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Part Number RFP-150N50TE

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Aluminum Nitride Terminations
150 Watts, 50
Model RFP-150N50TE
Outline Drawing
.161 DIA. THRU
(2 PLACES)
.15
.18
.37
.31
.43
.56
.71
.87
.06
.160
.120
TE
150N50
RFP
Aluminum Nitride Flanged T
e
rminations
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Features
· DC ­ 2.5 GHz
· 150 Watts
· Aluminum Nitride (AlN) Ceramic
· Welded Silver Leads
· Non-Nichrome Resistive
Element
· Low VSWR
· 100% Tested
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches. Lead
length 0.15" minimum.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, ±5%
Frequency Range:
DC - 2.5 GHz
Power:
150 Watts
V.S.W.R.:
1.25:1
General Specifications
Resistive Element:
Thick film
Substrate:
Aluminum nitride ceramic
Cover:
Alumina ceramic
Mounting Flange:
Copper, nickel plated per
QQ-N-290
Lead(s):
99.99% pure silver (.005" thk)
VER. 12/5/01
Aluminum Nitride Flanged T
e
rminations
Model RFP-150N50TE
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Drill & tap the heatsink for the appropriate thread size to be
used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001" max. thickness).
4. Position device on mounting surface & secure using socket
head screws, flat & split washers. Torque screws to the
appropriate value. Make sure that the device is flat against
the heatsink. (Care should be taken to avoid upward
pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (700°F).
SCALE:
BOARD EVEN
WITH LEAD.
THAN LEAD.
BOARD LOWER
SUGGESTED STRESS RELIEF METHODS
(2 PLACES)
.025
MIN.
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD.
THAN LEAD.
BOARD HIGHER
SCALE: