AD9514 1.6 GHz Clock Distribution IC, Dividers, Delay Adjust, Three Outputs Data Sheet (Rev. 0)

1.6 GHz Clock Distribution IC,

Dividers, Delay Adjust, Three Outputs

AD9514

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700

www.analog.com

Fax: 781.461.3113

FEATURES

1.6 GHz differential clock input
3 programmable dividers

Divide-by in range from1 to 32
Phase select for coarse delay adjust

2 independent 1.6 GHz LVPECL clock outputs

Additive broadband output jitter 225 fs rms

1 independent 800 MHz/250 MHz LVDS/CMOS clock output

Additive broadband output jitter 300 fs rms/290 fs rms
Time delays up to 10 ns

Device configured with 4-level logic pins
Space-saving, 32-lead LFCSP

APPLICATIONS

Low jitter, low phase noise clock distribution
Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs
High performance wireless transceivers
High performance instrumentation
Broadband infrastructure
ATE

FUNCTIONAL BLOCK DIAGRAM

VREF

S10 S9

SETUP LOGIC

OUT0

CLK

CLKB

SYNCB

RSET

GND

OUT0B

OUT1

OUT1B

OUT2

OUT2B

AD9514

/1. . . /32

LVPECL

LVDS/CMOS

05596-

001

Figure 1.

GENERAL DESCRIPTION

The AD9514 features a multi-output clock distribution IC in a
design that emphasizes low jitter and phase noise to maximize
data converter performance. Other applications with demanding
phase noise and jitter requirements also benefit from this part.

There are three independent clock outputs. Two of the outputs
are LVPECL, and the third output can be set to either LVDS or
CMOS levels. The LVPECL outputs operate to 1.6 GHz, and the
third output operates to 800 MHz in LVDS mode and to
250 MHz in CMOS mode.

Each output has a programmable divider that can be set to
divide by a selected set of integers ranging from 1 to 32. The
phase of one clock output relative to another clock output can
be set by means of a divider phase select function that serves as
a coarse timing adjustment.

The LVDS/CMOS output features a delay element with three
selectable full-scale delay values (1.5 ns, 5 ns, and 10 ns), each
with 16 steps of fine adjustment.

The AD9514 does not require an external controller for
operation or setup. The device is programmed by means of
11 pins (S0 to S10) using 4-level logic. The programming pins
are internally biased to V

. The VREF pin provides a level of

. V

(3.3 V) and GND (0 V) provide the other two logic levels.

The AD9514 is ideally suited for data converter clocking
applications where maximum converter performance is
achieved by encode signals with subpicosecond jitter.

The AD9514 is available in a 32-lead LFCSP and operates from
a single 3.3 V supply. The temperature range is -40°C to +85°C.

AD9514

Rev. 0 | Page 2 of 28

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Clock Input.................................................................................... 3

Clock Outputs ............................................................................... 3

Timing Characteristics ................................................................ 4

Clock Output Phase Noise .......................................................... 5

Clock Output Additive Time Jitter............................................. 8

SYNCB, VREF, and Setup Pins ................................................. 10

Power............................................................................................ 10

Timing Diagrams............................................................................ 11

Absolute Maximum Ratings.......................................................... 12

Thermal Characteristics ............................................................ 12

ESD Caution................................................................................ 12

Pin Configuration and Function Descriptions........................... 13

Terminology .................................................................................... 14

Typical Performance Characteristics ........................................... 15

Functional Description .................................................................. 18

Overall.......................................................................................... 18

CLK, CLKB--Differential Clock Input ................................... 18

Synchronization.......................................................................... 18

Power-On SYNC .................................................................... 18

SYNCB..................................................................................... 18

SET

Resistor ................................................................................ 19

VREF............................................................................................ 19

Setup Configuration................................................................... 19

Divider Phase Offset .................................................................. 22

Delay Block ................................................................................. 22

Outputs ........................................................................................ 23

Power Supply............................................................................... 23

Exposed Metal Paddle ........................................................... 24

Power Management ................................................................... 24

Applications..................................................................................... 25

Using the AD9514 Outputs for ADC Clock Applications.... 25

LVPECL Clock Distribution ..................................................... 25

LVDS Clock Distribution .......................................................... 26

CMOS Clock Distribution ........................................................ 26

Setup Pins (S0 to S10)................................................................ 26

Power and Grounding Considerations and Power Supply
Rejection...................................................................................... 26

Phase Noise and Jitter Measurement Setups........................... 27

Outline Dimensions ....................................................................... 28

Ordering Guide .......................................................................... 28

REVISION HISTORY

7/05--Revision 0: Initial Version

AD9514

Rev. 0 | Page 3 of 28

SPECIFICATIONS

Typical (typ) is given for V

= 3.3 V ± 5%, T

= 25°C, R

SET

= 4.12 k, LVPECL V

= 790 mV, unless otherwise noted. Minimum (min)

and maximum (max) values are given over full V

and T

(-40°C to +85°C) variation.

CLOCK INPUT

Table 1.

Parameter

Min

Typ

Max

Unit

Test Conditions/Comments

CLOCK INPUT (CLK)

Input Frequency

0 1.6

GHz

Input Sensitivity

150

p-p

Input Common-Mode Voltage, V

1.5

1.6

1.7

Self-biased; enables ac coupling

Input Common-Mode Range, V

CMR

1.3

1.8

With 200 mV p-p signal applied; dc-coupled

Input Sensitivity, Single-Ended

150

mV p-p

CLK ac-coupled; CLKB ac-bypassed to RF ground

Input Resistance

4.0

4.8

5.6

Self-biased

Input Capacitance

A slew rate of 1 V/ns is required to meet jitter, phase noise, and propagation delay specifications.

CLOCK OUTPUTS

Table 2.

Parameter

Min

Typ

Max

Unit

Test Conditions/Comments

LVPECL CLOCK OUTPUTS

Termination = 50 to V

- 2 V

(OUT0, OUT1) Differential

Output Frequency

1.6

GHz

Output High Voltage (V

) V

- 1.1

- 0.96

- 0.82

Output Low Voltage (V

) V

- 1.90

- 1.76

- 1.52

Output Differential Voltage (V

)

640

790

960

LVDS CLOCK OUTPUT

Termination = 100 differential

(OUT2) Differential

Output Frequency

800

MHz

Differential Output Voltage (V

)

250

350

450

Delta V

Output Offset Voltage (V

) 1.125

1.23

1.375

Delta V

Short-Circuit Current (I

, I

)

Output shorted to GND

CMOS CLOCK OUTPUT

Single-ended measurements; termination open

(OUT2) Single-Ended

Complementary output on (OUT2B)

Output Frequency

250

MHz

With 5 pF load

Output Voltage High (V

) V

- 0.1

@ 1 mA load

Output Voltage Low (V

)

0.1

@ 1 mA load

AD9514

Rev. 0 | Page 4 of 28

TIMING CHARACTERISTICS

CLK input slew rate = 1 V/ns or greater.

Table 3.

