4-7
Optical Reflective Sensors
Technical Data
HBCC-1570
HBCC-1580
HBCC-1590
Features
· Focused Emitter and
Detector in a Single
Package
· TO-5 Miniature Sealed
Package
· Photodiode Output
· Choice of Resolutions
(0.13 mm, 0.178 mm, 0.33 mm)
· Two Wavelengths
Available; 655 nm, 820 nm
(see selection guide)
Sensor Part Number
HBCC-1570
HBCC-1580
HBCC-1590
LED Resolution
0.33 mm (0.013 in.)
0.185 mm (0.007 in.)
0.13 mm (0.005 in.)
LED Wavelength
655 nm
655 nm
820 nm
REFERENCE PLANE
MAXIMUM SIGNAL POINT MSP
CL
9.40
8.51
(0.370)
(0.335)
0.86
0.73
(0.034)
(0.029)
5.08
(0.200)
1.14
0.73
(0.045)
(0.029)
15.24
12.70
(0.600)
(0.500)
11.50
11.22
(0.453)
(0.442)
8.33
8.12
(0.328)
(0.320)
12.0
(0.473)
S.P.
R.P.
NOTES:
A. ALL DIMENSIONS IN MILLIMETERS AND (INCHES).
B. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.
C. THE REFERENCE PLANE (R.P.) IS THE TOP SURFACE OF THE PACKAGE.
D. NICKEL CAN AND GOLD PLATED LEADS.
±
(0.168) ± (0.010)
4.27
0.25
5.08
(0.200)
Z
E. S.P. = SEATING PLANE.
F. THE LEAD DIAMETER IS 0.45 mm (0.018 in.) TYP.
G. O.D. = OUTSIDE DIAMETER OF CAN MEASURED IN REGION ABOVE
WELD FLANGE TO MIDWAY OF CAN LENGTH.
O.D.
Selection Guide
Package Dimensions
Description
The HBCC-15XX series sensors
are fully integrated modules
designed for applications requir-
ing optical reflective sensing. The
modules contain a 655 nm (or 820
nm) LED emitter and a photo-
diode. A bifurcated aspheric lens
is used to image the active areas
of the emitter and detector to a
single spot 4.27 mm (0.168 in.) in
front of the package. The output
signal is a current generated by
the photodiode.
Applications
The HBCC-15XX sensors are
intended for use with the Hewlett-
Packard HBCC-0500 and HBCC-
0600 low current digitizer ICs, or
h H
5965-5942E
4-8
with suitable PCB assemblies
provided by HP for use with these
sensors. The HBCC-15XX sensors
have been characterized for use
only with Hewlett-Packard's
digitizer IC technology. Use of
these sensors in designs or appli-
cations other than those stated is
at the customer's risk.
Mechanical
Considerations
The HBCC-15XX series are
packaged in a high profile 8 pin
TO-5 metal can with a glass
window. The LED and photodiode
are mounted on a header at the
base of the package. Positioned
above these active elements is a
bifurcated aspheric acrylic lens
that focuses them to the same
point.
The sensor can be rigidly secured
by commercially available TO-5
style heat sinks or 8 pin 0.200 inch
diameter pin circle sockets. These
fixtures provide a stable reference
platform for affixing the HBCC-
15XX sensors to a circuit board.
In applications requiring contact
scanning (such as bar code
reading), protective focusing tips
are available. Focusing tips are
available in either metal or poly-
carbonate packages using a
sapphire ball as the contact
surface. The Hewlett-Packard part
numbers are HBCS-2999, HBCS-
4999, HBCS-A998, and
HBCS-A999.
Electrical Operation
The sensor detector is a pn
photodiode. The LED cathode is
physically and electrically con-
nected to the case-substrate of the
sensor.
HBCC-1570, 1580 Optical System
EMITTER
BAFFLE
EPOXY SEAL
SENSING
AREA
GLASS
LENS
DETECTOR
HBCC-1590 Optical System
EMITTER
0.089 mm DIA. JUNCTION
OPTICAL
APERTURE
BAFFLE
EPOXY SEAL
SENSING
AREA
GLASS
LENS
DETECTOR
0.406 mm SQUARE
SILICON
BAFFLE
The HBCC-15XX sensors are
characterized for use with Hewlett-
Packard's low current digitizer
ICs. The digitizer IC part numbers
are HBCC-0500 and HBCC-0600.
