Features
·
Operates from Single Supply: 3.3V or 5V
·
Small Footprint 64-Pin TQFP Package or Flip Chip
·
Precision Low-voltage Monitor Circuitry for the Power Supply
·
Master Power on Reset
·
Serial Port Interface with Read-back Capability
·
Over-temperature Protection/Warning
·
Shock Sensor Signal Processing
·
On-chip 1.8V, 2.5V and -3V Regulators
·
Low Power Consumption, 9 mA in Normal Run Mode
·
Spindle Driver
Commutator is Driven by a FLL for High Immunity to Jitter
Programmable 10-bit DAC
Adjustable Slew Rate Control
External Startup Capability
1.0A Current Capability with R
on
= 1
Digital Commutation Delay and Blanking
Programmable Delay from BEMF Zero Crossing
External INDEX Signal for Spin Lock
Active Spindle Braking Capability
·
VCM Driver
0.4A Current Capability with R
on
= 1.5
Programmable 14-bit DAC
Ramp Load/Unload Capability with 10-bit ADC
Power-off Retract with 9V Charge-pump
Programmable VCM Current Controlled by Sense Resistor
·
Available in a Variety of Packages Depending on Customer Requirements
Description
The AT78C7005 is a CMOS monolithic device that integrates Spindle and VCM con-
trollers as well as power stages into one chip. The device operates from 3.3V or 5V
power supply. The AT78C7005 is designed for a small-form-factor hard disk drive
application.
A precision low-voltage detection circuit monitors the power supply and initiates VCM
retract at voltage fault condition. A 3-line serial port interface with read back capability
provides interface to the microprocessor.
The Spindle driver features a transconductance amplifier, a current sense amplifier,
power output drivers, sequencer, internal delay/masking logic, Spindle brake circuit,
FLL, and charge-pump for locking the spindle to the programmed rotational speed.
The VCM driver features a transconductance amplifier, differential input current sense
amplifier, ramp load/unload capability, and power output amplifier.
Spindle/
VCM Motor
Controller/
Drivers
AT78C7005
Summary
Note: This is a summary document. A complete document
is available under NDA. For more information, please con-
tact your local Atmel sales office.
3432BSNETST5/04
3
AT78C7005
3432BSNETST5/04
Packaging Information
64A1 TQFP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
64A1, 64-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness,
0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP)
A
64A1
4/22/2004
PIN 1 IDENTIFIER
0°~7°
PIN 1
L
C
A1
A2
A
D1
D
e
E1
E
B
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:
1. This package conforms to JEDEC reference MS-026, Variation ACD.
2. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum
plastic body size dimensions including mold mismatch.
3. Lead coplanarity is 0.10 mm maximum.
A
1.20
A1
0.05
0.15
A2
0.95
1.00
1.05
D
11.75
12.00
12.25
D1
9.90
10.00
10.10
Note 2
E
11.75
12.00
12.25
E1
9.90
10.00
10.10
Note 2
B 0.30
0.45
C
0.09
0.20
L
0.45
0.75
e
0.50 TYP
Printed on recycled paper.
Disclaimer: Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard
warranty which is detailed in Atmel's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any
errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and
does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel's products are not authorized for use
as critical components in life support devices or systems.
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3432BSNETST5/04
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®
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