Parameter

Min

Typ

Max

Unit

Test Conditions/Comments

LVPECL

Termination = 50 to V

- 2 V

Output Rise Time, t

100

20% to 80%, measured differentially

Output Fall Time, t

100

80% to 20%, measured differentially

PROPAGATION DELAY, t

PECL

, CLK-TO-LVPECL OUT

Divide = 1

355

480

635

Divide = 2 - 32

395

530

710

Variation with Temperature

0.5

ps/°C

OUTPUT SKEW, LVPECL

OUT0 to OUT1 on Same Part, t

SKP

-50 0

+55 ps

Both LVPECL Outputs Across Multiple Parts, t

SKP_AB

125

Same LVPECL Output Across Multiple Parts, t

SKP_AB

125

LVDS

Termination = 100 differential, 3.5 mA

Output Rise Time, t

200

350

20% to 80%, measured differentially

Output Fall Time, t

210

350

80% to 20%, measured differentially

PROPAGATION DELAY, t

LVDS

, CLK-TO-LVDS OUT

Optional delay off

Divide = 1

1.00

1.25

1.55

Divide = 2 - 32

1.05

1.30

1.60

Variation with Temperature

0.9

ps/°C

OUTPUT SKEW, LVDS

Optional delay off

LVDS Output Across Multiple Parts, t

SKV_AB

230

CMOS

B outputs are inverted; termination = open

Output Rise Time, t

650

865

20% to 80%; C

LOAD

= 3 pF single-ended

Output Fall Time, t

650

990

80% to 20%; C

LOAD

= 3 pF single-ended

PROPAGATION DELAY, t

CMOS

, CLK-TO-CMOS OUT

Optional delay off

Divide = 1

1.10

1.45

1.75

Divide = 2 - 32

1.15

1.50

1.80

Variation with Temperature

ps/°C

OUTPUT SKEW, CMOS

Optional delay off

CMOS Output Across Multiple Parts, t

SKC_AB

300

LVPECL-TO-LVDS OUT

Output Delay, t

SKV_C

560 790 950 ps

LVPECL-TO-CMOS OUT

Output Delay, t

SKV_C

700 970 1150 ps

DELAY ADJUST (OUT2; LVDS and CMOS)

S0 = 1/3

Zero Scale Delay Time

0.34

Zero Scale Variation with Temperature

0.20

ps/°C

Full Scale Time Delay

1.7

Full Scale Variation with Temperature

-0.38

ps/°C

S0 = 2/3

Zero Scale Delay Time

0.45

Zero Scale Variation with Temperature

0.31

ps/°C

Full Scale Time Delay

5.9

Full Scale Variation with Temperature

-1.3

ps/°C

AD9514

Rev. 0 | Page 5 of 28

Parameter

Min

Typ

Max

Unit

Test Conditions/Comments

S0 = 1

Zero Scale Delay Time

0.56

Zero Scale Variation with Temperature

0.47

ps/°C

Full Scale Time Delay

11.4

Full Scale Variation with Temperature

-5

ps/°C

Linearity, DNL

0.2

LSB

Linearity, INL

0.2

LSB

This is the difference between any two similar delay paths within a single device operating at the same voltage and temperature.

This is the difference between any two similar delay paths across multiple devices operating at the same voltage and temperature.

Incremental delay; does not include propagation delay.

CLOCK OUTPUT PHASE NOISE

CLK input slew rate = 1 V/ns or greater.

Table 4.

