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Part Number TSPC603R

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Features
·
Superscalar (3 Instructions per Clock Peak)
·
Dual 16 KB Caches
·
Selectable Bus Clock
·
32-bit Compatibility PowerPC Implementation
·
On-chip Debug Support
·
Nap, Doze and Sleep Power Saving Modes
·
Device Offered in Cerquad, CBGA 255, HiTCE CBGA 255 and CI-CGA 255
Features Specific to CBGA 255, HiTCE CBGA 255 and CI-CGA 255
·
7.4 SPECint95, 6.1 SPECfp95 at 300 MHz (Estimated)
·
P
D
Typically = 3.5W (266 MHz), Full Operating Conditions
·
Branch Folding
·
64-bit Data Bus (32-bit Data Bus Option)
·
4-Gbytes Direct Addressing Range
·
Pipelined Single/Double Precision Float Unit
·
IEEE 754 Compatible FPU
·
IEEE P 1149-1 Test Mode (JTAG/C0P)
·
f
INT
Max = 300 MHz
·
f
BUS
Max = 75 MHz
·
Compatible CMOS Input/TTL Output
Features Specific to Cerquad
·
5.6 SPECint95, 4 SPECfp95 and 200 MHz (Estimated)
·
P
D
Typically = 2.5W (200 MHz), Full Operating Conditions
1.
Description
The PID7t-603e implementation of the PowerPC 603e (renamed after the 603R) is a
low-power implementation of the Reduced Instruction Set Computer (RISC) micropro-
cessor PowerPC family. The 603R is pin-to-pin compatible with the PowerPC 603e
and 603P in a Cerquad package. The 603R implements 32-bit effective addresses,
integer data types of 8, 16 and 32 bits, and floating-point data types of 32 and 64 bits.
The 603R is a low-power 2.5/3.3V design and provides four software controllable
power-saving modes. This device is a superscalar processor capable of issuing and
retiring as many as three instructions per clock. Instructions can be executed in any
order for increased performance, but, the 603R makes completion appear sequential.
It integrates five execution units and is able to execute five instructions in parallel.
The 603R provides independent on-chip, 16-Kbyte, four-way set-associative, physi-
cally addressed caches for instructions and data, as well as on-chip instructions, and
data Memory Management Units (MMUs). The MMUs contain 64-entry, two-way
set-associative, data and instruction translation look aside buffers that provide support
for demand-paged virtual memory address translation and variable-sized block trans-
lation. The 603R has a selectable 32- or 64-bit data bus and a 32-bit address bus. The
interface protocol allows multiple masters to compete for system resources through a
central external arbiter. The device supports single-beat and burst data transfers for
memory accesses, and supports memory-mapped I/Os.
PowerPC
®
603e
RISC
Microprocessor
Family
PID7t-603e
TSPC603R
Rev. 5410B­HIREL­09/05
2
5410B­HIREL­09/05
TSPC603R
The 603R uses an advanced, 2.5/3.3V CMOS process technology and maintains full interface
compatibility with TTL devices. It also integrates in-system testability and debugging features
through JTAG boundary-scan capabilities.
2.
Screening/Quality/Packaging
This product is manufactured in full compliance with:
· HiTCE CBGA according to Atmel Standards
· CI-CGA 255 and Cerquad: MIL-PRF-38535 class Q or according to Atmel standards
· CBGA 255: Upscreenings based upon Atmel standards
· CBGA, CI-CGA, HiTCE packages:
­ Full military temperature range (T
C
= -55°C, T
j
= +125°C)
­ Industrial temperature range (T
C
= -40°C, T
j
= +110°C)
· Cerquad:
­ Full military temperature range (T
C
= -55°C, T
c
= +125°C)
­ Industrial temperature range (T
C
= -40°C, T
c
= +110°C)
­ Commercial temperature ranges (
T
C
= 0
°C,
T
C
= +70
°C)
· Internal I/O Power Supply = 2.5 ±5% // 3.3V ±5%
G suffix
CBGA 255
Ceramic Ball Grid Array
GS suffix
CI-CGA 255
Ceramic Ball Grid Array
with Solder Column Interposer (SCI)
CERQUAD 240
GH suffix
HiTCE 255
Ceramic Ball Grid Array
A suffix
CERQUAD 240
Ceramic Leaded Chip Carrier
Cavity up
3
5410B­HIREL­09/05
TSPC603R
3.
Block Diagram
Figure 3-1.
Block Diagram
4.
Overview
The 603R is a low-power implementation of the PowerPC microprocessor family of Reduced
Instruction Set Computing (RISC) microprocessors. The 603R implements the 32-bit portion of
the PowerPC architecture, which provides 32-bit effective addresses, integer data types of 8, 16
and 32 bits, and floating-point data types of 32 and 64 bits. For 64-bit PowerPC microproces-
sors, the PowerPC architecture provides 64-bit integer data types, 64-bit addressing, and other
features required to complete the 64-bit architecture.
The 603R provides four software controllable power-saving modes. Three of the modes (nap,
doze, and sleep) are static in nature, and progressively reduce the amount of power dissipated
by the processor. The fourth is a dynamic power management mode that causes the functional
units in the 603R to automatically enter a low-power mode when the functional units are idle
without affecting operational performance, software execution, or any external hardware.