Data Sheets including circuit
diagrams are available.
4-9
Parameter
Symbol
Min.
Max.
Units
Notes
Storage Temperature
T
S
-40
+75
°
C
Operating Temperature
T
A
-20
+75
°
C
Lead Soldering Temperature
260
°
C
1
(1.6 mm from Seating Plane)
(for 10 seconds)
Average LED Forward Current
If
2
Peak LED Forward Current
Ifp
125
mA
3 (HBCC-1570)
100
mA
3 (HBCC-1580)
40
mA
4 (HBCC-1590)
Reverse LED Input Voltage
Vr
5.0
V
2.5
V
HBCC-1590 Only
Photodiode Bias
Vd
-0.3
6.0
V
5
Absolute Maximum Ratings
T
A
= 25
°
C unless specified otherwise (unless specified separately, data applies to all sensors)
Notes:
1. CAUTION: The thermal constraints of the acrylic lens will not permit conventional wave soldering procedures. The typical
preheat and post-soldering cleaning procedures and dwell times can subject lens to thermal stresses beyond the absolute
maximum ratings and can cause it to defocus.
2. These sensors are specified for use with the drive conditions provided by the HBCC-0500 and HBCC-0600 Digitizer IC ONLY.
3. When used with HBCC-0500 or HBCC-0600 digitizer ICs.
4. At all combinations of pulse width and duty cycle.
5. Voltage differential between Pin 1 and Pin 8 with Pin 8 taken as reference. Exceeding maximum conditions may cause permanent
damage to photodiode or to chip metallization.
REFLECTOR
REFERENCE
PLANE
1
8
Dps
Rs
LED
6
2
CASE, SUBSTRATE
Z
Dps
Rs
LED
8
1
2
3
4
5
6
7
TOP VIEW
Rs = CHARACTERISTIC NOT DEFINED
SCHEMATIC DIAGRAM
CONNECTION DIAGRAM
PIN#
1
2
6
8
FUNCTION
PHOTODIODE CATHODE
HEADER GROUND
LED ANODE
PHOTODIODE ANODE
+
4-10
HBCC-1570 and HBCC-1580: Electrical and Optical Characteristics
T
A
= 25
°
C
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Note
Figure
Reflected
(see Bin Table)
nA
If = 70 mA
6,7
1,2A,
Photocurrent
peak
4A, 4B, 5
Quality Factor
<Q>
0.82
0.95
1.0
If = 70 mA
6,8
peak
Maximum Signal
Z
4.11
4.27
4.42
mm
If = 70 mA
6,9
1, 4A, 4B
Point (MSP)
(0.162)
(0.168)
(0.174)
(in.)
peak
LED Forward
Vf
1.5
1.75
2.0
V
If = 70 mA
3
Voltage
LED Reverse
BVR
5.0
V
Ir = 100
µ
A
Breakdown Voltage
Photodiode
Id
60
1000
pA
Vd = 5 V
Dark Current
Photodiode
Cd
100
pF
Vd = 0 V
Capacitance
60
pF
Vd = 1 V
LED Peak
650
670
nm
If = 35 mA DC
6A
Wavelength
Ipr Temperature
Ke
-0.006
1/
°
C
If = 35 mA DC
10
Coefficient
System Optical
d
0.268
mm
4.27 mm
11
7A
Step Response
(0.0106)
(in.)
(Target from
(OSR)
sensor)
HBCC-1570
(OSR)
d
0.154
mm
4.27 mm
11
7B
HBCC-1580
(0.0061)
(in.)
(Target from
sensor)
Notes:
6. Measured from a reflector coated with 99% diffuse reflective white paint (Kodak 6080) positioned 4.27 mm (0.168 in.) from the
reference plane. Measured physically is the total photocurrent, Ipt, which consists of a signal (reflected from target) component,
Ipr, and a component induced by reflections internal to the sensor (stray), Ips. Ipt = Ipr + Ips. Specified is the reflected signal
component, Ipr.