Parameter Min

Typ

Max

Unit

Test

Conditions/Comments

CLK-TO-LVPECL ADDITIVE PHASE NOISE

CLK = 622.08 MHz, OUT = 622.08 MHz

Divide = 1

@ 10 Hz Offset

-125

dBc/Hz

@ 100 Hz Offset

-132

dBc/Hz

@ 1 kHz Offset

-140

dBc/Hz

@ 10 kHz Offset

-148

dBc/Hz

@ 100 kHz Offset

-153

dBc/Hz

>1 MHz Offset

-154

dBc/Hz

CLK = 622.08 MHz, OUT = 155.52 MHz

Divide = 4

@ 10 Hz Offset

-128

dBc/Hz

@ 100 Hz Offset

-140

dBc/Hz

@ 1 kHz Offset

-148

dBc/Hz

@ 10 kHz Offset

-155

dBc/Hz

@ 100 kHz Offset

-161

dBc/Hz

>1 MHz Offset

-161

dBc/Hz

CLK = 622.08 MHz, OUT = 38.88 MHz

Divide = 16

@ 10 Hz Offset

-135

dBc/Hz

@ 100 Hz Offset

-145

dBc/Hz

@ 1 kHz Offset

-158

dBc/Hz

@ 10 kHz Offset

-165

dBc/Hz

@ 100 kHz Offset

-165

dBc/Hz

>1 MHz Offset

-166

dBc/Hz

CLK = 491.52 MHz, OUT = 61.44 MHz

Divide = 8

@ 10 Hz Offset

-131

dBc/Hz

@ 100 Hz Offset

-142

dBc/Hz

@ 1 kHz Offset

-153

dBc/Hz

@ 10 kHz Offset

-160

dBc/Hz

@ 100 kHz Offset

-165

dBc/Hz

>1 MHz Offset

-165

dBc/Hz

AD9514

Rev. 0 | Page 6 of 28

Parameter Min

Typ

Max

Unit

Test

Conditions/Comments

CLK = 491.52 MHz, OUT = 245.76 MHz

Divide = 2

@ 10 Hz Offset

-125

dBc/Hz

@ 100 Hz Offset

-132

dBc/Hz

@ 1 kHz Offset

-140

dBc/Hz

@ 10 kHz Offset

-151

dBc/Hz

@ 100 kHz Offset

-157

dBc/Hz

>1 MHz Offset

-158

dBc/Hz

CLK = 245.76 MHz, OUT = 61.44 MHz

Divide = 4

@ 10 Hz Offset

-138

dBc/Hz

@ 100 Hz Offset

-144

dBc/Hz

@ 1 kHz Offset

-154

dBc/Hz

@ 10 kHz Offset

-163

dBc/Hz

@ 100 kHz Offset

-164

dBc/Hz

>1 MHz Offset

-165

dBc/Hz

CLK-TO-LVDS ADDITIVE PHASE NOISE

CLK = 622.08 MHz, OUT= 622.08 MHz

Divide = 1

@ 10 Hz Offset

-100

dBc/Hz

@ 100 Hz Offset

-110

dBc/Hz

@ 1 kHz Offset

-118

dBc/Hz

@ 10 kHz Offset

-129

dBc/Hz

@ 100 kHz Offset

-135

dBc/Hz

@ 1 MHz Offset

-140

dBc/Hz

>10 MHz Offset

-148

dBc/Hz

CLK = 622.08 MHz, OUT = 155.52 MHz

Divide = 4

@ 10 Hz Offset

-112

dBc/Hz

@ 100 Hz Offset

-122

dBc/Hz

@ 1 kHz Offset

-132

dBc/Hz

@ 10 kHz Offset

-142

dBc/Hz

@ 100 kHz Offset

-148

dBc/Hz

@ 1 MHz Offset

-152

dBc/Hz

>10 MHz Offset

-155

dBc/Hz

CLK = 491.52 MHz, OUT = 245.76 MHz

Divide = 2

@ 10 Hz Offset

-108

dBc/Hz

@ 100 Hz Offset

-118

dBc/Hz

@ 1 kHz Offset

-128

dBc/Hz

@ 10 kHz Offset

-138

dBc/Hz

@ 100 kHz Offset

-145

dBc/Hz

@ 1 MHz Offset

-148

dBc/Hz

>10 MHz Offset

-154

dBc/Hz

AD9514

Rev. 0 | Page 7 of 28

Parameter Min

Typ

Max

Unit

Test

Conditions/Comments

CLK = 491.52 MHz, OUT = 122.88 MHz

Divide = 4

@ 10 Hz Offset

-118

dBc/Hz

@ 100 Hz Offset

-129

dBc/Hz

@ 1 kHz Offset

-136

dBc/Hz

@ 10 kHz Offset

-147

dBc/Hz

@ 100 kHz Offset

-153

dBc/Hz

@ 1 MHz Offset

-156

dBc/Hz

>10 MHz Offset

-158

dBc/Hz

CLK = 245.76 MHz, OUT = 245.76 MHz

Divide = 1

@ 10 Hz Offset

-108

dBc/Hz

@ 100 Hz Offset

-118

dBc/Hz

@ 1 kHz Offset

-128

dBc/Hz

@ 10 kHz Offset

-138

dBc/Hz

@ 100 kHz Offset

-145

dBc/Hz

@ 1 MHz Offset

-148

dBc/Hz

>10 MHz Offset

-155

dBc/Hz

CLK = 245.76 MHz, OUT = 122.88 MHz

Divide = 2

@ 10 Hz Offset

-118

dBc/Hz

@ 100 Hz Offset

-127

dBc/Hz

@ 1 kHz Offset

-137

dBc/Hz

@ 10 kHz Offset

-147

dBc/Hz

@ 100 kHz Offset

-154

dBc/Hz

@ 1 MHz Offset

-156

dBc/Hz

>10 MHz Offset

-158

dBc/Hz

CLK-TO-CMOS ADDITIVE PHASE NOISE

CLK = 245.76 MHz, OUT = 245.76 MHz

Divide = 1

@ 10 Hz Offset

-110

dBc/Hz

@ 100 Hz Offset

-121

dBc/Hz

@ 1 kHz Offset

-130

dBc/Hz

@ 10 kHz Offset

-140

dBc/Hz

@ 100 kHz Offset

-145

dBc/Hz

@ 1 MHz Offset

-149

dBc/Hz

>10 MHz Offset

-156

dBc/Hz

CLK = 245.76 MHz, OUT = 61.44 MHz

Divide = 4

@ 10 Hz Offset

-125

dBc/Hz

@ 100 Hz Offset

-132

dBc/Hz

@ 1 kHz Offset

-143

dBc/Hz

@ 10 kHz Offset

-152

dBc/Hz

@ 100 kHz Offset

-158

dBc/Hz

@ 1 MHz Offset

-160

dBc/Hz

>10 MHz Offset

-162

dBc/Hz

AD9514

Rev. 0 | Page 8 of 28

Parameter Min

Typ

Max

Unit

Test

Conditions/Comments

CLK = 78.6432 MHz, OUT = 78.6432 MHz

Divide = 1

@ 10 Hz Offset

-122

dBc/Hz

@ 100 Hz Offset

-132

dBc/Hz

@ 1 kHz Offset

-140

dBc/Hz

@ 10 kHz Offset

-150

dBc/Hz

@ 100 kHz Offset

-155

dBc/Hz

@ 1 MHz Offset

-158

dBc/Hz

>10 MHz Offset

-160

dBc/Hz

CLK = 78.6432 MHz, OUT = 39.3216 MHz

Divide = 2

@ 10 Hz Offset

-128

dBc/Hz

@ 100 Hz Offset

-136

dBc/Hz

@ 1 kHz Offset

-146

dBc/Hz

@ 10 kHz Offset

-155

dBc/Hz

@ 100 kHz Offset

-161

dBc/Hz

>1 MHz Offset

-162

dBc/Hz

CLOCK OUTPUT ADDITIVE TIME JITTER

Table 5.

Parameter Min

Typ

Max

Unit

Test

Conditions/Comments

LVPECL OUTPUT ADDITIVE TIME JITTER

CLK = 622.08 MHz

fs rms

BW = 12 kHz - 20 MHz

LVPECL (OUT0 and OUT1) = 622.08 MHz

OUT2 off

Divide = 1

CLK = 622.08 MHz

fs rms

BW = 12 kHz - 20 MHz

LVPECL (OUT0 and OUT1) = 155.52 MHz

OUT2 off

Divide = 4

CLK = 400 MHz

215

fs rms

Calculated from SNR of ADC method;

LVPECL (OUT0 and OUT1) = 100 MHz

OUT2 off

Divide = 4

CLK = 400 MHz

215

fs rms

Calculated from SNR of ADC method;

LVPECL (OUT0, OUT1) = 100 MHz

Other LVPECL and OUT2 LVDS at same frequency

Divide = 4

CLK = 400 MHz

225

fs rms

Calculated from SNR of ADC method;

LVPECL (OUT0 or OUT1) = 100 MHz

Divide = 4

Other LVPECL = 50 MHz

Interferer

LVDS (OUT2) = 50 MHz

Interferer

CLK = 400 MHz

230

fs rms

Calculated from SNR of ADC method;

LVPECL (OUT0 or OUT1) = 100 MHz

Divide = 4

Other LVPECL = 50 MHz

Interferer

CMOS (OUT2) = 50 MHz

Interferer

LVDS OUTPUT ADDITIVE TIME JITTER

Delay off

CLK = 400 MHz

300

fs rms

Calculated from SNR of ADC method;

LVDS (OUT2) = 100 MHz

OUT0 at same frequency; OUT1 off

Divide = 4

AD9514

Rev. 0 | Page 9 of 28

Parameter Min

Typ

Max

Unit

Test

Conditions/Comments

CLK = 400 MHz

350

fs rms

Calculated from SNR of ADC method

LVDS (OUT2) = 100 MHz

Divide = 4

Both LVPECL = 50 MHz

Interferer(s)

CMOS OUTPUT ADDITIVE TIME JITTER

Delay off

CLK = 400 MHz

290

fs rms

Calculated from SNR of ADC method

CMOS (OUT2) = 100 MHz

OUT0 at same frequency; OUT1 off

Divide = 4

CLK = 400 MHz

315

fs rms

Calculated from SNR of ADC method

CMOS (OUT2) = 100 MHz

Divide = 4

Both LVPECL = 50 MHz

Interferer(s)

DELAY BLOCK ADDITIVE TIME JITTER

100 MHz output; incremental additive jitter

Delay FS = 1.5 ns Fine Adj. 00000

0.71

ps rms

Delay FS = 1.5 ns Fine Adj. 11111

1.2

ps rms

Delay FS = 5 ns Fine Adj. 00000

1.3

ps rms

Delay FS = 5 ns Fine Adj. 11111

2.7

ps rms

Delay FS = 10 ns Fine Adj. 00000

2.0

ps rms

Delay FS = 10 ns Fine Adj. 11111

2.8

ps rms

This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter

should be added to this value using the root sum of the squares (RSS) method.

AD9514

Rev. 0 | Page 10 of 28

SYNCB, VREF, AND SETUP PINS

Table 6.

