05/13/04

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846 www.calmicro.com

CM1415

3 Channel Headset EMI Filter with ESD Protection

Features

Functionally and pin compatible with California
Micro Device's CSPEMI205

Optiguard

coated for improved reliability at

assembly

Three channels of EMI filtering, two for earpiece
speakers and one for a microphone

Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network

Greater than 30dB relative attenuation in the 800-
2700MHz range

8kV ESD protection on each channel

(IEC 61000-4-2 Level 4, contact discharge)

15kV ESD protection on each channel (HBM)

8-bump, 1.41mm X 1.45mm footprint
Chip Scale Package (CSP)

Chip Scale Package features extremely low para-
sitic inductance for optimum filter performance

Lead-free version available

Applications

EMI filtering and ESD protection for headset micro-
phone and speaker

Cellular / Mobile Phones

Notebooks and Personal Computers

Handheld PCs / PDAs / Tablets

Wireless Handsets

Digital Camcorders

Product Description

The CM1415 is a low-pass filter array integrating three
pi-style filters (C-R-C) that reduce EMI/RFI emissions
while at the same time providing ESD protection. This
device is custom-designed to interface with the head-
set port on a cellular telephone, and contains two dif-
ferent filter values. Each high quality filter provides
more than 30dB attenuation in the 800-2700 MHz
range. These pi-style filters support bidirectional filter-
ing, controlling EMI both to and from the microphone
and speaker elements. They also support bipolar sig-
nals, enabling audio signals to pass through without
distortion.

In addition, the CM1415 provides a very high level of
protection for sensitive electronic components that may
be subject to electrostatic discharge (ESD). The input
pins are designed and characterized to safely dissipate
ESD strikes of

8kV, the maximum requirement of the

IEC 61000-4-2 international standard. Using the MIL-
STD-883 (Method 3015) specification for Human Body
Model (HBM) ESD, the device provides protection for
contact discharges to greater than

15kV.

The CM1415 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight.

The CM1415 incorporates Optiguard

coating which

results in improved reliability at assembly. The CM1415
is available in a space-saving, low-profile Chip Scale
Package with optional lead-free finishing.

Electrical Schematic

100p

Earpiece 1

GND

Input

Earpiece 2

Input

Earpiece 1
Output

Earpiece 2
Output

100

100p

47p

Microphone

Input

Microphone
Output

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846 www.calmicro.com

05/13/04

CM1415

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.

Note 2: Lead-free devices are specified by using a "

" character for the top side orientation mark.

PIN DESCRIPTIONS

PIN

NAME

DESCRIPTION

EAR1_IN

Earpiece Input 1 (from audio circuitry)

EAR2_IN

Earpiece Input 2 (from audio circuitry)

MIC_IN

Microphone Input (from microphone)

GND

Device Ground

GND

Device Ground

EAR1_OUT

Earpiece Output 1 (to earpiece)

EAR2_OUT

Earpiece Output 2 (to earpiece)

MIC_OUT

Microphone Output (to audio circuitry)

Orientation

Marking

(se note 2)

MIC_OUT EAR2_OUT EAR1_OUT

GND

MIC_IN

EAR2_IN

EAR1_IN

Orientation
Marking

PACKAGE / PINOUT DIAGRAMS

Note:

TOP VIEW

CM1415

CSP Package

BOTTOM VIEW

(Bumps Down View)

(Bumps Up View)

1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.

PART NUMBERING INFORMATION

Bumps

Package

Standard Finish

Lead-free Finish

Ordering Part

Number

Part Marking

Ordering Part

Number

Part Marking

CSP

CM1415-03CS

CM1415-03CP

05/13/04

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846

www.calmicro.com

CM1415

Specifications

Note 1: T

=25

C unless otherwise specified.

Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,

then clamping voltage is measured at Pin C1.