7. See Bin Table
8. <Q> = Ipr/Ipt
9. Measured from reference plane (R.P.) of sensor.
10. Photocurrent variation with temperature varies with LED output which follows a natural exponential law:
Ip(T) = Ip(To)*exp[Ke(T-To)]
11. OSR is defined as the distance for a 10%-90% "step" response of Ipr as the sensor moves over an abrupt black-white edge, or from
opaque white to free space (no reflection).
Ipr
4-11
HBCC-1590: Electrical and Optical Characteristics
T
A
= 25
°
C
REFLECTOR
REFERENCE
PLANE
1
8
Dps
Rs
LED
6
CASE, SUBSTRATE
Z
2
+Vf
I
nA-METER
I f
pt
Figure 1. Photocurrent Test Circuit.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Note
Figure
Reflected
(see Bin Table)
nA
If = 30 mA
6,7
1,2B,
Photocurrent
peak
4C, 5
Quality Factor
<Q>
0.82
0.95
1.0
If = 30 mA
6,8
peak
Maximum Signal
Z
4.01
4.27
4.62
mm
If = 30 mA
6,9
1, 4C
Point (MSP)
(0.158)
(0.168)
(0.182)
(in.)
peak
LED Forward
Vf
1.3
1.45
1.8
V
If = 30 mA
3
Voltage
LED Reverse
BVR
2.5
V
Ir = 100
µ
A
Breakdown Voltage
Photodiode
Id
60
1000
pA
Vd = 5 V
Dark Current
Photodiode
Cd
100
pF
Vd = 0 V
Capacitance
60
pF
Vd = 1 V
LED Peak
805
820
835
nm
If = 35 mA DC
6B
Wavelength
Ipr Temperature
Ke
-0.005
1/
°
C
If = 35 mA DC
10
Coefficient
System Optical
d
0.140
mm
4.27 mm
11
7C
Step Response
(0.0055)
(in.)
(Target from
(OSR)
sensor)
Ipr
4-12
Bin Table
Ipr Limits (nA)
Bin#
Min.
Max.
1
160
225
2
215
270
3
255
313
4
300
375
5
360
440
6
430
555
Product Marking
The photocurrent binning of the
sensor is incorporated as part of
the product marking format. The
Bin # is represented as the last
number (N) on the last line of
marking.
HP
HBCC-15XX
XXXXXXXN
N = bin number
Bin Availability
The entire available distribution of
parts, appropriately marked, will
be shipped. Requests for indi-
vidual bin selections cannot be
honored.
Binning and
Temperature Effects
Test algorithm bins units to the
lower bin number if a unit is in the
bin overlap region. Such units can
cross bin boundaries as tempera-
ture changes. (Ambient tempera-
ture affects LED efficiency slightly
and may cause several percentage
changes in Ipr.) Bin numbers are
for "reference only" and do not
constitute an absolute guarantee.
The output of all LEDs degrades
with time, depending on drive
conditions and temperature. LED
degradation is minimized by the
drive conditions generated by both
the HBCC-0500 and HBCC-0600,
(when used as specified).
Warranty and Service
HP Optical Reflective Sensors are
warranted for a period of one year
after purchase covering defects in
material and workmanship.
Hewlett-Packard will repair or, at
its option, replace products that
prove to be defective in material or
workmanship under proper use
during the warranty period.
NO OTHER WARRANTIES ARE
EXPRESSED OR IMPLIED,
INCLUDING BUT NOT LIMITED
TO THE IMPLIED WARRANTIES
OF MERCHANT ABILITY AND
FITNESS FOR A PARTICULAR
PURPOSE. HEWLETT-PACKARD
IS NOT LIABLE FOR CONSE-
QUENTIAL DAMAGES.
For additional warranty or service
information please contact your
local Hewlett-Packard sales
representative or authorized
distributor.
4-13
Figure 2A. Typical Reflected
Photocurrent.
