier output
6
MODE
When asserted low, changes gain of TX path
(-7 dB) and RX path (+7 dB) to accommodate
reactive termination networks
7
GND
Host (CPE) side analog ground
8
OH
Assert logic low for off-hook operation
9
RING
Indicates ring signal, pulsed high to low
10 CID
Assert logic low while on hook to place CID
information on RX pins.
11 RX-
Negative differential analog signal received
from the telephone line. Must be AC coupled
with 0.1
µ
F.
12 RX+
Positive differential analog signal received from
the telephone line. Must be AC coupled with
0.1
µ
F.
13 SNP+
Positive differential snoop input
14 SNP-
Negative differential snoop input
15 RXF
Receive photodiode amplifier output
16 RX
Receive photodiode summing junction
17 VDDL
Power supply for line side, regulated from tip
and ring.
18 RXS
Receive isolation amp summing junction
19 RPB
Receive LED pre-bias current set
20 BR-
Bridge rectifier return
21 ZDC
Electronic inductor DCR/current limit
22 DCS2
DC feedback output
23 DCS1
V to I slope control
24 NTF
Network amplifier feedback
25 GAT
External MOSFET gate control
26 NTS
Receive signal input
27 BR-
Bridge rectifier return
28 TXSL
Transmit photodiode summing junction
29 ZNT
Receiver impedance set
30 ZTX
Transmit transconductance gain set
31 TXF
Transmit photodiode amplifier output
32 REFL
1.25 Vdc reference
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VDD
TXSM
TX-
TX+
TX
MODE
GND
OH
RING
CID
RX-
RX+
SNP+
SNP-
RXF
RX
REFL
TXF
ZTX
ZNT
TXSL
BR-
NTS
GAT
NTF
DCS1
DCS2
ZDC
BR-
RPB
RXS
VDDL
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