Note 4: Unused pins are left open
Note 5: The parameters are guaranteed by design.
Note 6: Z

SOURCE

=50

, Z

LOAD

=50

ABSOLUTE MAXIMUM RATINGS

PARAMETER

RATING

UNITS

Storage Temperature Range

-65 to +150

°C

DC Power per Resistor

100

DC Package Power Rating

300

STANDARD OPERATING CONDITIONS

PARAMETER

RATING

UNITS

Operating Temperature Range

-40 to +85

°C

ELECTRICAL OPERATING CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Resistance

Capacitance

100

120

Capacitance

LEAK

Diode Leakage Current

=5.0V

1.0

µA

SIG

Signal Voltage

Positive Clamp
Negative Clamp

LOAD

= 10mA

-5

-10

-15

V
V

ESD

In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883,

Method 3015

b) Contact Discharge per IEC 61000-4-2

Level 4

Notes 2,4 and 5

±15

±8

Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV

Positive Transients
Negative Transients

Notes 2,3,4 and 5

+15

-19

V
V

Cut-off frequency 1; Note 6

R = 10

, C = 100pF

MHz

Cut-off frequency 2; Note 6

R = 68

, C = 47pF

MHz

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846 www.calmicro.com

05/13/04

CM1415

Application Information

Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.

Figure 4. Recommended Non-Solder Mask Defined Pad Illustration

Figure 5. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 6. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

Pad Size on PCB

0.275mm Round

Pad Definition

Non-Solder Mask defined pads

Solder Mask Opening

0.325mm Round

Solder Stencil Thickness

0.125 - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

0.330mm Round

Solder Flux Ratio

50/50 by volume

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance -- Edge To Corner Ball

+50

µm

Solder Ball Side Coplanarity

+20

µm

Maximum Dwell Time Above Liquidous

60 seconds

Soldering Maximum Temperature

260°C

Solder Mask Opening

0.325mm DIA.

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Stencil Opening

0.330mm DIA.

200

250

150

100

1:00.0

2:00.0

3:00.0

4:00.0

Time (minutes)

emperature (°

05/13/04

430 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846

www.calmicro.com

CM1415

Mechanical Details

CSP Mechanical Specifications

CM1415 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.

Package Dimensions for CM1415

Chip Scale Package

CSP Tape and Reel Specifications

Figure 7. Tape and Reel Mechanical Data

PACKAGE DIMENSIONS

Package

Custom CSP

Bumps

Dim

Millimeters

Inches

Min

Nom

Max

Min

Nom

Max

1.405

1.450

1.495

0.0553

0.0571

0.0589

1.365

1.410

1.455

0.0537

0.0555

0.0573

0.495

0.500

0.505

0.0195

0.0197

0.0199

0.245

0.250

0.255

0.0096

0.0098

0.0100

0.430

0.435

0.440

0.0169

0.0171

0.0173

0.430

0.435

0.440

0.0169

0.0171

0.0173

0.175

0.225

0.275

0.0069

0.0089

0.0108

0.220

0.270

0.320

0.0087

0.0106

0.0126

0.600

0.670

0.739

0.0236

0.0264

0.0291

0.394

0.445

0.495

0.0155

0.0175

0.0195

# per tape and

reel

3500 pieces

Controlling dimension: millimeters

Mechanical Package Diagrams

DIMENSIONS IN MILLIMETERS

D1
D2

BOTTOM VIEW

SIDE

VIEW

0.30 DIA.
63/37 Sn/Pb (Eutectic) or

SOLDER BUMPS

95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)

OptiGuard

Coating

PART NUMBER

CHIP SIZE (mm)

POCKET SIZE (mm)

X A

X K

TAPE WIDTH

REEL

DIAMETER

QTY PER

REEL

CM1415

1.45 X 1.41 X 0.6

1.55 X 1.52 X 0.71

8mm

178mm (7")

3500

4mm

Top

For tape feeder reference

Cover

Tape

only including draft.

Concentric around B.

Embossment

User direction of feed

0.2 mm

Center lines
of cavity

10 Pitches cumulative

tolerance on tape

Part Number CM1415

Document Outline