Parameter

Min

Typ

Max

Unit

Test Conditions/Comments

SYNCB

Logic High

2.7

Logic Low

0.40

Capacitance 2

VREF

Output Voltage

0.62 V

0.76

Minimum - maximum from 0 mA to 1 mA load

S10

Levels

0.1

1/3 0.2

0.45

2/3 0.55

0.8

1 0.9

POWER

Table 7.

Parameter

Min Typ Max

Unit

Test Conditions/Comments

POWER-ON SYNCHRONIZATION

See

Figure 24.

Transit Time from 2.2 V to 3.1 V

POWER DISSIPATION

295

405

550

All outputs on. 2 LVPECL (divide = 2), 1 LVDS (divide = 2). No clock.
Does not include power dissipated in external resistors.

380

490

635

All outputs on. 2 LVPECL (divide = 2), 1 CMOS (divide = 2);
at 62.5 MHz out (5 pF load).

410

525

680

All outputs on. 2 LVPECL, 1 CMOS (divide = 2); At 125 MHz out (5 pF load).

POWER DELTA

Divider (Divide = 2 to Divide = 1)

For each divider. No clock.

LVPECL Output

125

For each output. No clock.

LVDS Output

No clock.

CMOS Output (Static)

No clock.

CMOS Output (@ 62.5 MHz)

110

140

Single-ended. At 62.5 MHz out with 5 pF load.

CMOS Output (@ 125 MHz)

110

150

190

Single-ended. At 125 MHz out with 5 pF load.

Delay Block

Off to 1.5 ns fs, delay word = 60; output clocking at 62.5 MHz.

This is the rise time of the V

supply that is required to ensure that a synchronization of the outputs occurs on power-up. The critical factor is the time it takes the V

transition the range from 2.2 V to 3 .1 V. If the rise time is too slow, the outputs will not be synchronized.

AD9514

Rev. 0 | Page 12 of 28

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter or Pin

With
Respect
to

Min Max

Unit

GND

-0.3

+3.6

RSET GND

-0.3

+ 0.3

CLK GND

-0.3

+ 0.3

CLK

CLKB

-1.2

+1.2

OUT0, OUT1, OUT2

GND

-0.3

+ 0.3

FUNCTION GND

-0.3

+ 0.3

STATUS GND

-0.3

+ 0.3

Junction Temperature

150

°C

Storage Temperature

-65

+150

°C

Lead Temperature (10 sec)

300

°C

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may affect
device reliability.

THERMAL CHARACTERISTICS

Thermal Resistance

32-Lead LFCSP

= 36.6°C/W

See Thermal Characteristics for .

Thermal impedance measurements were taken on a 4-layer board in still air

in accordance with EIA/JESD51-7.

The external pad of this package must be soldered to adequate copper land

on board.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.

AD9514

Rev. 0 | Page 13 of 28

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

CLK

CLKB

SYNCB

VREF

S10

18 OUT2B

19 OUT2

20 VS

21 VS

22 OUT1B

23 OUT1

24 VS

17 VS

1
3

1
4

1
6

1
2

0
B

2
5

TOP VIEW

(Not to Scale)

AD9514

05596-

005

Figure 6. 32-Lead LFCSP Pin Configuration

05596-

006

THE EXPOSED PADDLE

IS AN ELECTRICAL AND

THERMAL CONNECTION

EXPOSED PAD

(BOTTOM VIEW)

GND

Figure 7. Exposed Paddle

Note that the exposed paddle on this package is an electrical connection as well as a thermal enhancement. For the device to
function properly, the paddle must be soldered to a PCB land that functions as both a heat dissipation path as well as an electrical
ground (analog).

Table 9. Pin Function Descriptions

Pin No.

Mnemonic

Description

1, 4 ,17, 20, 21,
24, 26, 29, 30

Power Supply (3.3 V).

CLK

Clock Input.

CLKB

Complementary Clock Input.

SYNCB

Used to Synchronize Outputs; Do Not Let Float.

6 VREF

Provides

2/3

for Use as One of the Four Logic Levels on S0 to S10.

7 to 16, 25

S10 to S0

Setup Select Pins. These are 4-state logic. The logic levels are V

, GND, 1/3 V

, and 2/3 V

The VREF pin provides 2/3 V

. Each pin is internally biased to 1/3 V

so that a pin requiring

that logic level should be left no connection (NC).

OUT2B

Complementary LVDS/Inverted CMOS Output.

OUT2

LVDS/CMOS Output.

OUT1B

Complementary LVPECL Output.

23 OUT1

LVPECL

Output.

OUT0B

Complementary LVPECL Output.

28 OUT0

LVPECL

Output.

31, Exposed Paddle

GND

Ground. The exposed paddle on the back of the chip is also GND.

RSET

Current Sets Resistor to Ground. Nominal value = 4.12 k.

AD9514

Rev. 0 | Page 14 of 28

TERMINOLOGY

Phase Jitter and Phase Noise
An ideal sine wave can be thought of as having a continuous
and even progression of phase with time from 0 to 360 degrees
for each cycle. Actual signals, however, display a certain amount
of variation from ideal phase progression over time. This
phenomenon is called phase jitter. Although there are many
causes that can contribute to phase jitter, one major component
is due to random noise that is characterized statistically as being
Gaussian (normal) in distribution.

This phase jitter leads to a spreading out of the energy of the
sine wave in the frequency domain, producing a continuous
power spectrum. This power spectrum is usually reported as a
series of values whose units are dBc/Hz at a given offset in
frequency from the sine wave (carrier). The value is a ratio
(expressed in dB) of the power contained within a 1 Hz
bandwidth with respect to the power at the carrier frequency.
For each measurement, the offset from the carrier frequency is
also given.

It is also meaningful to integrate the total power contained
within some interval of offset frequencies (for example, 10 kHz
to 10 MHz). This is called the integrated phase noise over that
frequency offset interval and can be readily related to the time
jitter due to the phase noise within that offset frequency
interval.

Phase noise has a detrimental effect on the performance of
ADCs, DACs, and RF mixers. It lowers the achievable dynamic
range of the converters and mixers, although they are affected
in somewhat different ways.

Time Jitter
Phase noise is a frequency domain phenomenon. In the
time domain, the same effect is exhibited as time jitter. When
observing a sine wave, the time of successive zero crossings is
seen to vary. For a square wave, the time jitter is seen as a
displacement of the edges from their ideal (regular) times of
occurrence. In both cases, the variations in timing from the
ideal are the time jitter. Since these variations are random in
nature, the time jitter is specified in units of seconds root mean
square (rms) or 1 sigma of the Gaussian distribution.

Time jitter that occurs on a sampling clock for a DAC or an
ADC decreases the SNR and dynamic range of the converter.
A sampling clock with the lowest possible jitter provides the
highest performance from a given converter.

Additive Phase Noise
It is the amount of phase noise that is attributable to the device
or subsystem being measured. The phase noise of any external
oscillators or clock sources has been subtracted. This makes it
possible to predict the degree to which the device affects the
total system phase noise when used in conjunction with the
various oscillators and clock sources, each of which contribute
their own phase noise to the total. In many cases, the phase
noise of one element dominates the system phase noise.

Additive Time Jitter

It is the amount of time jitter that is attributable to the device
or subsystem being measured. The time jitter of any external
oscillators or clock sources has been subtracted. This makes it
possible to predict the degree to which the device will affect the
total system time jitter when used in conjunction with the
various oscillators and clock sources, each of which contribute
their own time jitter to the total. In many cases, the time jitter of
the external oscillators and clock sources dominates the system
time jitter.

