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09/15/05

490 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846

www.calmicro.com

CM1411

2 Channel Headset/Speaker EMI Filter with ESD Protection

Features

Functionally and pin compatible with CMD's
CSPEMI201A

OptiGuard

coated for improved reliability at

assembly

Two channels of EMI filtering

Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network

Greater than 40dB attenuation at 1GHz

8kV ESD protection on each channel

(IEC 61000-4-2 Level 4, contact discharge)

15kV ESD protection in each channel (HBM)

Supports AC signals--ideal for audio applications

Extremely low lead inductance for optimum filter
and ESD performance

5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)

Lead-free version available

Applications

EMI filtering and ESD protection for
headset/speaker ports

Wireless Handsets

Handheld PCs / PDAs

MP3 Players

Digital Camcorders

Notebooks

Desktop PCs

Product Description

The CM1411 is a dual low-pass filter array integrating
two pi-style filters (C-R-C) that reduce EMI/RFI emis-
sions while at the same time providing ESD protection.
This part is custom-designed to interface with a
speaker port on a cellular telephone or similar device.
Each high quality filter provides more than 35dB atten-
uation in the 800-2700 MHz range. These pi-style fil-
ters support bidirectional filtering, controlling EMI both
to and from a speaker element. They also support AC
signals with a cutoff frequency of 31MHz, enabling
audio signals to pass through without distortion.

In addition, the CM1411 provides a very high level of
protection for sensitive electronic components that may
be subjected to electrostatic discharge (ESD). The
CM1411 can safely dissipate ESD strikes of 8kV, the
maximum requirement of the IEC 61000-4-2 interna-
tional standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than 15kV.

The CM1411 is particularly well-suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight. The CM1411 incorporates OptiGuard

coating which results in improved reliability at assem-
bly and is available in a space-saving, low-profile Chip
Scale Package with optional lead-free finishing.

Electrical Schematic

100pF

SPKR_OUT1

SPKR_OUT2

GND

SPKR_IN2

SPKR_IN1

100pF

490 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846

www.calmicro.com

09/15/05

CM1411

Ordering Information

Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "

" character for the top side orientation mark.

PIN DESCRIPTIONS

PIN

NAME

DESCRIPTION

SPKR_IN1

Speaker Input 1 (from audio circuitry)

SPKR_IN2

Speaker Input 2 (from audio circuitry)

GND

Device Ground

SPKR_OUT1

Speaker Output 1 (to speaker)

SPKR_OUT2

Speaker Output 2 (to speaker)

2 3

Orientation

Marking

(see note 2)

SPKR_IN1

SPKR_IN2

SPKR_OUT1 SPKR_OUT2

GND

Pin "A1"

Marking

PACKAGE / PINOUT DIAGRAMS

Notes:

CM1411

CSP Package

TOP VIEW

BOTTOM VIEW

(Bumps Down View)

(Bumps Up View)

Lead-free devices are specified by using a "+" character for the top side orientation mark.

These drawings are not to scale.

PART NUMBERING INFORMATION

Pins

Package

Standard Finish

Lead-free Finish

Ordering Part

Number

Part Marking

Ordering Part

Number

Part Marking

CSP

CM1411-03CS

CM1411-03CP

09/15/05

490 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846

www.calmicro.com

CM1411

Specifications

Note 1: T

=25

C unless otherwise specified.

Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,

then clamping voltage is measured at Pin C1.

Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.

ABSOLUTE MAXIMUM RATINGS

PARAMETER

RATING

UNITS

Storage Temperature Range

-65 to +150

°C

DC Power per Resistor

100

DC Package Power Rating

200

STANDARD OPERATING CONDITIONS

PARAMETER

RATING

UNITS

Operating Temperature Range

-40 to +85

°C

ELECTRICAL OPERATING CHARACTERISTICS

(SEE NOTE 1)

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

Resistance

Capacitance

100

120

LEAK

Diode Leakage Current

=5.0V

1.0

SIG

Signal Voltage

Positive Clamp
Negative Clamp

LOAD

= 10mA

-5

-10

-15

V
V

ESD

In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883,

Method 3015

b) Contact Discharge per IEC 61000-4-2

Level 4

Notes 2,4 and 5

±15

±8

Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV

Positive Transients
Negative Transients

Notes 2,3,4 and 5

+15

-19

V
V

Cut-off frequency
Z

SOURCE

= 50

, Z

LOAD

= 50

R = 10

, C = 100pF

MHz

09/15/05

490 N. McCarthy Blvd., Milpitas, CA 95035-5112

Tel: 408.263.3214

Fax: 408.263.7846

www.calmicro.com

CM1411

Application Information

Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.

Figure 3. Recommended Non-Solder Mask Defined Pad Illustration

Figure 4. Eutectic (SnPb) Solder

Ball Reflow Profile

Figure 5. Lead-free (SnAgCu) Solder

Ball Reflow Profile

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

Pad Size on PCB

0.275mm

Pad Shape

Round

Pad Definition

Non-Solder Mask defined pads

Solder Mask Opening

0.325mm Round

Solder Stencil Thickness

0.125 - 0.150mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

0.330mm Round

Solder Flux Ratio

50/50 by volume

Solder Paste Type

No Clean

Pad Protective Finish

OSP (Entek Cu Plus 106A)

Tolerance -- Edge To Corner Ball

+50

Solder Ball Side Coplanarity

+20

Maximum Dwell Time Above Liquidous

60 seconds

Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste

240°C

Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste

260°C

Solder Mask Opening

0.325mm DIA.

Non-Solder Mask Defined Pad

0.275mm DIA.

Solder Stencil Opening

0.330mm DIA.

200

250

150

100

1:00.0

2:00.0

3:00.0

4:00.0

Time (minutes)

emperature

(°

Part Number CM1411

Document Outline