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Part Number CSPEMI202A

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© 2003 California Micro Devices Corp. All rights reserved.
10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
1
CSPEMI202A
2 Channel Headset Microphone EMI Filter with ESD Protection
Features
·
Two channels of EMI filtering
·
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
·
Greater than 40dB attenuation at 1GHz
·
+
8kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
·
+
15kV ESD protection on each channel (HBM)
·
Supports bipolar signals--ideal for
audio applications
·
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
·
5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
·
Lead-free version available
Applications
·
EMI filtering and ESD protection for headset
microphone ports
·
Wireless Handsets
·
Handheld PCs / PDAs
·
MP3 Players
·
Digital Camcorders
·
Notebooks
·
Desktop PCs
Product Description
The CSPEMI202A is a dual low-pass filter array inte-
grating two pi-style filters (C-R-C) that reduce EMI/RFI
emissions while at the same time providing ESD pro-
tection. This part is custom-designed to interface with a
microphone port on a cellular telephone or similar
device. Each high quality filter provides more than
35dB attenuation in the 800-2700 MHz range. These
pi-style filters support bidirectional filtering, controlling
EMI both to and from a microphone element. They also
support bipolar signals, enabling audio signals to pass
through without distortion.
In addition, the CSPEMI202A provides a very high
level of protection for sensitive electronic components
that may be subjected to electrostatic discharge (ESD).
The input pins are designed and characterized to
safely dissipate ESD strikes of 8kV, the maximum
requirement of the IEC 61000-4-2 international stan-
dard. Using the MIL-STD-883 (Method 3015) specifica-
tion for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater
than 15kV.
The CSPEMI202A is particularly well suited for porta-
ble electronics (e.g., cellular telephones, PDAs, note-
book computers) because of its small package format
and low weight. The CSPEMI202A is available in a
space-saving, low-profile Chip Scale Package with
optional lead-free finishing.
Electrical Schematic
68
47pF
47pF
68
C1
C3
A1
A3
B2
MIC_OUT1
MIC_OUT2
GND
MIC_IN2
MIC_IN1
47pF
47pF
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© 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
10/09/03
CSPEMI202A
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
MIC_IN1
Microphone Input 1 (from microphone)
A3
MIC_IN2
Microphone Input 2 (from microphone)
B2
GND
Device Ground
C1
MIC_OUT1
Microphone Output 1 (to audio circuitry)
C3
MIC_OUT2
Microphone Output 2 (to audio circuitry)
MIC_IN1
MIC_IN2
MIC_OUT1
MIC_OUT2
A1
A3
C3
C1
GND
B2
Orientation
Marking
A1
AD
2 3
1
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Note:
CSPEMI202A
CSP Package
TOP VIEW
BOTTOM VIEW
(Bumps Down View)
(Bumps Up View)
2) Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
1) These drawings are not to scale.
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
5
CSP
CSPEMI202A
AD
CSPEMI202AG
AD
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© 2003 California Micro Devices Corp. All rights reserved.
10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846
L www.calmicro.com
3
CSPEMI202A
Specifications
Note 1: T
A
=25
°
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
200
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
1
Resistance
61
68
75
C
1
Capacitance
38
47
56
pF
I
LEAK
Diode Leakage Current
V
IN
=5.0V
1.0
µA
V
SIG
Signal Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
5
-5
7
-10
15
-15
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2,4 and 5
±15
±8
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2,3,4 and 5
+15
-19
V
V
f
C
Cut-off frequency
Z
SOURCE
= 50
, Z
LOAD
= 50
R = 68
, C = 47pF
60
MHz
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© 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
10/09/03
CSPEMI202A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
background image
© 2003 California Micro Devices Corp. All rights reserved.
10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846
L www.calmicro.com
5
CSPEMI202A
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
µm
Solder Ball Side Coplanarity
+20
µm
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260°C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature (°
C)

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