AD9514

Rev. 0 | Page 16 of 28

VERT 500mV/DIV

HORIZ 200ps/DIV

05596-

095

Figure 11. LVPECL Differential Output @ 1600 MHz

VERT 100mV/DIV

HORIZ 500ps/DIV

05596-

010

Figure 12. LVDS Differential Output @ 800 MHz

VERT 500mV/DIV

HORIZ 1ns/DIV

05596-

011

Figure 13. CMOS Single-Ended Output @ 250 MHz with 10 pF Load

OUTPUT FREQUENCY (MHz)

FFE

NTI

L S

G (V

p-p)

100

1600

1100

600

1.2

1.3

1.4

1.5

1.6

1.7

1.8

05596-012

Figure 14. LVPECL Differential Peak-to-Peak Output Swing vs. Frequency

OUTPUT FREQUENCY (MHz)

FFERENTI

L SWI

(

mV p-

100

900

700

500

300

500

750

700

650

600

550

05596-013

Figure 15. LVDS Differential Peak-to-Peak Output Swing vs. Frequency

OUTPUT FREQUENCY (MHz)

OUT

)

600

500

400

300

200

100

3.5

3.0

2.5

2.0

1.5

1.0

0.5

05596-014

2pF

10pF

20pF

Figure 16. CMOS Single-Ended Output Swing vs. Frequency and Load

AD9514

Rev. 0 | Page 17 of 28

OFFSET (Hz)

(f) (d

Bc/Hz)

10M

100k

10k

100

170

110

130

120

140

150

160

05596-015

Figure 17. Additive Phase Noise--LVPECL Divide = 1, 245.76 MHz

OFFSET (Hz)

(f) (d

Bc/Hz)

10M

100k

10k

100

170

80

90

110

100

120

130

140

150

160

05596-016

Figure 18. Additive Phase Noise--LVDS Divide = 1, 245.76 MHz

OFFSET (Hz)

(f) (d

Bc/Hz)

10M

100k

10k

100

170

100

110

120

130

140

150

160

05596-017

Figure 19. Additive Phase Noise--CMOS Divide = 1, 245.76 MHz

OFFSET (Hz)

(f) (d

Bc/Hz)

10M

100k

10k

100

170

110

130

120

140

150

160

05596-018

Figure 20. Additive Phase Noise--LVPECL Divide = 1, 622.08 MHz

OFFSET (Hz)

(f) (d

Bc/Hz)

10M

100k

10k

100

170

80

90

110

100

120

130

140

150

160

05596-019

Figure 21. Additive Phase Noise--LVDS Divide = 2, 122.88 MHz

OFFSET (Hz)

(f) (d

Bc/Hz)

10M

100k

10k

100

170

100

110

120

130

140

150

160

05596-020

Figure 22. Additive Phase Noise--CMOS Divide = 4, 61.44 MHz

AD9514

Rev. 0 | Page 18 of 28

FUNCTIONAL DESCRIPTION

OVERALL

The AD9514 provides for the distribution of its input clock
on up to three outputs simultaneously. OUT0 and OUT1 are
LVPECL levels. OUT2 can be set to either LVDS or CMOS
levels. Each output has its own divider that can be set for a
divide ratio selected from a list of integer values from 1
(bypassed) to 32.

OUT2 includes an analog delay block that can be set to add an
additional delay of 1.5 ns, 5 ns, or 10 ns full scale, each with
16 levels of fine adjustment.

CLK, CLKB--DIFFERENTIAL CLOCK INPUT

The CLK and CLKB pins are differential clock input pins.
This input works up to 1600 MHz. The jitter performance is
degraded by a slew rate below 1 V/ns. The input level should be
between approximately 150 mV p-p to no more than 2 V p-p.
Anything greater can result in turning on the protection diodes
on the input pins.

See Figure 23 for the CLK equivalent input circuit. This input
is fully differential and self-biased. The signal should be ac-
coupled using capacitors. If a single-ended input must be used,
this can be accommodated by ac coupling to one side of the
differential input only. The other side of the input should be
bypassed to a quiet ac ground by a capacitor.

2.5k

CLKB

CLK

CLOCK INPUT

STAGE

05596-

021

Figure 23 Clock Input Equivalent Circuit

SYNCHRONIZATION

Power-On SYNC

A power-on sync (POS) is issued when the V

power supply is

turned on to ensure that the outputs start in synchronization.
The power-on sync works only if the V

power supply transi-

tions the region from 2.2 V to 3.1 V within 35 ms. The POS can
occur up to 65 ms after V

crosses 2.2 V. Only outputs which are

not divide = 1 are synchronized.

05596-094

CLK

OUT

3.3V

2.2V

3.1V

CLOCK FREQUENCY

IS EXAMPLE ONLY

DIVIDE = 2

PHASE = 0

< 65ms

INTERNAL SYNC NODE

35ms

MAX

Figure 24. Power-On Sync Timing

SYNCB

If the setup configuration of the AD9514 is changed during
operation, the outputs can become unsynchronized. The
outputs can be re-synchronized to each other at any time.
Synchronization occurs when the SYNCB pin is pulled low and
released. The clock outputs (except where divide = 1) are forced
into a fixed state (determined by the divide and phase settings)
and held there in a static condition until the SYNCB pin is
returned to high. Upon release of the SYNCB pin, after four
cycles of the clock signal at CLK, all outputs continue clocking
in synchronicity (except where divide = 1).

When divide = 1 for an output, that output is not affected by
SYNCB.

05596-

093

CLK

SYNCB

OUT

3 CLK CYCLES

4 CLK CYCLES

EXAMPLE: DIVIDE

PHASE = 0

EXAMPLE DIVIDE

RATIO PHASE = 0

Figure 25. SYNCB Timing with Clock Present

05596-

092

4 CLK CYCLES

CLK

OUT

SYNCB

DEPENDS ON PREVIOUS STATE AND DIVIDE RATIO

DEPENDS ON PREVIOUS STATE

EXAMPLE DIVIDE

RATIO PHASE = 0

MIN 5ns

Figure 26. SYNCB Timing with No Clock Present

The outputs of the AD9514 can be synchronized by using the
SYNCB pin. Synchronization aligns the phases of the clock
outputs, respecting any phase offset that has been set on a
particular output's divider.

SYNCB

05596-

022

Figure 27. SYNCB Equivalent Input Circuit

AD9514

Rev. 0 | Page 19 of 28

Synchronization is initiated by pulling the SYNCB pin low for a
minimum of 5 ns. The input clock does not have to be present
at the time the command is issued. The synchronization occurs
after four input clock cycles.

The synchronization applies to clock outputs:

that are not turned OFF

where the divider is not divide = 1 (divider bypassed)

An output with its divider set to divide = 1 (divider bypassed) is
always synchronized with the input clock, with a propagation
delay.

The SYNCB pin must be pulled up for normal operation. Do
not let the SYNCB pin float.

