Aluminum Nitride Terminations
16 Watts, 50
Model RFP-250250N6Z50-2
Outline Drawing
.065
.120
.070
.030
.060
.250
.250
.037
.175
BOTTOM VIEW
SIDE VIEW
TOP VIEW
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE COATING
RFP
RF PAD
N6Z
50
Aluminum Nitride SMD T
e
rminations
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Features
· DC 3.0 GHz
· 16 Watts
· Aluminum Nitride (AlN) Ceramic
· Surface Mountable
· Non-Nichrome Resistive
Element
· Low VSWR
· 100% Tested
Available on Tape and Reel for Pick and Place Manufacturing.
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +125°C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, ±2%
Frequency Range:
DC - 3.0 GHz
Power:
16 Watts
V.S.W.R.:
1.25:1
General Specifications
Resistive Element:
Thick film
Substrate:
Aluminum nitride ceramic
Terminals:
Tin/Lead, 90/10 over nickel
VER. 12/5/01
Aluminum Nitride SMD T
e
rminations
Model RFP-250250N6Z50-2
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
Available on Tape and Reel for Pick and Place Manufacturing.
P.C.B. SOLDER INTERFACE TEMPERATURE --
°C
% OF RATED POWER
125
100
75
50
25
100
75
25
50
0
FILLED VIA
SOLDER
HEATSINK
PC BOARD
PASTE
SOLDER
SCREW
(2 PLS.)
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700°F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
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