MH1RT QualPack
2
Rev. 2 Jan 2002
1. Table of Contents
1.
Table of Contents ................................................................................................................................................ 2
2.
General Information ........................................................................................................................................... 3
3.
Technology Information .................................................................................................................................... 4
3.1
Wafer Process Technology ........................................................................................................................ 4
3.2
Product Design ........................................................................................................................................... 5
3.3
Cross Section............................................................................................................................................... 6
4.
Qualification........................................................................................................................................................ 7
4.1
Qualification methodology ........................................................................................................................ 7
4.2
Qualification test methods......................................................................................................................... 8
4.3
Wafer Process Qualification...................................................................................................................... 9
4.3.1
Wafer Level Reliability....................................................................................................................... 9
4.3.2
Hot carrier qualification ....................................................................................................................... 9
4.3.3
Electromigration................................................................................................................................. 10
4.3.4
Product Reliability Results................................................................................................................. 12
4.4
Product Qualification............................................................................................................................... 13
4.4.1
Device reliability................................................................................................................................ 13
4.4.2
Packaging Reliability ......................................................................................................................... 14
4.5
Qualification status: ................................................................................................................................. 14
4.6
Irradiation................................................................................................................................................. 15
4.6.1
Conditions and Chronology ............................................................................................................... 15
4.6.2
Results................................................................................................................................................ 16
4.6.3
Irradiation summary ........................................................................................................................... 16
4.6.4
Irradiation test records........................................................................................................................ 17
5.
Environmental Information.............................................................................................................................. 20
6.
Other Data ......................................................................................................................................................... 21
6.1
ISO9001 and QS900 Certificates ............................................................................................................ 21
6.2
Data Book Reference................................................................................................................................ 22
MH1RT QualPack
Rev.2 Jan. 2002
3
2. General Information
Product Name:
MH1RT
Function:
ASIC Sea of Gates
1.6 million gates, 596 pins
200 KRAD Total Dose capability
Wafer Process:
CMOS 0.35
µ
m Rad Tolerant, 4 metal levels
Available Package Types
PQFP, PowerQuad, L/TQFP,PLCC, PBGA, Super PBGA
CPGA,CQFP, MQFPF, CLGA
Other Forms: Die, Wafer
Locations:
Process Development
Atmel Rousset, France
Atmel Nantes, France
Product Development
Atmel Nantes, France
Wafer Plant
Atmel Rousset, France
QC Responsibility
Atmel Nantes, France
Probe Test
Atmel Nantes, France
Assembly
Atmel Grenoble, France (except plastic)
Final Test
Atmel Nantes, France
Lot Release
Atmel Nantes, France
Shipment Control
Atmel Nantes, France
Quality Assurance
Atmel Nantes, France
Reliability Testing
Atmel Nantes, France
Failure Analysis
Atmel Nantes, France
Quality Management
Atmel Nantes, France
Signed: Pascal LECUYER