SET

RESISTOR

The internal bias currents of the AD9514 are set by the
R

SET

resistor. This resistor should be as close as possible to

the value given as a condition in the Specifications section
(R

SET

= 4.12 k). This is a standard 1% resistor value and

should be readily obtainable. The bias currents set by this
resistor determine the logic levels and operating conditions
of the internal blocks of the AD9514. The performance figures
given in the Specifications section assume that this resistor
value is used for R

SET

VREF

The VREF pin provides a voltage level of V

. This voltage is

one of the four logic levels used by the setup pins (S0 to S10).
These pins set the operation of the AD9514. The VREF pin
provides sufficient drive capability to drive as many of the setup
pins as necessary, up to all on a single part. The VREF pin
should be used for no other purpose.

SETUP CONFIGURATION

The specific operation of the AD9514 is set by the logic levels
applied to the setup pins (S0 to S10). These pins use four-state
logic. The logic levels used are V

and GND, plus V

and

. The V

level is provided by the internal self-biasing on

each of the setup pins (S0 to S10). This is the level seen by a
setup pin that is left not connected (NC). The V

level is

provided by the VREF pin. All setup pins requiring the V

level must be tied to the VREF pin.

SETUP PIN

S0 TO S10

60k

30k

05596-

023

Figure 28. Setup Pin (S0 to S10) Equivalent Circuit

The AD9514 operation is determined by the combination of
logic levels present at the setup pins. The setup configurations
for the AD9514 are shown in Table 10 to Table 15. The four
logic levels are referred to as 0, , , and 1. These numbers
represent the fraction of the V

voltage that defines the logic

levels. See the setup pins thresholds in Table 6.

The meaning of some of the setup pins depends on the logic
level set on other pins. For example, the effect of the S3 to S4
pair of pins depends on whether S0 = 0. If S0 = 0, the delay
block for OUT2 is off, and the logic levels on S3 to S4 set the
phase word of the OUT2 divider. However, if S0 0, then the
full-scale delay for OUT2 is set by the logic level on S0, and S3
to S4 sets the delay block fine adjust (fraction of full scale).

S1 and S2 together determine the logic level of each output or
whether a channel is off. An output that is set to OFF is
powered down, including the divider.

OUT0 and OUT1 are LVPECL. The LVPECL output differential
voltage (V

) can have three possible levels: 410 mV, 790 mV,

and 960 mV (limited to the available combinations, see Table 11).
OUT2 can be set to either LVDS or CMOS levels.

S5 and S6 effect depends on S2. If S2 = 0 (OUT2 is off), S5 and
S6 set the OUT1 phase word. If S2 0, S5 and S6 set the OUT2
divide ratio. If S2 = , then the value in S9 and S10 overrides
the divide ratio for OUT2.

S7 and S8 depend on S2 and S0. If S2 1, these pins set the
OUT1 divide ratio. However, if S2 = 1 (OUT1 is off) and S0 0,
S7 and S8 set the phase word for OUT2.

S9 and S10 depend on S2. If S2 , these pins set the OUT0
divide ratio. If S2 = , they set the OUT2 divide ratio,
overriding S5 and S6.

AD9514

Rev. 0 | Page 20 of 28

Table 10. S0--OUT2 Delay

Delay Full Scale

0 Off

(Bypassed)

1/3 1.5

2/3 5

1 10

Table 11. S1, S2--Output Select

S1 S2

OUT0
LVPECL

OUT1
LVPECL

OUT2
LVDS/CMOS

0 0 OFF

410

mV OFF

1/3

790 mV

OFF

2/3

410 mV

OFF

1 0 960

mV 960

mV OFF

1/3

790 mV

CMOS

1/3 1/3 410

mV 410

mV LVDS

2/3 1/3 410

mV 410

mV CMOS

1/3

790 mV

LVDS

2/3

OFF OFF OFF

1/3 2/3 OFF

OFF

LVDS

2/3 2/3 OFF

OFF

CMOS

1 2/3

OFF

790

mV OFF

0 1 410

mV OFF

CMOS

1/3 1 790

mV OFF

LVDS

2/3 1 410

mV OFF

LVDS

1 1 790

mV OFF

CMOS

Table 12. S3, S4--OUT2 Delay Fine Adjust or Phase

S0 0

S0 = 0

S3 S4

OUT2 Delay Fine Adjust
(Fraction of FS)

OUT2 Phase

0 0 0

1/3 0 1/16

2/3 0 1/8

1 0 3/16

0 1/3

1/4

1/3 1/3 5/16

2/3 1/3 3/8

1 1/3

7/16

0 2/3

1/2

1/3 2/3 9/16

2/3 2/3 5/8

1 2/3

11/16

0 1 3/4

1/3 1 13/16

2/3 1 7/8

1 1 15/16

AD9514

Rev. 0 | Page 21 of 28

Table 13. S5, S6--OUT2 Divide or OUT1 Phase

S2 0

S2 = 0

S5 S6

OUT2
Divide (Duty Cycle

)

OUT1
Phase

0 0 1

1/3 0 2

(50%)

2/3 0 3

(33%)

1 0 4

(50%)

0 1/3

(40%)

1/3 1/3 6

(50%)

2/3 1/3 8

(50%)

1 1/3

(44%)

0 2/3

(50%)

1/3 2/3 12

(50%)

2/3 2/3 15

(47%)

1 2/3

(50%)

0 1 18

(50%)

1/3 1 24

(50%)

2/3 1 30

(50%)

1 1 32

(50%)

Duty cycle is the clock signal high time divided by the total period.

Table 14. S7, S8--OUT1 Divide or OUT2 Phase

S2 1

S2 = 1 and S0 0

S7 S8

OUT1
Divide (Duty Cycle

)

OUT2
Phase

0 0 1

1/3 0 2

(50%)

2/3 0 3

(33%)

1 0 4

(50%)

0 1/3

(40%)

1/3 1/3 6

(50%)

2/3 1/3 8

(50%)

1 1/3

(44%)

0 2/3

(50%)

1/3 2/3 12

(50%)

2/3 2/3 15

(47%)

1 2/3

(50%)

0 1 18

(50%)

1/3 1 24

(50%)

2/3 1 30

(50%)

1 1 32

(50%)

Duty cycle is the clock signal high time divided by the total period.

Table 15. S9, S10--OUT0 Divide or OUT2 Divide

S2 2/3

S2 = 2/3

S9 S10

OUT0
Divide (Duty Cycle

)

OUT2
Divide (Duty Cycle

)

7 (43%)

1/3

2 (50%)

11 (45%)

2/3

3 (33%)

13 (46%)

4 (50%)

14 (50%)

1/3

5 (40%)

17 (47%)

1/3

6 (50%)

19 (47%)

2/3

1/3

8 (50%)

20 (50%)

1/3

9 (44%)

21 (48%)

2/3

10 (50%)

22 (50%)

1/3

2/3

12 (50%)

23 (48%)

2/3

15 (47%)

25 (48%)

2/3

16 (50%)

26 (50%)

18 (50%)

27 (48%)

1/3

24 (50%)

28 (50%)

2/3

30 (50%)

29 (48%)

32 (50%)

31 (48%)

Duty cycle is the clock signal high time divided by the total period.

AD9514

Rev. 0 | Page 22 of 28

DIVIDER PHASE OFFSET

The phase of OUT1 or OUT2 can be selected, depending on the
divide ratio and output configuration chosen. This allows, for
example, the relative phase of OUT0 and OUT1 to be set.

