050-5982
Rev
-
10-01
MAXIMUM RATINGS
All Ratings: T
C
= 25°C unless otherwise specified.
STATIC ELECTRICAL CHARACTERISTICS
Symbol
BV
DSS
V
DS
(ON)
I
DSS
I
GSS
g
fs
V
isolation
V
GS
(TH)
Characteristic / Test Conditions
Drain-Source Breakdown Voltage (V
GS
= 0V, I
D
= 250 µA)
On State Drain Voltage
1
(I
D
(ON)
= 15A, V
GS
= 10V)
Zero Gate Voltage Drain Current (V
DS
= V
DSS
, V
GS
= 0V)
Zero Gate Voltage Drain Current (V
DS
= 0.8 V
DSS
, V
GS
= 0V, T
C
= 125°C)
Gate-Source Leakage Current (V
GS
= ±30V, V
DS
= 0V)
Forward Transconductance (V
DS
= 25V, I
D
= 12.5A)
RMS Voltage
(60Hz Sinewave from terminals to mounting surface for 1 minute)
Gate Threshold Voltage (V
DS
= V
GS
, I
D
= 50mA)
MIN
TYP
MAX
1000
9
100
1000
±400
3
5.3
2500
3
5
UNIT
Volts
µA
nA
mhos
Volts
Symbol
V
DSS
V
DGO
I
D
V
GS
P
D
T
J
,T
STG
T
L
Parameter
Drain-Source Voltage
Drain-Gate Voltage
Continuous Drain Current @ T
C
= 25°C
Gate-Source Voltage
Total Device Dissipation @ T
C
= 25°C
Operating and Storage Junction Temperature Range
Lead Temperature: 0.063" from Case for 10 Sec.
ARF 1500
1000
1000
30
±30
1500
-55 to 200
300
UNIT
Volts
Amps
Volts
Watts
°C
RF POWER MOSFET
N- CHANNEL ENHANCEMENT MODE
250V 1500W 40MHz
The ARF1501 is an RF power transistor designed for very high power scientific, commercial, medical and industrial RF
power generator and amplifier applications up to 40 MHz.
Specified 300 Volt, 27.12 MHz Characteristics:
Output Power = 900 Watts.
Gain = 17dB (Class C)
Efficiency > 75%
High Performance Power RF Package.
Very High Breakdown for Improved Ruggedness.
Low Thermal Resistance.
Nitride Passivated Die for Improved Reliability.
ARF1501
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
USA:
405 S.W. Columbia Street
Bend, Oregon 97702-1035
Phone: (541) 382-8028
FAX: (541) 388-0364
EUROPE:
Chemin de Magret
F-33700 Merignac - France
Phone: (33) 5 5792 15 15
FAX: (33) 5 56 479761
APT Website - http://www.advancedpower.com
THERMAL CHARACTERISTICS
Symbol
R
JC
R
CS
Characteristic (per package unless otherwise noted)
Junction to Case
Case to Sink
(Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.)
MIN
TYP
MAX
0.12
0.09
UNIT
°C/W
D
S
G
D
S
S
G
S
S
D
G
S
S
S
S
ARF1500
BeO
135-05
Volts
050-5982
Rev
-
10-01
DYNAMIC CHARACTERISTICS
ARF1501
Symbol
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Test Conditions
V
GS
= 0V
V
DS
= 150V
f = 1 MHz
V
GS
= 15V
V
DD
= 0.5 V
DSS
I
D
= I
D[Cont.]
@ 25°C
R
G
= 1.6
MIN
TYP
MAX
3600
5900
280
520
108
200
7
15
5
10
23
40
12
25
UNIT
pF
ns
FUNCTIONAL CHARACTERISTICS
Symbol
G
PS
Test Conditions
f = 27.12 MHz
V
GS
= 0V V
DD
= 300V
P
out
= 900W
No Degradation in Output Power
Characteristic
Common Source Amplifier Power Gain
Drain Efficiency
Electrical Ruggedness VSWR 20:1
MIN
TYP
MAX
17
19
70
75
UNIT
dB
%
1
Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%.
APT Reserves the right to change, without notice, the specifications and information contained herein.
D
S
S
G
S
S
D
G
S
S
S
S
ARF1500
BeO
135-05
.005
.045
.160
.500
.500
1.065
.207
.207
.375
.105 typ.
1.065
D
S
G
dims: inches
HAZARDOUS MATERIAL
WARNING
The ceramic portion of the
device between leads and
mounting surface is beryllium
oxide. Beryllium oxide dust is
highly toxic when inhaled. Care
must be taken during handling
and mounting to avoid damage
to this area. These devices
must never be thrown away with
general industrial or domestic
waste.
;;
yy
ARF 1500
Compliant
layer
Clamp
;;;;
yyyy
Heat Sink
Thermal Considerations and Package Mounting:
The rated 1500W power dissipation is only available when the package mounting
surface is at 25°C and the junction temperature is 200°C. The thermal resistance
between junctions and case mounting surface is 0.12 °C/W. When installed, an addi-
tional thermal impedance of 0.09 °C/W between the package base and the mounting
surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint
compound must be used to reduce the effects of small surface irregularities. The heat-
sink should incorporate a copper heat spreader to obtain best results.
The package is designed to be clamped to a heatsink. A clamped joint maintains the
required mounting pressure while allowing for thermal expansion of both the device
and the heat sink. A simple clamp, a compliant layer of plastic or rubber, and two 6-32
(M3.5) screws can provide the minimum 85 lb required mounting force. T = 6 in-lb.
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