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DS-CPC1001N-R00A.3
1
PRELIMINAR
Y
CPC1001N
Solid State Current Sensors
Part #
Description
CPC1001N
4 Pin SOP (100/Tube)
CPC1001NTR
4 Pin SOP Surface Mount (2000/Reel)
CPC1001N
Units
Break Down Voltage
20
V
Current Transfer Ratio
200 (TYP)
%
Saturation Voltage
0.3 (MAX)
V
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
·
Small 4 Pin SOP Package
·
100mA Continuous Load Rating
·
1500V
RMS
Input/Output Isolation
·
Machine Insertable, Wave Solderable
·
Surface Mount and Tape & Reel Version Available
·
Telecom Switching
·
Tip/Ring Circuits
·
Modem Switching (Laptop, Notebook, Pocket Size)
·
Loop Detect
·
Ring Detect
·
Current Sensing
CPC1001N is a unidirectional input optocoupler with
a single transistor output. Current transfer ratios
range from 33% to 1000%.
·
UL Recognized: File Number E76270
·
CSA Certified: File Number LR 43639-10
·
Certified to:
·
EN 60950
1
2
3
4
+ Control
Control
Load
Load
CPC1001N Pinout
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2
CPC1001N
R00A.3
PRELIMINAR
Y
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter
Conditions
Symbol
Min
Typ
Max
Units
Output Characteristics @ 25°C
Phototransistor Blocking Voltage
I
C
=10µA
BV
CEO
20
50
-
V
Phototransistor Offstate
leakage Current
V
CE
=40V, I
F
=0mA
I
CEO
-
-
100
nA
Saturation Voltage
I
F
=10mA, I
C
=2mA
V
SAT
-
-
0.3
V
Current Transfer Ratio
I
F
=5mA, V
CE
=5V
CTR
33
200
-
%
Output Capacitance
50V, f=1 MHz
C
OUT
-
3
-
pF
Input Characteristics @ 25°C
Input Voltage Drop
I
F
=5mA
V
F
0.9
1.2
1.4
V
Input Reverse Current
V
R
=5V
I
R
-
-
10
µA
Parameter
Ratings
Units
Input Power Dissipation
150
1
mW
Input Control Current
100
mA
Peak (10ms)
1
A
Reverse Input Voltage
5
V
Phototransistor
150
mW
Power Dissipation
Total Package Dissipation
400
mW
Isolation Voltage
Input to Output
1500
V
RMS
Operational Temperature
-40 to +85
°
C
Storage Temperature
-40 to +125
°
C
Soldering Temperature
(10 Seconds Max.)
+220
°
C
1
Derate Linearly 1.33 mw/
o
C
Absolute Maximum Ratings (@ 25° C)
Electrical Characteristics
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions
at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support
or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make
changes to its products at any time without notice.
Specification: DS-CPC1001N-R00A.3
©Copyright 2003, Clare, Inc.
OptoMOS
®
is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
5/16/03
For additional information please visit our website at: www.clare.com
PRELIMINAR
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MECHANICAL DIMENSIONS
4 Pin SOIC Narrow ("N" Suffix)
PC Board Pattern (Top View)
0.20 ± 0.025
(0.008 ± 0.001)
2.54 TYP.
(0.100 TYP.)
2.18 MAX.
(0.086 MAX.)
1.02 ± 0.025
(0.040 ± 0.001)
3.81 ± 0.08
(0.150 ± 0.003)
6.096 ± 0.102
(0.240 ± 0.004)
0.38 x 45¼
(0.015 x 45¼ )
0.38 TYP.
(0.015 TYP.)
4.09 ± 0.20
(0.161 ± 0.008)
0.432 ± 0.127
(0.017 ± 0.005)
2.54 ± 0.127
(0.100 ± 0.005)
5.66 ± 0.14
(0.223 ± 0.005)
1.448
(0.057)
0.889
(0.035)
B
0
= 4.70
(0.185)
A
A
P = 8.00
(0.315)
W = 12.00 MAX
(0.472 MAX)
K
1
= 2.30
(0.091)
SECTION A-A
Tape and Reel Packaging for 4 pin SOIC package
330.2 DiA
(13.00" DiA)
Top Cover
Tape Thickness
0.102 MAX
(0.004 MAX)
K
0
= 2.7
(0.106)
Embossment
Embossed
Carrier
A
0
= 6.50
(0.256)
NOTE: Tape dimensions not shown, comply with JEDEC Standard EIA-481-2
Dimensions
mm
(inches)
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