After a SYNC operation (see the Synchronization section), the
phase offset word of each divider determines the number of
input clock (CLK) cycles to wait before initiating a clock output
edge. By giving each divider a different phase offset, output-to-
output delays can be set in increments of the fast clock period, t

CLK

Figure 29 shows four cases, each with the divider set to divide = 4.
By incrementing the phase offset from 0 to 3, the output is
offset from the initial edge by a multiple of t

CLK

11 12 13

CLK

CLOCK INPUT

CLK

DIVIDER OUTPUT

DIV = 4

PHASE = 0

PHASE = 1

PHASE = 2

PHASE = 3

CLK

2 × t

CLK

3 × t

CLK

05596-024

Figure 29. Phase Offset--Divider Set for Divide = 4, Phase Set from 0 to 2

For example:

CLK = 491.52 MHz

CLK

= 1/491.52 = 2.0345 ns

For Divide = 4:

Phase Offset 0 = 0 ns

Phase Offset 1 = 2.0345 ns

Phase Offset 2 = 4.069 ns

Phase Offset 3 = 6.104 ns

The outputs can also be described as:

Phase Offset 0 = 0°

Phase Offset 1 = 90°

Phase Offset 2 = 180°

Phase Offset 3 = 270°

Setting the phase offset to Phase = 4 results in the same relative
phase as Phase = 0° or 360°.

The resolution of the phase offset is set by the fast clock period
(t

CLK

) at CLK. The maximum unique phase offset is less than the

divide ratio, up to a phase offset of 15.

Phase offsets can be related to degrees by calculating the phase
step for a particular divide ratio:

Phase Step = 360°/Divide Ratio

Using some of the same examples:

Divide = 4

Phase Step = 360°/4 = 90°

Unique Phase Offsets in Degrees Are Phase = 0°, 90°,

180°, 270°

Divide = 9

Phase Step = 360°/9 = 40°

Unique Phase Offsets in Degrees Are Phase = 0°, 40°, 80°,

120°, 160°, 200°, 240°, 280°, 320°

DELAY BLOCK

OUT2 includes an analog delay element that gives variable time
delays (T) in the clock signal passing through that output.

SELECT

LVDS

CMOS

MUX

OUTPUT

DRIVER

FINE DELAY ADJUST

(16 STEPS)

FULL SCALE : 1.5ns, 5ns, 10ns

CLOCK INPUT

OUT2 ONLY

05596-

025

Figure 30. Analog Delay Block

The amount of delay that can be used is determined by the
output frequency. The amount of delay is limited to less than
one-half cycle of the clock period. For example, for a 10 MHz
clock, the delay can extend to the full 10 ns maximum.
However, for a 100 MHz clock, the maximum delay is less than
5 ns (or half of the period).

The AD9514 allows for the selection of three full-scale delays,
1.5 ns, 5 ns, and 10 ns, set by delay full scale (see Table 10). Each
of these full-scale delays can be scaled by 16 fine adjustment
values, which are set by the delay word (see Table 12).

The delay block adds some jitter to the output. This means that
the delay function should be used primarily for clocking digital
chips, such as FPGA, ASIC, DUC, and DDC, rather than for
supplying a sample clock for data converters. The jitter is higher
for longer full scales because the delay block uses a ramp and
trip points to create the variable delay. A longer ramp means
more noise has a chance of being introduced.

AD9514

Rev. 0 | Page 23 of 28

When the delay block is OFF (bypassed), it is also powered
down.

OUTPUTS

The AD9514 offers three different output level choices:
LVPECL, LVDS, and CMOS. OUT0/OUT0B and OUT1/
OUT1B are LVPECL differential outputs. There are three
amounts of LVPECL differential voltage swing (V

) that can be

selected (410 mV, 790 mV, and 960 mV) within the choices
available in Table 11.

OUT2/OUT2B can be selected as either an LVDS differential
output or a pair of CMOS single-ended outputs. If selected as
CMOS, OUT2 is a noninverted, single-ended output, and
OUT2B is an inverted, single-ended output.

GND

3.3V

OUTB

OUT

05596-

026

Figure 31. LVPECL Output Simplified Equivalent Circuit

OUTB

OUT

3.5mA

05596-

027

Figure 32. LVDS Output Simplified Equivalent Circuit

05596-

028

OUT2/
OUT2B

Figure 33. CMOS Equivalent Output Circuit

POWER SUPPLY

The AD9514 requires a 3.3 V ± 5% power supply for V

. The

tables in the Specifications section give the performance
expected from the AD9514 with the power supply voltage
within this range. In no case should the absolute maximum
range of -0.3 V to +3.6 V, with respect to GND, be exceeded
on Pin VS.

Good engineering practice should be followed in the layout of
power supply traces and the ground plane of the PCB. The
power supply should be bypassed on the PCB with adequate
capacitance (>10 F). The AD9514 should be bypassed with
adequate capacitors (0.1 F) at all power pins as close as
possible to the part. The layout of the AD9514 evaluation board
(AD9514/PCB) is a good example.

AD9514

Rev. 0 | Page 24 of 28

Exposed Metal Paddle

The exposed metal paddle on the AD9514 package is an
electrical connection, as well as a thermal enhancement. For the
device to function properly, the paddle must be properly
attached to ground (GND).

The exposed paddle of the AD9514 package must be soldered
down.

The AD9514 must dissipate heat through its exposed

paddle. The PCB acts as a heat sink for the AD9514. The PCB
attachment must provide a good thermal path to a larger heat
dissipation area, such as a ground plane on the PCB. This
requires a grid of vias from the top layer down to the ground
plane (see Figure 34). The AD9514 evaluation board
(AD9514/PCB) provides a good example of how the part
should be attached to the PCB.

05596-

035

VIAS TO GND PLANE

Figure 34. PCB Land for Attaching Exposed Paddle

POWER MANAGEMENT

In some cases the AD9514 can be configured to use less power
by turning off functions that are not being used.

The power-saving options include the following:

Any divider is powered down when set to divide = 1
(bypassed).

Adjustable delay block on OUT2 is powered down when in
off mode (S0 = 0).

In some cases, an unneeded output can be powered down
(see Table 11). This also powers down the divider for that
output.

AD9514

Rev. 0 | Page 25 of 28

APPLICATIONS

USING THE AD9514 OUTPUTS FOR ADC CLOCK
APPLICATIONS

Any high speed, analog-to-digital converter (ADC) is extremely
sensitive to the quality of the sampling clock provided by the
user. An ADC can be thought of as a sampling mixer, and any
noise, distortion, or timing jitter on the clock is combined with
the desired signal at the A/D output. Clock integrity require-
ments scale with the analog input frequency and resolution,
with higher analog input frequency applications at 14-bit
resolution being the most stringent. The theoretical SNR of an
ADC is limited by the ADC resolution and the jitter on the
sampling clock. Considering an ideal ADC of infinite resolution
where the step size and quantization error can be ignored, the
available SNR can be expressed approximately by

SNR

log

where f

is the highest analog frequency being digitized.

is the rms jitter on the sampling clock.

Figure 35 shows the required sampling clock jitter as a function
of the analog frequency and effective number of bits (ENOB).