The 603R is a superscalar processor capable of issuing and retiring as many as three instruc-
tions per clock. Instructions can be executed in any order for increased performance, but, the
603R makes completion appear sequential.
The 603e integrates five execution units:
· an Integer Unit (IU)
· a Floating-point Unit (FPU)
· a Branch Processing Unit (BPU)
Completion
Unit
Fetch
Unit
Dispatch
Unit
Branch
Unit
Integer
Unit
Gen
Reg
Unit
Gen
Re-
name
Load/
Store
Unit
FP
Re-
name
FP
Reg
File
Float
Unit
D MMU
16K Data Cache
I MMU
16K Inst. Cache
Bus Interface Unit
System Bus
32b Address
64b Data
4
5410B­HIREL­09/05
TSPC603R
· a Load/Store Unit (LSU)
· a System Register Unit (SRU)
The ability to execute five instructions in parallel and the use of simple instructions with rapid
execution times yield high efficiency and throughput for 603R-based systems. Most integer
instructions execute in one clock cycle. The FPU is pipelined so a single-precision multiply-add
instruction can be issued every clock cycle.
The 603R provides independent on-chip, 16 Kbyte, four-way set-associative, physically
addressed caches for instructions and data, as well as on-chip instruction and data Memory
Management Units (MMUs). The MMUs contain 64-entry, two-way set-associative, Data and
Instruction Translation Lookaside Buffers (DTLB and ITLB) that provide support for
demand-paged virtual memory address translation and variable-sized block translation. The
TLBs and caches use a Least Recently Used (LRU) replacement algorithm. The 603R also sup-
ports block address translation through the use of two independent Instruction and Data Block
Address Translation (IBAT and DBAT) arrays of four entries each. Effective addresses are com-
pared simultaneously with all four entries in the BAT array during block translation. In
accordance with the PowerPC architecture, if an effective address hits in both the TLB and BAT
array, the BAT translation has priority.
The 603R has a selectable 32- or 64-bit data bus and a 32-bit address bus. The 603R interface
protocol allows multiple masters to compete for system resources through a central external
arbiter. The 603R provides a three-state coherency protocol that supports the exclusive, modi-
fi ed , a n d i n v a l i d c a c h e s t at es . T h i s pr o to c o l i s a c om p a ti b l e s u b s e t o f th e ME S I
(Modified/Exclusive/Shared/Invalid) four-state protocol and operates coherently in systems that
contain four-state caches. The 603R supports single-beat and burst data transfers for memory
accesses, and supports memory-mapped I/Os.
The 603R uses an advanced, 0.29 µm 5-metal-layer CMOS process technology and maintains
full interface compatibility with TTL devices.
5.
Signal Description
Figure 5-1 on page 5
,
Table 10-5
and
Table 10-6 on page 20
describe the signals on the
TSPC603R and indicate signal functions. The test signals, TRST, TMS, TCK, TDI and TDO,
comply with the subset P-1149.1 of the IEEE testability bus standard.
The three signals LSSD_MODE, LI_TSTCLK and L2_TSTCLK are test signals for factory use
only and must be pulled up to V
DD
for normal machine operations.
5
5410B­HIREL­09/05
TSPC603R
Figure 5-1.
Functional Signal Groups
6.
Detailed Specifications
This specification describes the specific requirements for the microprocessor TSPC603R, in
compliance with MIL-STD-883 class B or Atmel standard screening.
7.
Applicable Documents
1.
MIL-STD-883: Test methods and procedures for electronics
2.
MIL-PRF-38535: General specifications for microcircuits
The microcircuits are in accordance with the applicable documents and as specified herein.
BR
BG
ABB
TS
TT[0-4]
AP[0-3]
APE
TBST
TSIZ[0-2]
GBL
CI
WT
CSE[0-1]
TC[0-1]
AACK
ARTRY
SYSCLK
CLK_OUT
PLL_CFG[0-3]
DBG
DBWO
DBB
DPE
DP[0-7]
DH[0-31], DL[0-31]
A[0-31]
DBDIS
TA
DR TR Y
TEA
INT, SMI
MCP
HRESET, SRESET
CKSTP_IN, CKSTP_OUT
RSRV
QREQ, QACK
TBEN
TLBISYNC
TRST, TCK, TMS, TDI, TD0
5
LSSD_MODE
L1_TSTCLK, L2_TSTCLK
3
1
1
1
VDD
OVDD
GND
AVDD
ADDRESS
ARBITRATION
ADDRESS
START
ADDRESS
BUS
TRANSFER
ATTRIBUTE
ADDRESS
TERMINATION
CLOCKS
PROCESSOR
STATUS
LSSD TEST
CONTROL
POWER SUPPLY
64
8
1
1
1
1
1
2
1
2
2
1
2
1
1
20
19
40
1
1
1
1
1
1
1
32
4
1
5
3
1
1
1
2
4
1
2
1
1
603r
VOLTDETGND
1
POWER SUPPLY
INDICATOR
DATA
ATTRIBUTION
DATA
TRANSFER
DATA
TERMINATION
INTERRUPTS
CHECKSTOPS
RESET
JTAG/COP
INTERFACE