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
PHOTOCURRENT NORMALIZED AT
I f
70mA, 25°C
0
10
20
30
40
50
60
70
80
90 100
If FORWARD LED CURRENT, mA
HBCC-1580
HBCC-1570
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
PHOTOCURRENT NORMALIZED AT
I f
30mA, 25°C
0
10
20
30
40
If FORWARD LED CURRENT, mA
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
V
f FORWARD VOLTAGE, V
0.001
0.01
1
10
100
If FORWARD CURRENT, mA
0.1
HBCC-1580
HBCC-1590
HBCC-1570
Figure 3. Typical LED Forward Voltage
vs. Forward Current.
100
80
60
40
20
0
PERCENT MSP SIGNAL
3.5
4.0
5.0
5.5
DISTANCE FROM SENSOR, mm
3.0
4.5
MIN MSP
MEAN MSP
MAX MSP
Figure 4A. HBCC-1570 Signal vs.
Distance from Sensor.
100
80
60
40
20
0
PERCENT MSP SIGNAL
3.5
4.0
5.0
5.5
DISTANCE FROM SENSOR, mm
3.0
4.5
MEAN MSP
MAX MSP
MIN MSP
100
80
60
40
20
0
PERCENT MSP SIGNAL
3.5
4.0
5.0
5.5
DISTANCE FROM SENSOR, mm
3.0
4.5
MEAN MSP
MIN MSP
MAX MSP
Figure 4B. HBCC-1580 Signal vs.
Distance from Sensor.
Figure 4C. HBCC-1590 Signal vs.
Distance from Sensor.
1.0
0.8
0.6
0.4
0.2
0
RESPONSE AT GIVEN WAVELENGTH
NORMALIZED TO PEAK
500
600
700
800
900
WAVELENGTH, nm
750
850
550
650
HBCC 1570
HBCC 1580
HBCC 1590
LOW-PASS FILTERING OF
AMBIENT LIGHT CAUSED
BY RED LENS
TYP. PEAK RESPONSIVITY
Po =0.34 AMPS/WATT
1.50
1.25
1.00
0.75
0.25
0
LIGHT OUTPUT, NORMALIZED TO 25°C VALUE
620
640
680
700
WAVELENGTH, nm
600
660
1.75
0.50
-20°C
0°C
25°C
70°C
1.2
1.0
0.8
0.6
0.2
0
LIGHT OUTPUT, NORMALIZED TO 25°C VALUE
780
820
900
WAVELENGTH, nm
740
860
1.4
0.4
-40°C
25°C
85°C
Figure 5. Relative Spectral
Response of Sensors.
Figure 6A. Typical Spectral
Distribution of 655 nm LED.
Figure 6B. Typical Spectral
Distribution of 820 nm LED.
Figure 2B. Typical HBCC-1590
Reflected Photocurrent.
4-14
Figure 7A. HBCC-1570, System Optical Step Response Variation with Distance.
1.0
0.8
0.6
0.4
0.2
0
d -- SYSTEM RESPONSE -- mm
3.0
3.5
4.0
4.5
5.0
5.5
DISTANCE FROM SENSOR -- mm
NON-PREFERRED ORIENTATION
PREFERRED ORIENTATION
100%
90%
10%
0
NORMALIZED SIGNAL
BLACK
d
WHITE
1.0
0.8
0.6
0.4
0.2
0
d -- SYSTEM RESPONSE -- mm
3.0
3.5
4.0
4.5
5.0
5.5
DISTANCE FROM SENSOR -- mm
NON-PREFERRED ORIENTATION
PREFERRED ORIENTATION
100%
90%
10%
0
NORMALIZED SIGNAL
BLACK
d
WHITE
Figure 7B. HBCC-1580, System Optical Step Response Variation with Distance.
1.0
0.8
0.6
0.4
0.2
0
d -- SYSTEM RESPONSE -- mm
3.0
3.5
4.0
4.5
5.0
5.5
DISTANCE FROM SENSOR -- mm
NON-PREFERRED ORIENTATION
PREFERRED ORIENTATION
100%
90%
10%
0
NORMALIZED SIGNAL
BLACK
d
WHITE
Figure 7C. HBCC-1590, System Optical Step Response Variation with Distance.
Preferred Orientation
At maximum signal point (MSP)
when the sensor is in focus, the
orientation of the sensor is unim-
portant. However, as one moves
away from MSP (either by distance
or angle), the preferred orientation
indicated above is recommended to
maintain a higher resolution spot
size.
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