FULL-SCALE SINE WAVE ANALOG FREQUENCY (MHz)

NR (dB)

100

110

05596-091

= 100

200

400

1ps
2ps

10ps

SNR = 20log

Figure 35. ENOB and SNR vs. Analog Input Frequency

See Application Notes AN-756 and AN-501 at

www.analog.com

Many high performance ADCs feature differential clock inputs
to simplify the task of providing the required low jitter clock on
a noisy PCB. (Distributing a single-ended clock on a noisy PCB
can result in coupled noise on the sample clock. Differential
distribution has inherent common-mode rejection that can
provide superior clock performance in a noisy environment.)
The AD9514 features both LVPECL and LVDS outputs that
provide differential clock outputs, which enable clock solutions
that maximize converter SNR performance. The input
requirements of the ADC (differential or single-ended, logic
level, termination) should be considered when selecting the best
clocking/converter solution.

LVPECL CLOCK DISTRIBUTION

The low voltage, positive emitter-coupled, logic (LVPECL)
outputs of the AD9514 provide the lowest jitter clock signals
available from the AD9514. The LVPECL outputs (because they
are open emitter) require a dc termination to bias the output
transistors. The simplified equivalent circuit in Figure 31 shows
the LVPECL output stage.

In most applications, a standard LVPECL far-end termination is
recommended, as shown in Figure 36. The resistor network is
designed to match the transmission line impedance (50 ) and
the switching threshold (V

- 1.3 V).

LVPECL

SINGLE-ENDED

(NOT COUPLED)

LVPECL

127

= V

 1.3V

05596-

030

Figure 36. LVPECL Far-End Termination

LVPECL

100

DIFFERENTIAL

(COUPLED)

LVPECL

100

0.1nF

200

05596-

031

Figure 37. LVPECL with Parallel Transmission Line

AD9514

Rev. 0 | Page 26 of 28

LVDS CLOCK DISTRIBUTION

Termination at the far end of the PCB trace is a second option.
The CMOS outputs of the AD9514 do not supply enough
current to provide a full voltage swing with a low impedance
resistive, far-end termination, as shown in Figure 40. The
far-end termination network should match the PCB trace
impedance and provide the desired switching point. The
reduced signal swing may still meet receiver input requirements
in some applications. This can be useful when driving long
trace lengths on less critical nets.

The AD9514 provides one clock output (OUT2) that is
selectable as either CMOS or LVDS levels. Low voltage
differential signaling (LVDS) is a differential output option for
OUT2. LVDS uses a current mode output stage. The current is
3.5 mA, which yields 350 mV output swing across a 100
resistor. The LVDS output meets or exceeds all ANSI/TIA/EIA-
644 specifications.

A recommended termination circuit for the LVDS outputs is
shown in Figure 38.

OUT2/OUT2B

SELECTED AS CMOS

CMOS

3pF

100

05596-

034

LVDS

100

DIFFERENTIAL (COUPLED)

LVDS

100

05596-

032

Figure 40. CMOS Output with Far-End Termination

Because of the limitations of single-ended CMOS clocking,
consider using differential outputs when driving high speed
signals over long traces. The AD9514 offers both LVPECL and
LVDS outputs that are better suited for driving long traces
where the inherent noise immunity of differential signaling
provides superior performance for clocking converters.

Figure 38. LVDS Output Termination

See Application Note AN-586 at

www.analog.com

for more

information on LVDS.

CMOS CLOCK DISTRIBUTION

SETUP PINS (S0 TO S10)

The AD9514 provides one output (OUT2) that is selectable as
either CMOS or LVDS levels. When selected as CMOS, this
output provides for driving devices requiring CMOS level logic
at their clock inputs.

The setup pins that require a logic level of V

(internal self-

bias) should be tied together and bypassed to ground via a
capacitor.

Whenever single-ended CMOS clocking is used, some of the
following general guidelines should be used.

The setup pins that require a logic level of V

should be tied

together, along with the VREF pin, and bypassed to ground via
a capacitor.

Point-to-point nets should be designed such that a driver has
only one receiver on the net, if possible. This allows for simple
termination schemes and minimizes ringing due to possible
mismatched impedances on the net. Series termination at the
source is generally required to provide transmission line
matching and/or to reduce current transients at the driver. The
value of the resistor is dependent on the board design and
timing requirements (typically 10 to 100 is used). CMOS
outputs are also limited in terms of the capacitive load or trace
length that they can drive. Typically, trace lengths less than
3 inches are recommended to preserve signal rise/fall times and
preserve signal integrity.

POWER AND GROUNDING CONSIDERATIONS AND
POWER SUPPLY REJECTION

Many applications seek high speed and performance under less
than ideal operating conditions. In these application circuits,
the implementation and construction of the PCB is as important
as the circuit design. Proper RF techniques must be used for
device selection, placement, and routing, as well as power
supply bypassing and grounding to ensure optimum
performance.

MICROSTRIP

GND

5pF

60.4

1.0 INCH

CMOS

05596-

033

Figure 39. Series Termination of CMOS Output

AD9514

Rev. 0 | Page 27 of 28

PHASE NOISE AND JITTER MEASUREMENT SETUPS

AD9514

CLK1

OUT1

OUT1B

BALUN

TERM

AMP

+28dB

ZFL1000VH2

ATTENUATOR

12dB

EVALUATION BOARD

AD9514

CLK1

OUT1

OUT1B

BALUN

TERM

AMP

+28dB

ZFL1000VH2

ATTENUATOR

7dB

SIG IN

REF IN

EVALUATION BOARD

WENZEL

OSCILLATOR

SPLITTER

ZESC-2-11

VARIABLE DELAY

COLBY PDL30A

0.01ns STEP

TO 10ns

AGILENT E5500B

PHASE NOI

SE MEASUREMENT SYSTEM

05596-041

Figure 41. Additive Phase Noise Measurement Configuration

AD9514

CLK1

OUT1

OUT1B

BALUN

TERM

CLK

ANALOG

SOURCE

TERM

EVALUATION BOARD

WENZEL

OSCILLATOR

WENZEL

OSCILLATOR

DATA CAPTURE CARD

FIFO

FFT

ADC

SNR

J_RMS

05596-

042

Figure 42. Jitter Determination by Measuring SNR of ADC

(

)

(

)

[

]

A_PK

DNL

THERMAL

QUANTIZATI

SNR

A_RMS

J_RMS

SND

where:

j_RMS

is the rms time jitter.

SNR

is the signal-to-noise ratio.

SND

is the source noise density in nV/Hz.

is the SND filter bandwidth.

is the analog source voltage.

is the analog frequency.

The terms are the quantization, thermal, and DNL errors.

AD9514

Rev. 0 | Page 28 of 28

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

0.30
0.23
0.18

0.20 REF

0.80 MAX
0.65 TYP

0.05 MAX
0.02 NOM

12° MAX

1.00
0.85
0.80

SEATING

PLANE

COPLANARITY

0.08

0.50
0.40
0.30

3.50 REF

0.50

BSC

PIN 1

INDICATOR

TOP

VIEW

5.00

BSC SQ

4.75

BSC SQ

3.25
3.10 SQ
2.95

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOTTOM VIEW)

Figure 43. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad (CP-32-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD9514BCPZ

-40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD9514BCPZ-REEL7

-40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)

CP-32-2

AD9514/PCB

Evaluation

Board

Z = Pb-free part.

D0559607/05(0)

Part Number AD9514

Document Outline